8052P GENNUM | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Transient Protection to Œ IEC 61000-4-2 (ESD) 30kV (Air), 25kV (Contact) Œ IEC 61000-4-4 (EFT) 4kV (5/50ns) Œ IEC 61000-4-5 (Lightning) 6A (8/20µs) Œ ISO-10605 (ESD) 30kV (Air), 25kV (Contact)
  • Qualified to AEC-Q100, Grade 1
  • Package design optimized for high speed lines
  • ESD protection and common mode filtering for two high-speed lines
  • High differential bandwidth cutoff frequency
  • Low ESD Clamping Voltage
  • Dynamic Resistance: 0.50 Ohms (Typ)
  • Solid-State Silicon-Avalanche Technology Mechanical Characteristics
  • SGP1917N5 package
  • Pb-Free, Halogen Free, RoHS/WEEE Compliant
  • Nominal Dimensions: 1.9 x 1.70 x 0.55 mm
  • Molding Compound Flammability Rating: UL 94V-0
  • Marking : Marking Code + Date Code
  • Packaging : Tape and Reel

Applications

  • Automotive Applications
  • Industrial Equipment
  • USB 2.0 / USB 3.0
  • HDMI / MHL
  • MIPI Camera Serial Interface (CSI)
  • MIPI Display Serial Interface (DSI) Circuit Diagram Pin Configuration EMIClamp® 2-Line Common Mode Filter and Low Capacitance ESD Protection

Description

EClamp®8052P integrates common mode filtering with low capacitance ESD protection and is designed specifically for MIPI, MHL, and USB interfaces. Each device provides filtering and ESD protection for one high-speed differential pair. EClamp8052P is an easily implemented solution for replacing discrete common mode chokes and ESD protection devices in a single package. These devices utilize silicon avalanche technology for superior ESD and TLP clamping performance. They feature high maximum ESD withstand voltage of +/- 25kV contact, +/-30kV air discharge per IEC 61000-4-2. The integrated common-mode choke has a typical differential mode cutoff frequency >3GHZ and typical common mode suppression of 10dB at 500MHz and 15dB from 1GHz to 2.8GHz. Each channel series resistance is 1.8 Ohms maximum. EClamp8052P is in a 7-pin SGP1917N5 package, measuring 1.9 x 1.7mm with a nominal height of 0.55mm. The leads have a nominal pin-to-pin pitch of 0.50mm. Flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. GND I/O+ In I/O- In I/O+ Out I/O- Out External Side Towards Connector I/O+ In 1 I/O- In I/O+ Out I/O- Out GND Internal Side Towards IC

Final Datasheet Rev 4.0 May 7, 2015 www.semtech.com Page 2 Semtech Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage VRWM -40OC to 125OC Pin 1 or Pin 2 to Pin 3 5 V Reverse Breakdown Voltage VBR It = 1mA, Pin 1 or 2 to Pin 3 -40OC to 125OC 6.5 9 11 V Reverse Leakage Current IR VRWM = 5V T = 25OC 0.005 0.100 μA Clamping Voltage VC IPP = 1A, tp = 8/20µs, Pin 1 or 2 to Pin 3 12 V Clamping Voltage VC IPP = 6A, tp = 8/20µs, Pin 1 or 2 to Pin 3 17 V ESD Clamping Voltage(3) VC IPP = 4A, tp = 0.2/100ns (TLP) Pin 1 or 2 to Pin 3 11 V ESD Clamping Voltage(3) VC IPP = 16A, tp = 0.2/100ns (TLP) Pin 1 or 2 to Pin 3 17 V Dynamic Resistance(3), (4) RDYN tp = 0.2/100ns (TLP) Pin 1 or 2 to Pin 3 0.50 Ohms Total Channel Capacitance CIN VR = 0V, f = 1MHz Pin 1 or 2 to Pin 3 T = 25OC 0.95 1.2 pF Differential (SDD21) Cut-Off Frequency f3dB 50 Ohm Source and Load Termination 3 GHz Common Mode (SCC21) Attenuation fATT f = 75MHz 3 dB f = 500MHz 10 dB f = 1GHZ - 2.5GHz 20 dB Channel Resistance RCH Input to Output 1.3 1.8 Ohms Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): ESD Gun return path to Horizontal Coupling Plane (HCP); Test conditions: a)150pF/330pF, 330W b) 150pF/330pF, 2kW (3): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. (4): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A Absolute Maximum Ratings Electrical Characteristics (T=25OC unless otherwise specified) Rating Symbol Value Units Peak Pulse Current (tp = 8/20µs) IPP 6 A ESD per IEC 61000-4-2 (Contact)(1) ESD per IEC 61000-4-2 (Air)(1) VESD ±25 ±30 kV ESD per ISO-10605 (Contact)(2) ESD per ISO-10605 (Air)(2) VESD ±25 ±30 kV Operating Temperature TJ -40 to +125 OC Storage Temperature TSTG -55 to +150 OC

Final Datasheet Rev 4.0 May 7, 2015 www.semtech.com Page 3 Semtech Typical Characteristics Differential Mode Attenuation vs. Frequency Common Mode Attenuation vs. Frequency Junction Capacitance vs. Reverse Voltage Channel DC Resistance vs. Temperature 0.92 0.93 0.94 0.95 0.96 0.97 0.98 0.99 0123456 Capacitance ‐CJ (pF) Reverse Voltage ‐VR (V) EC8052P_AR_CJvV f = 1Mhz Any Pin to GND TA = 25OC 0.0 0.5 1.0 1.5 2.0 ‐50 0 50 100 150 Channel DC Resistance ‐RCH (Ω) Temperature (OC) Pin1 to 5 or 2 to 4 EC8052P_AR_RCH 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 ‐50 ‐25 0 25 50 75 100 125 150 Capacitance ‐CJ (pF) Temperature (°C) VR = 0V VR = 5V EC8052P_AR_CJvT f = 1Mhz Any Pin to GND Normalized to 25OC 8.45 8.50 8.55 8.60 8.65 8.70 ‐50 ‐25 0 25 50 75 100 125 150 Breakdown Voltage ‐VBR (V) Temperature (OC) Any Pin to GND IBR = 1mA EC8052P_AR_VBR -10 0.01 0.1 1 10 Insertion Loss (dB) Frequency (GHz) -50 -45 -40 -35 -30 -25 -20 -15 -10 0.01 0.1 1 Insertion Loss (dB) Frequency (GHz) Junction Capacitance vs. Temperature Breakdown Voltage (VBR) vs. Temperature

Final Datasheet Rev 4.0 May 7, 2015 www.semtech.com Page 4 Semtech Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) TLP Characteristic (Positive) Clamping Voltage vs. Peak Pulse Current (tp=8/20us) 0 5 10 15 20 25 30 IDUT (A) VDUT (V) EC8052P_AR_TLPP TA = 25OC TP = 100ns TR = 0.2ns 0.7TP < TSAMPLE < 0.9TP 01234567 Clamping Voltage ‐VC (V) Peak Pulse Current ‐IPP (A) I/O IN (Input Side) TA = 25OC tr = 8µs td = 20µs Surge applied and measured on same pin EC8052P_AR_8_20 ‐30 ‐25 ‐20 ‐15 ‐10 IDUT (A) VDUT (V) EC8052P_AR_TLPN TA = 25OC TP = 100ns TR = 0.2ns 0.7TP < TSAMPLE < 0.9TP 25 40 55 70 85 100 115 130 145 Leakage Current ‐IL (nA) Temperature (OC) VR = 5V Any Pin to GND EC8052P_AR_IR ‐10 110 130 150 ‐10 0 10 20 30 40 50 60 70 80 Clamping Voltage ‐VC (V) Time (ns) EC8052P_AR_ESDP8 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. Pin1 or 2 to GND,TA = 25OC ‐160 ‐140 ‐120 ‐100 ‐80 ‐60 ‐40 ‐20 ‐10 0 10 20 30 40 50 60 70 80 Clamping Voltage ‐VC (V) Time (ns) EC8052P_AR_ESDN8 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. Pin1 or 2 to GND,TA = 25OC TLP Characteristic (Negative) Reverse Leakage vs. Temperature

Final Datasheet Rev 4.0 May 7, 2015 www.semtech.com Page 5 Semtech

Application Information

Figure 1 - USB 3.0 Type-A Protection Example USB 3.0 - Type A Host Connector EClamp8052P uClamp0571P RClamp3324T VBus SSTX+ SSTX- SSRX+ SSRX- GND GND R R USB 3.0 Transceiver width. Both ground pads should be connected for op- timal performance. Ground connection is made using filled via-in-pad. Additional information may be found on the device data sheet. Single line devices such as uClamp0571P are recom- mended for surge and ESD protection of the VBus line. This device features high surge and ESD capability and may be used on 5V power rails. Device Placement Placement of the protection component is a critical ele- ment for effective ESD suppression. TVS diodes should be placed as close to the connector as possible. This helps reduce transient coupling to nearby traces. Ground connections should be made directly to the ground plane using micro-vias. This reduces parasitic inductance in the ground path and minimizes the clamp- ing voltage seen by the protected device. USB Interface Protection EClamp8052P may be used to protect D+ and D- lines against ESD and EMI in USB 2.0, USB 3.0, and USB 3.1 applications. USB D+ and D- lines enter at pins 1 and 2 (connector side) and exit at pins 4 and 5. The TVS diodes are internally connected at pins 1 and 2 and therfore must be located towards the connector on the PCB. Pin 3 is connected to the ground plane. Figures 1 is an exam- ple of protecting a USB 3.0 Type-A interface (host side shown). For USB 3.0 applications, RClamp3324T is recommended for protecting the 5Gb/s SuperSpeed line pairs. Lines are routed through the device at pins 1-4. Traces should be kept the same length to avoid impedance mismatch. Ground is connected at pins 5 and 6. The differential impedance of each pair can be controlled for USB 3.0 (85 Ohms +/-15%) while maintaining a minimum trace-to- trace and trace-to-pad spacing. Individual PCB design constraints may necessitate different spacing or trace

Final Datasheet Rev 4.0 May 7, 2015 www.semtech.com Page 7 Semtech Outline Drawing - SGP1917N5 Land Pattern - SGP1917N5 b bbb aaa N L D DIM A 0.250.15 0.20 0.450.35 0.08 0.10 0.40 1.90 MILLIMETERS MAX 0.60 DIMENSIONS MIN NOM 0.50 See Note 2 0.55 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: 1.70E 1.951.85 1.65 1.75 e 0.50 BSC A B aaa C C SEATING PLANE bbb CAB (0.025-0.075) PIN 1 INDICATOR (LASER MARK) D E A A1 BOTTOM SOLDER MASK ( 0.020+/-0.007 ) 2. SOLDER PAD ( 0.018+/-0.005) 1 2 N e LxN D/2 E/2 bxN P THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).1. DIM X Y P G C MILLIMETERS (1.50) 0.25 0.75 0.50 0.75 DIMENSIONS 2.25ZY Z X (C) G

Final Datasheet Rev 4.0 May 7, 2015 www.semtech.com Page 8 Semtech Marking Code (LASER MARK) INDICATOR PIN 1 82P YW Tape and Reel Specification - Plastic Tape, 4mm Pitch

Ordering Information

Part Number Qty per Reel Reel Size Carrier Tape Pitch EClamp8052P.TCT 3000 7 Inch Plastic 4mm EMIClamp and EClamp are trademarks of Semtech Corporation. Pin1 Location ( towards sprocket holes ) P YW P YW YW = Alphanumeric character Date Code

Final Datasheet Rev 4.0 May 7, 2015 Page 9 Semtech Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESUL T IN PERSONAL INJURY , LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015