ZALM-301-1

ZALM-301-1 CEL | Alldatasheet

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APEX LT SEriES TrANSCEiVEr MODULES

DESCriPTiON

Apex modules provide a cost-effective RF transceiver solution for 2.4GHz ZigBee and IEEE 802.15.4 data links and wireless networks. The ZALM-301-1 Apex LT module is based on Ember TM EM260 ZigBee network processor. Also onboard are a 100mW Power Amplifier and SPI-based microprocessor interface, providing you with the flexibility to choose an external microprocessor based on your application’s needs. The APEX LT provide over 4000 feet of range and is designed to deliver constant RF output power across the 2.1 to 3.6V voltage input, ensuring consistent performance over the entire life of the battery. integrated Transceiver Modules for ZigBee/iEEE 802.15.4 Evaluation Kit available: ZAXM-201-KiT-1 The information in this document is subject to change without notice, please confirm data is current. Document No: 0003-00-07-00-000 (Issue C) Date Published: April 29, 2010 DATA SHEET

• 1 - 100mW output power, software configured
• Designed for EmberZNet networks
• Miniature footprint: 1.00” x 1.275”
• Integrated PCB trace antenna
• Optional MMCX connector for external antenna
• 16 RF channels (Channel 16 operates at reduced power levels)
• Over 4000 feet of range
• Integrated hardware support for Ember InSight Development Environment
• Non-intrusive debug interface (SIF)
• AES 128 bit encryption
• Low power consumption
• Constant RF output power over 2.1– 3.6 V voltage range
• FCC, IC, and CE certified
• RoHS compliant

FEATUrES

• Ember™ EM260 platform
• Integrated IEEE 802.15.4 PHY and MAC
• Dedicated network processor
• SPI or UART interface to application microcontroller
• Handles all ZigBee processing & timing intensive tasks

APPLiCATiONS

Home & Building Automation

• Security
• HVAC control
• Lighting control
• Thermostats industrial Controls
• Food processing controls
• Traffic Management
• Sensor Networks
• Asset Management
• Barcode reader
• Patient Monitoring
• Glucose monitor Automated Meter reading
• In meter applications
• Thermostats
• In-home display units NOT RECOMMENDED FOR NEW DESIGN

ORDERING INFORMATION

Part Number Order Number Description Mins/Mults Status APEX LT ZALM-301 ZALM-301-1 Apex Lite 100mW transceiver module PCB Trace Antenna 160 pcs / 160 pcs Not Recommended For New DesignZALM-301-1-B Apex Lite 100mW transceiver module PCB Trace Antenna Bulk (1 tray) 32 pcs / 32 pcs ZALM-301-1C Apex Lite 100mW transceiver MMCX connector installed 5,120 pcs / 160 pcs ZALM-301-1C-B Apex Lite 100mW transceiver MMCX connector installed Bulk (1 tray) N/A Discontinued NOT RECOMMENDED FOR NEW DESIGN

APEX LT MODULE BLOCK DIAGRAM

24 MHz

(Renesas PA & Renesas Switch) ANT Castellation Edge Connector PWR Reg APEX LT Ember EM260 ZigbeeTM SOC EVALUATiON KiT CEL provides Apex Evaluation Kits to assist users in evaluating Apex and Apex LT modules. The key components of the Apex Evaluation Kit are the interface board and the CEL’s Apex radio module. Apex LT module combines an Ember EM260 (Apex LT) transceiver IC with an NEC high gain Power Amplifier and a high performance NEC RFIC switch. The interface board features a serial communication interface, a power management module, peripherals such as potentiometer and accelerometer, and GPIO headers. The Evaluation Kit also contains four AA batteries and two USB cables. For more detail information regarding Apex Evaluation Kit, refer to the Apex Module Evaluation Kit User Guide document. (http:// www .cel.com/pdf/misc/apexseries_ug.pdf) Kit Contents:

• Evaluation Boards (2)
• ZigBee Modules (2)
• USB Cables (2)
• AA Batteries (4)
• Technical Information CD (1) Order Number Description ZAXM-201-KiT-1* Engineering Evaluation Kit
• To evaluate the ZALM-301-1 module, please utilize the ZAXM-201-KIT-1 Part Number Order Number Description Mins/Mults Status APEX LT ZALM-301 ZALM-301-1 Apex Lite 100mW transceiver module PCB Trace Antenna 160 pcs / 160 pcs Not Recommended For New DesignZALM-301-1-B Apex Lite 100mW transceiver module PCB Trace Antenna Bulk (1 tray) 32 pcs / 32 pcs ZALM-301-1C Apex Lite 100mW transceiver MMCX connector installed 5,120 pcs / 160 pcs ZALM-301-1C-B Apex Lite 100mW transceiver MMCX connector installed Bulk (1 tray) N/A Discontinued NOT RECOMMENDED FOR NEW DESIGN

Pin Signal & Interfaces Processing 15 Agency Certifications 17 Shipment, Storage & Handling 18 References & Revision History 19 TABLE OF CONTENTS NOT RECOMMENDED FOR NEW DESIGN

APEX LT MODULE MiCrOPrOCESSOr APEX LT modules provide a connection to the Ember Serial API over the SPI allowing the application development to be completed on a host microprocessor of your choice. In addition to the SPI signals, two additional signals (nHOST_INT and nWAKE) provide a handshake mechanism. The module provides a slave device with all transactions initiated by the host. Please consult the EM260 datasheet for details on the SPI Protocol including: Physical Interface Configuration

• SPI Transactions
• SPI Protocol Timing Parameters & Waveforms
• Data Formatting
• SPI Commands & Responses
• Handling Resets and Power Cycling
• Transaction Examples ANTENNA APEX and APEX LT modules include an integrated PCB trace antenna. An optional MMCX connector can be specified, enabling connection to a 50-ohm external antenna of the user’s choice. See Ordering Information. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern.To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB. If positioned correctly, the ground plane on the host board under the module can contribute significantly to antenna performance. The position of the module on the host board and overall design of the product enclosure contribute to antenna perfor- mance. Poor design effects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal. Measured radiation patterns of these modules are available from California Eastern Labs and can be used to benchmark design performance. Here are some design guidelines to help ensure antenna performance: Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metallized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction. TOP VIEW TOP VIEW TOP VIEW NOT RECOMMENDED FOR NEW DESIGN

Orientation of EUT Peak Gain was in the Horizontal Position. The receiver antenna was in the Horizontal Position. -30 -25 -20 -15 -10 210 240 270 120 300 150 330 180 0 Horizontal Polarization Gain (dBi) min: -8.9 max: +1.8 avg: -2.7 Vertical Polarization Gain (dBi) min: -26.1 max: -7.3 avg: -14.7 Frequency = 2405 MHz Horizontal Polarization Gain (dBi) min: -15.2 max: +1.4 avg: -3.1 Vertical Polarization Gain (dBi) min: -22.1 max: -8.7 avg: -13.9 Frequency = 2480 MHz Frequency = 2440 MHz Ve rtical Polarization Gain (dBi) min: -24.7 max: -9.6 avg: -14.8 Horizontal Polarization Gain (dBi) min: -8.1 max: +0.4 avg: -3.4 -30 -25 -20 -15 -10 210 240 270 120 300 150 330 180 0 -30 -25 -20 -15 -10 210 240 270 120 300 150 330 180 0 ANTENNA (Continued) NOT RECOMMENDED FOR NEW DESIGN

The Apex LT supports three power modes: Processor ACTIVE, processor IDLE, and DEEP SLEEP. Processor ACTiVE In this mode all operations are running normally. Processor iDLE While in idle mode, code execution halts until any interrupt occurs. All modules of the EM260 including the radio continue to operate normally. The EmberZNet stack automatically invokes idle as appropriate. Deep Sleep To achieve the lowest power consumption, the module can be set in DEEP SLEEP mode. In this mode most of the function- alities of the modules are turned off with the exception of the critical functions such as GPIO pads and RAM that is powered by the high voltage supply (DCC_PADS). The module can be taken out of DEEP SLEEP in 3 ways:

• Configuring the sleep timer to generate an interrupt after some periods of time.
• Issuing external interrupt signal.
• Issuing commands through the SIF interface. In DEEP SLEEP the current consumption of the module will drop to 5.0μA (5.5μA with optional 32.768kHz oscillator en- abled). For more detail information on modes of operation refer to Ember EM260 datasheet available at Ember’s website (www.ember.com) NOT RECOMMENDED FOR NEW DESIGN

POWER AMPLIFIER REGULATOR CONTROL LINE The APEX LT module includes a separate 1.8V regulator for a power amplifier bias that enables consistent module out- put performance over the wide 2.1 – 3.6V voltage range. To prevent excessive sleep currents, this regulator should be disabled when the module is in sleep mode. An external pull up resistor option is provided on each module (R6) that allows the regulator to be constantly enabled. This option increases the sleep current of the module to a point well above the specified values. SPECIFICATIONS — VPA_EN (APEX LT) Parameter Min Typ Max Unit Regulator enable voltage 0.95 V Regulator disable voltage 0.4 V Enable line current (VEN = 0) 0.1 μA Enable line current (VEN = VDD) 10 μA Turn on Time 250 μsec On the APEX LT module the VP A_EN control must be provided by the host microprocessor. In normal operation, the VPA_ EN line must be set high. It must be set low when the module is put into sleep mode in conjunction with putting the EM260 into deep sleep. Upon module wake-up, a 250µsec turn-on time must be provided prior to any transmission, allowing the module’s regulator to settle. Note that this 250µsec requirement applies only to the external power amplifier, the wake-up time for the EM260 is separate from this value. If the application does not put the module to sleep or if sleep current is not an issue, the power amplifier regulator may be permanently enabled by tying the control line high. In this setup, the sleep current will increase by 80 μA over the 5μA Standby Current figure provided in Electrical Specifications. SiF iNTErFACE The APEX LT module provide access to the SIF module programming and debug interface. Consult the EM260 datasheet for further details on the following SIF features:

• Production Testing
• Firmware Download
• Product Control and Characterization HOST PrOTOCOL iNTErFACE COMMANDS For information on Host Protocol Interface Commands and for other software-related documents refer to Ember’s website: http://www.ember.com/products_documentation.html NOT RECOMMENDED FOR NEW DESIGN

Power Supply Voltage 3.6 Vdc Voltage on Any Digital Pin VDD + 0.3, Max 3.6 Vdc RF Input Power +10 dBm Storage Temperature Range -45 to 125 °C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Characteristic Min Typ Max Unit Power Supply Voltage (VDD) 2.1 3.6 V Input Frequency 2405 2480 MHz Ambient Temperature Range -40 25 85 °C Logic Input Low Voltage 0 20% VDD V Logic Input High Voltage 80% VDD VDD V DC CHArACTEriSTiCS (@ 25°C, VDD = 3.3V unless otherwise noted) Parameter Min Typ Max Unit Logic Input Low 0 0.2 x VDD V Logic Input High 0.8 x VDD VDD V Logic Output Low 0 0.18 x VDD V Logic Output High 0.82 x VDD VDD V Power Consumption Transmit Mode (100mW output): APEX LT 170 mA Receive Mode: APEX LT 37 mA Standby Mode: 10mW 5 μA 100mW 5 μA NOT RECOMMENDED FOR NEW DESIGN

rF CHArACTEriSTiCS (@ 25°C, VDD = 3.3V unless otherwise noted) Parameter Min Typ Max Unit General Charcteristics RF Frequency Range 2400 2483.5 MHz RF Data Rate 250 kbps Transmitter Nominal Output Power 20 dBm Programmable Output Power Range 32 dB Error Vector Magnitude 15 35 % receiver Receiver Sensitivity (1% PER) – normal mode -92 -96 dBm Receiver Sensitivity (1% PER) – boost mode* -93 -97 dBm Saturation (Maximum Input Level) (1% PER) 0 dBm

802.15.4 Adjacent Channel Rejection:

802.15.4 Alternate Channel Rejection 40 dB 802.11 g Rejection (±10 MHz): APEX LT 30 dB *Boost Mode is an optional software-selectable high performance mode designed to increase receiver sensitivity. Note: Refer to Ember EM260 datasheet for additional details. PIN SIGNALS I/O PORT CONFIGURATION The APEX LT module has a 28 edge I/O interfaces for connection to the user’s host board. Figure 1 shows the layout of the 28 edge castellations. PIN 1 PIN 10 PIN 28 PIN 19 Figure 1 (Top View) NOT RECOMMENDED FOR NEW DESIGN

APEX LT I/O PIN ASSIGNMENTS Pin # Name Type Description

1 GROUND GND Ground

2 GROUND GND Ground

3 GROUND GND Ground

4 GROUND GND Ground

5 VDD PI Power Supply Input

6 nRESET DI Reset, active low

7 MOSI DI SPI Data, Master Out/Slave In (from Host to APEX LT)

8 MISO DO SPI Data, Master In/Slave Out (from APEX LT to Host)

9 SCLK DI SPI Clock (from Host to APEX LT)

10 VPA_EN DI APEX LT Enable, active high (see section of “ Power Amplifier Regulator

Control Line”) 11 nRTS DO UART RTS 12 nSSEL_INT/nCTS DI SPI Slave Select (from Host to APEX LT)/UART CTS

13 PTI_EN DO PTI Frame signal

14 PTI_DATA DO PTI Data signal

15 TXD DO UART TXD

16 nHOST_INT/RXD DO/DI Host Interrupt Signal (from APEX LT to Host) or UART RXD 17 nWAKE DI Wake Interrupt Signal (from host to APEX LT)

18 GROUND GND Ground

19 SIF_CLK DI SIF Interface clock

20 SIF_MISO DO SIF Interface master in/slave out

21 SIF_MOSI DI SIF Interface master out/slave in

22 nSIF_LOAD DI/DO SIF Interface load strobe

23 SDBG DO Spare Debug Signal

24 LINK_ACTIVITY DO Link and Activity signal

25 GROUND GND Ground

26 GROUND GND Ground

27 GROUND GND Ground

28 GROUND GND Ground

Unused I/O pins should be left unconnected and the pin state set via the Host Protocol. DI = Digital Input PI = Power Input DO = Digital Output GND = Ground AI = Analog Input AO = Analog Output NOT RECOMMENDED FOR NEW DESIGN

DiMENSiONS: ZALM-301-1 Apex LT Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted. DIMENSIONS: ZALM-301-1C Apex LT with Optional MMCX Connector Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted. TOP VIEW 0.062 1.275 1.000 0.909 RF Shield 0.195 MAX PCB Trace Antenna PIN 19: SIF_CLK SIF_MISO SIF_MOSI nSIF_LOAD SDBG LINK_ACTIVITY GROUND GROUND GROUND PIN 28: GROUND PIN 10: VPA_EN SCLK MISO MOSI nRESET VDD GROUND GROUND GROUND PIN 1: GROUND PIN 18: GROUND nWAKE nHOST_INT/RXD TXD PTI_DATA PTI_EN nSSEL_INT/nCTS PIN 11: nRTS TOP VIEW PIN 19: SIF_CLK SIF_MISO SIF_MOSI nSIF_LOAD SDBG LINK_ACTIVITY GROUND GROUND GROUND PIN 28: GROUND PIN 10: VPA_EN SCLK MISO MOSI nRESET VDD GROUND GROUND GROUND PIN 1: GROUND PIN 18: GROUND nWAKE nHOST_INT/RXD TXD PTI_DATA PTI_EN nSSEL_INT/nCTS PIN 11: nRTS 0.062 1.275 1.000 0.909 RF Shield 0.195 0.205 0.410 Optional MMCX Connector for external antennaOverall Height w/MMCX Connector J2 J2 MAX MAX NOT RECOMMENDED FOR NEW DESIGN

PCB COPPEr PATTErN LAYOUT: Apex LT Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted. 0.850 0.090 0.050 0.240 0.025 0.025 0.970 0.100 Pitch Typ0.040 0.125 Typ 28 Pads

0.070 Typ 28 Pads

Recommended Host PCB Board Edge 0.040 PIN 128 PCB PASTE STENCiL PATTErN: Apex LT Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted. 0.900 0.100 Pitch Typ0.065 0.100 Typ 28 Pads 0.065 PIN 128 NOT RECOMMENDED FOR NEW DESIGN

PCB Keep-out areas: Apex LT Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted. For optimum antenna performance, the APEX LT modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the PCB edge. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout. 1.275 1.000 1.200 0.190 0.315 0.050 If optional MMCX connector is specified, edge of host board must be notched as shown Edge of Host PCB Recommended overhang for PCB Antenna = 0.230 If module does not overhang edge of host PCB, no components, copper or traces are allowed in this area Component Keep Out Area: No components within 0.100 inches of module NOT RECOMMENDED FOR NEW DESIGN

Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 260 + 0ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Achieve the brightest possible solder fillets with a good shape and low contact angle. Pb-Free Soldering Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations. Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.

• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step. Optical inspection After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias. NOT RECOMMENDED FOR NEW DESIGN

Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711. Rework The Apex LT Module can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. !Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customers own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. PROCESSING (Continued) NOT RECOMMENDED FOR NEW DESIGN

FCC Part 15.247 Module Certified (Mobile) The APEX LT modules comply with Part 15 of the Federal Communications Commission rules and regulations. To meet the FCC Certification requirements, the user must meet these regulations:

• The text on the FCC ID label provided with the module must be placed on the outside of the final product.
• The modules may only use the antennas that have been tested and approved with these modules: — The on-board PCB trace antenna — Nearson S131CL-5-RMM-2450S antenna. To meet the Section 15.209 emission requirements in the restricted frequency bands of Section 15.205, the transceiver transmitter power for the APEX LT (EM260) module needs to be reduced from the typical maximum setting on the upper two channels (2475 MHz and 2480 MHz). Maximum values are TBD. Per Section 2.109, the APEX LT module has been certified by the FCC for use with other products without additional certification. Any modifications to this product may violate the rules of the Federal Communications Commission and make operation of the product unlawful. Per Sections 15.107 and 15.109, the user’s end product must be tested for unintentional radiators compliance. limits set forth for an uncontrolled environment. The antennas used with these modules must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. If the module is to be used in a handheld application, the user is responsible for passing additional FCC part 2.1091 rules (SAR) and FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, OET Bulletin and Supplement C. IC Certification — Canada The APEX LT module is IC certified. The labeling requirements for Industry Canada are similar to those of the FCC. A visible label on the outside of the final product must display the IC labeling. The user is responsible for the end product to comply with IC ICES-003 (Unintentional radiators). CE Certification — Europe The APEX module is CE certified. The CE marking must be affixed legibly and indelibly to a visible location on the user’s product. FCC Approved Antennas
• Integrated PCB trace antenna
• Nearson S131CL-5-RMM-2450S – A 2.4GHz Dipole antenna with a 5 inch cable and a right angle MMCX connector. NOT RECOMMENDED FOR NEW DESIGN

SHIPMENT, HANDLING, AND STORAGE Shipment The Apex LT Module is delivered in trays of 32. Each package consist of 5 trays and therefore the total module quantity per package is 160. Handling The Apex LT Module is designed and packaged to be processed in an automated assembly line. !Warning The Apex LT Module contain a highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. !Warning According to JEDEC ISP, the Apex LT Module is moisture sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 NOT RECOMMENDED FOR NEW DESIGN

REFERENCES & REVISION HISTORY references Reference Documents Apex Module Evaluation Kit User Guide Ember EM260 Datasheet (June 29, 2007)

Revision History

Previous Versions Changes to Current Version Page (Issue A) May 7, 2008 Initial preliminary datasheet. N/A 0003-00-07-00-000 (Issue B) January 22, 2009 Datasheet Unification for ZigBee product line N/A 0003-00-07-00-000 (Issue C) April 29, 2010 The following corrections/changes were made: On page 11, the module height was changed from 0.162” to 0.195”. On page 6, the deep sleep mode current consumption was changed to 5.0μA. 6, 11 Disclaimer

• The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third part ies by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s •equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. NOT RECOMMENDED FOR NEW DESIGN