26C32-SMD | DigiCamel IC Datasheet

Online Datasheet

Read 26C32-SMD online.

26C32-SMD SYC | Alldatasheet

Document overview

Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
PDF pages: 20

Technical content

/C0065/C0077/C0050/C0054/C0067/C0051/C0050 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0076/C0073/C0078/C0069 /C0082/C0069/C0067/C0069/C0073/C0086/C0069/C0082 SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004 /C0068Meets or Exceeds the Requirements of ANSI TIA/EIA-422-B, TIA/EIA-423-B, and ITU Recommendation V.10 and V.11 /C0068Low Power, ICC = 10 mA Typ /C0068±7-V Common-Mode Range With ±200-mV Sensitivity /C0068Input Hysteresis. . . 60 mV Typ /C0068tpd = 17 ns Typ /C0068Operates From a Single 5-V Supply /C00683-State Outputs /C0068Input Fail-Safe Circuitry /C0068Improved Replacements for AM26LS32 /C0068Available in Q-Temp Automotive − High Reliability Automotive Applications − Configuration Control/Print Support − Qualification to Automotive Standards description/ordering information The AM26C32 is a quadruple differential line receiver for balanced or unbalanced digital data transmission. The enable function is common to all four receivers and offers a choice of active-high or active-low input. The 3-state outputs permit connection directly to a bus-organized system. Fail-safe design specifies that if the inputs are open, the outputs always are high. The AM26C32 devices are manufactured using a BiCMOS process, which is a combination of bipolar and CMOS transistors. This process provides the high voltage and current of bipolar with the low power of CMOS to reduce the power consumption to about one-fifth that of the standard AM26LS32, while maintaining ac and dc performance. The AM26C32C is characterized for operation from 0°C to 70°C. The AM26C32I is characterized for operation from −40°C to 85°C. The AM26C32Q is characterized for operation from −40°C to 125°C. The AM26C32M is characterized for operation over the full military temperature range of −55°C to 125°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. G GND V CC G AM26C32C ... D , N , O R N S PACKAGE AM26C32I ... D , N , NS, OR PW PACKAGE AM26C32Q ...D PACKAGE AM26C32M ...J O R W PACKAGE (TOP VIEW) 3212 0 1 9 91 0 1 1 1 2 1 3 NC G G NC AM26C32M . . . FK PACKAGE (TOP VIEW)1A NC 3A 4B GND NC CCV NC − No internal connection www.sycelectronica.com.ar

/C0065/C0077/C0050/C0054/C0067/C0051/C0050 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0076/C0073/C0078/C0069 /C0082/C0069/C0067/C0069/C0073/C0086/C0069/C0082 SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004 description/ordering information (continued)

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP (N) Tube of 25 AM26C32CN AM26C32CN 0°C to 70°C SOIC (D) Tube of 40 AM26C32CD AM26C32C0°C to 70°C SOIC (D) Reel of 2500 AM26C32CDR AM26C32C SOP (NS) Reel of 2000 AM26C32CNSR 26C32 PDIP (N) Tube of 25 AM26C32IN AM26C32IN SOIC (D) Tube of 40 AM26C32ID AM26C32I −40°C to 85°C SOIC (D) Reel of 2500 AM26C32IDR AM26C32I −40 C to 85C SOP (NS) Reel of 2000 AM26C32INSR 26C32I TSSOP (PW) Tube of 90 AM26C32IPW 26C32I −40°C to 125°C SOIC (D) Tube of 40 AM26C32QD AM26C32QD CDIP (J) Tube of 25 AM26C32MJ AM26C32MJ −55°C to 125°C CFP (W) Tube of 150 AM26C32MW AM26C32MW−55 C to 125C LCCC (FK) Tube of 55 AM26C32MFK AM26C32MFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each receiver) DIFFERENTIAL ENABLES OUTPUTDIFFERENTIAL INPUT G G OUTPUT Y VID ≥ VIT+ H X H VID ≥ VIT+ X LH VIT− < VID < VIT+ H X ? VIT− < VID < VIT+ X L? VID ≤ VIT− H X L VID ≤ VIT− X LL X L H Z H = high level, L = low level, X = irrelevant Z = high impedance (off), ? = indeterminate www.sycelectronica.com.ar

/C0065/C0077/C0050/C0054/C0067/C0051/C0050 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0076/C0073/C0078/C0069 /C0082/C0069/C0067/C0069/C0073/C0086/C0069/C0082 SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004 logic diagram (positive logic) G G Pin numbers shown are for the D, J, N, NS, PW, and W packages. schematics Input VCC EQUIVALENT OF A OR B INPUT TYPICAL OF ALL OUTPUTS Output VCCVCC 1.7 kΩ NOM GND GND 1.7 kΩ NOM 17 kΩ NOM 288 kΩ NOM VCC (A inputs) or GND (B inputs) Input GND EQUIVALENT OF G OR G INPUT www.sycelectronica.com.ar

/C0065/C0077/C0050/C0054/C0067/C0051/C0050 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0076/C0073/C0078/C0069 /C0082/C0069/C0067/C0069/C0073/C0086/C0069/C0082 SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential output voltage, VOD , are with respect to network GND. Currents into the device are positive and currents out of the device are negative. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V VIC Common-mode input voltage ±7 V IOH High-level output current −6 mA IOL Low-level output current 6 mA AM26C32C 0 70 TA Operating free-air temperature AM26C32I −40 85 °CTA Operating free-air temperature AM26C32Q −40 125 AM26C32M −55 125 www.sycelectronica.com.ar

/C0065/C0077/C0050/C0054/C0067/C0051/C0050 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0076/C0073/C0078/C0069 /C0082/C0069/C0067/C0069/C0073/C0086/C0069/C0082 SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004 electrical characteristics over recommended ranges of VCC , VIC, and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT VIT+ Differential input high-threshold voltageVO = VOH (min), VIC = −7 V to 7 V 0.2 VVIT+ Differential input high-threshold voltageVO = VOH (min), IOH = −440 µA VIC = 0 to 5.5 V 0.1 V VIT− Differential input low-threshold voltage VO = 0.45 V, VIC = −7 V to 7 V −0.2‡ VVIT− Differential input low-threshold voltage VO = 0.45 V, IOL = 8 mA VIC = 0 to 5.5 V −0.1‡ V Vhys Hysteresis voltage (VIT+ − VIT−) 60 mV VIK Enable input clamp voltage VCC = 4.5 V, II = −18 mA −1.5 V VOH High-level output voltage VID = 200 mV, IOH = −6 mA 3.8 V VOL Low-level output voltage VID = −200 mV, IOL = 6 mA 0.2 0.3 V IOZ Off-state (high-impedance state) output currentVO = VCC or GND ±0.5 ±5 µA II Line input current VI = 10 V, Other input at 0 V 1.5 mAII Line input current VI = −10 V, Other input at 0 V −2.5 mA IIH High-level enable current VI = 2.7 V 20 µA IIL Low-level enable current VI = 0.4 V −100 µA ri Input resistance One input to ground 12 17 kΩ ICC Supply current VCC = 5.5 V 10 15 mA † All typical values are at VCC = 5 V, VIC = 0, and TA = 25°C. ‡ The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for common-mode input voltage. switching characteristics over recommended ranges of operation conditions, CL = 50 pF (unless otherwise noted) PARAMETER TEST CONDITIONS AM26C32C AM26C32I AM26C32Q AM26C32M UNITPARAMETER CONDITIONS MIN TYP † MAX MIN TYP † MAX UNIT tPLH Propagation delay time, low- to high-level output See Figure 1 9 17 27 9 17 27 ns tPHL Propagation delay time, high- to low-level outputSee Figure 1 9 17 27 9 17 27 ns tTLH Output transition time, low- to high-level output See Figure 1 4 9 4 10 ns tTHL Output transition time, high- to low-level outputSee Figure 1 4 9 4 9 ns tPZH Output enable time to high level See Figure 2 13 22 13 22 ns tPZL Output enable time to low level See Figure 2 13 22 13 22 ns tPHZ Output disable time from high level See Figure 2 13 22 13 26 ns tPLZ Output disable time from low level See Figure 2 13 22 13 25 ns † All typical values are at VCC = 5 V, TA = 25°C. www.sycelectronica.com.ar

Orderable Device Status (1) Package Type Package Drawing Pins Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) 5962-9164001Q2A ACTIVE LCCC FK 20 TBD POST-PLATE N / A for Pkg Type 5962-9164001QEA ACTIVE CDIP J 16 TBD A42 N / A for Pkg Type 5962-9164001QFA ACTIVE CFP W 16 TBD A42 N / A for Pkg Type AM26C32CD ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI AM26C32CDE4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CDG4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CDR ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CDRE4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CDRG4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CN ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26C32CNE4 ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26C32CNSR ACTIVE SO NS 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CNSRE4 ACTIVE SO NS 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32CNSRG4 ACTIVE SO NS 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32ID ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI AM26C32IDE4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IDG4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

www.ti.com 18-Dec-2010 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) AM26C32IDR ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IDRE4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IDRG4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IN ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26C32INE4 ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type AM26C32INSR ACTIVE SO NS 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32INSRE4 ACTIVE SO NS 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32INSRG4 ACTIVE SO NS 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IPW ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IPWE4 ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IPWG4 ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IPWR ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32IPWRG4 ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26C32MFKB ACTIVE LCCC FK 20 TBD POST-PLATE N / A for Pkg Type AM26C32MJB ACTIVE CDIP J 16 TBD A42 N / A for Pkg Type AM26C32MWB ACTIVE CFP W 16 TBD A42 N / A for Pkg Type AM26C32QD ACTIVE SOIC D 16 TBD CU NIPDAU Level-1-220C-UNLIM AM26C32QDG4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION 30-Jul-2010 Pack Materials-Page 1 www.sycelectronica.com.ar

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AM26C32CDR SOIC D 16 2500 333.2 345.9 28.6 AM26C32CNSR SO NS 16 2000 346.0 346.0 33.0 AM26C32IDR SOIC D 16 2500 333.2 345.9 28.6 AM26C32INSR SO NS 16 2000 346.0 346.0 33.0 AM26C32IPWR TSSOP PW 16 2000 346.0 346.0 29.0 PACKAGE MATERIALS INFORMATION 30-Jul-2010 Pack Materials-Page 2 www.sycelectronica.com.ar

www.sycelectronica.com.ar

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 www.sycelectronica.com.ar

Product Information

26C32-SMD specifications and overview.

Summary

QUADRUPLE DIFFERENTIAL LINE RECEIVER

Description

QUADRUPLE DIFFERENTIAL LINE RECEIVER

Source title 26C32-SMD Datasheet(PDF) - SYC Electronica

Related Parts

More parts from the same family.

Browse manufacturer