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1 www.semtech.com PROTECTION PRODUCTS - RailClamp ®®®®® RClamp0552T Ultra Low Capacitance TVS 2-Line ESD Protection Description Features Dimensions Schematic & PIN Configuration Revision 3/19/2013
Applications
Mechanical Characteristics SLP1006N3T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.40 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code + dot matrix date code Packaging : Tape and Reel 2-Line, Bidirectional RailClamp ® TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. They are designed to replace 0201 size mul- tilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device deg- radation. The RClamp ®0552T has a maximum capacitance of only 0.40pF. This allows it to be used on circuits operating in excess of 5GHz without signal attenuation. The RClamp0552T is in a 3-pin SLP1006N3T package. It measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. The leads are finished with lead-free NiPdAu. Each device will protect two lines operating at 5 volts. It gives the designer the flexibility to replace multiple single line devices in space constrained applications. They may be used to meet the ESD immunity require- ments of IEC 61000-4-2. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. High ESD withstand Voltage: +/-17kV (Contact and Air) per IEC 61000-4-2 Very small PCB area: 0.6mm 2 Protects up to two high-speed data lines Low reverse current: <5nA typical (VR=5V) Working voltage: +/- 5V Low capacitance: <0.4pF (VR=0V) Low dynamic resistance: 0.90 Ohms (Typ) Solid-state silicon-avalanche technology Nominal Dimensions (mm) 1.00 0.40 0.60 0.68 HDMI 1.3 and HDMI 1.4 USB 3.0 MHL eDP LVDS Interfaces eSATA Interfaces
2© 2013 Semtech Corporation www.semtech.com PROTECTION PRODUCTS RClamp0552T Absolute Maximum Rating Electrical Characteristics (T=25 oC) retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR niPO/IynA DNGot egatloVnwodkaerBesreveRV RB It Am1= niPO/IynA DNGot 5.691 1V tnerruCegakaeLesreveRI R V MWR C°52=T,V2= niPO/IynA DNGot 5<0 2A n tnerruCegakaeLesreveRI R V MWR C°52=T,V5= niPO/IynA DNGot 55<0 01A n egatloVgnipmalCV C I PP sμ02/8=pt,A3= niPO/IynA DNGot 02V egatloVgnipmalCDSE 2 VC I PP ,A61= sn001/2.0=plt 5.42V ecnatsiseRcimanyD 3,2 R nyD sn001=pt0 9.0s mhO ecnaticapaCnoitcnuJC j VR zHM1=f,V0= niPO/IynA DNGot 12.04 .0F p gnitaRl obmySe ulaVs tinU )sμ02/8=pt(rewoPesluPkaePP kp 06s ttaW (tnerruCesluPkaePmumixaM) sμ02/8=ptI pp 3s pmA )riA(2-4-00016CEIrepDSE 1 )tcatnoC(2-4-00016CEIrepDSE 1 V DSE 71-/+ 71-/+ Vk erutarepmeTgnitarepOT J 521+ot55-C ° erutarepmeTegarotST GTS 051+ot55-C ° Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: t p = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A 4)Guaranteed by design. Not production tested
3© 2013 Semtech Corporation www.semtech.com PROTECTION PRODUCTS RClamp0552T Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time TLP Characteristic Clamping Voltage vs. Peak Pulse Current (tp=8/20us) ESD Clamping (+8kV Contact per IEC 61000-4-2) Junction Capacitance vs. Reverse Voltage ESD Clamping (-8kV Contact per IEC 61000-4-2) 01234 Peak Pulse Current - I PP (A) Clamping Voltage -VC (V) Waveform Parameters: tr = 8µs td = 20µs 0.00 0.10 0.20 0.30 0.40 0.50 012345 Reverse Voltage - V R(V) Capacitance - Cj(pf) f = 1 MHz 100 120 140 160 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane -160 -140 -120 -100 -80 -60 -40 -20 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane 0 1 02 03 04 05 0 TLP Voltage (V) TLP Current (A) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 100 1000 0.1 1 10 100 1000 Peak Pulse Power - PPP (W) Pulse Duration - tp (µs) DR040412-65 TA = 25OC
4© 2013 Semtech Corporation www.semtech.com PROTECTION PRODUCTS RClamp0552T Typical Characteristics Typical Insertion Loss S21 Analog Crosstalk 1 2 3 4 START. 030 MHz 3STOP 000 .000000MHz CH1 S21 LOG 6 dB / REF 0 dB 1: - .20480 dB
800 MHz
2: - .31660 dB
900 MHz
3: - .68660 dB
1.8 GHz
4: - .70880 dB
2.5 GHz
5: - 1.4302 dB
2.7 GHz
-6 dB -12 dB -18 dB -24 dB -30 dB -36 dB GHz 100 MHz GHz MHz MHz -42 dB -48 dB START. 030 MHz 3 STOP 000 .000000MHz CH1S21 LOG 20dB /REF 0 dB 0 dB -20 dB -40 dB -60 dB -80 dB -100 dB -120 dB -140 dB -160 dB
5© 2013 Semtech Corporation www.semtech.com PROTECTION PRODUCTS RClamp0552T Example Pin ConfigurationDevice Connection Options The RClamp0552T is designed to protect two high- speed data lines operating up to 5 volts. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The diagram at the right shows an example pin configuration with pin 3 connected to ground. However, due to the device symmetry, any pin may be connected to ground with the remaining pins conneted to the protected lines. Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufactur- ing parameters will require some experimentation to get the desired solder application. retemaraPylbmessAn oitadnemmoceR ngiseDlicnetSredloSd ehsilop-ortcelE,tucresaL epahserutrepAr alugnatceR ssenkcihTlicnetSredloS) "400.0(mm001.0 epyTetsaPredloSr ellamsroerehpsezis4epyT eliforPwolfeRredloS0 20-DTS-JCEDEJreP ngiseDdaPredloSBCPd enifedksamredloS-noN hsiniFdaPBCPu AiNROPSO Recommended Mounting Pattern I/O 1 I/O 2 GND Stencil Opening (220x460 mm) Land Pad (200x400 mm) All Dimensions are in mm. Land Pad. Stencil opening Component 1.000 .850
6© 2013 Semtech Corporation www.semtech.com PROTECTION PRODUCTS RClamp0552T Outline Drawing - SLP1006N3T Land Pattern - SLP1006N3T THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DIM X Y G C MILLIMETERS (0.45) 0.20 0.40 0.05 DIMENSIONS 0.85Z P 0.68 P/2 P Y Z(C) G X b bbb aaa N e D DIM A 0.1950.145 0.17 0.08 0.10 1.00
0.68 BSC
0.05 0.43 DIMENSIONS MIN 0.00 NOM 0.37 0.02 (0.13) 0.40 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: 0.60E 1.100.90 0.50 0.70 PIN 1 INDICATOR (LASER MARK) SEATING PLANE L 0.225 0.25 0.275 N e bbb C A B A CA2 aaa C BA bbb C A B b1 0.2250.175 0.20 D E e/2 bxN b1xN LxNE/2 R0.05 D/2
7© 2013 Semtech Corporation www.semtech.com PROTECTION PRODUCTS RClamp0552T Marking Code Ordering Information Carrier Tape Specification rebmuNtraP repytQ leeR leeR eziS TNT.T2550pmalCR0 00,01h cnI7 Notes: Marking will also include line matrix date code Device Orientation in Tape 0A0 B0 K Note: All dimensions in mm unless otherwise specified Ko Ao Bo RailClamp and RClamp are trademarks of Semtech Corporation. Pin 1 Location (Towards Sprocket Holes) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804