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2 1 f o 1 e g a P 0 0 . 1 . v e R 0 0 1 0 J E 8 6 0 0 S D 8 0 R Nov 07, 2012 t e e h S a t a D PH5553A2NA1 Ambient Light Sensor
DESCRIPTION
The PH5553A2NA1 is a dig ital ambient light sensor for I 2C bus in terfaces and inclu des a 16-b it AD converter. This product has spectral ch aracteristics close to human eye sensitiv ity a nd outputs dig ital signals co rresponding to the ambient brightness. The PH5553A2NA1 can be used to improve the perf ormance and reduce the power consump tion of digital equipment such as FPD TV sets and mobile phones, by enabling automatic brightness control and automatic switching on and off of lighting systems.
FEATURES
- Small and thin SON pack age 2.55 x 1.56 x 0.55 mm
- Built-in 16-bit AD converter
- I2C bus interface 1.8 V reference supply voltage
- Spectral characteristics close to human eye sensitivity Peak sensitivity wavelength 550 nm TYP.
- Light source dependence with mounting the device can be reduced by the spectral characteristics adjustment function from visible region to infrared region.
- The calculation after illuminance output is not necessary by selecting the spectral characteristics from 16 patterns of those.
- Illuminance detection of wide region can be realized. x l 1 . 0 e c n a n i m u l l i e l b a t c e t e d m u m i n i M x l 5 3 5 5 6 e c na n i m u l l i e l b a t c e t e d m u m i x a M
- P b-free
APPLICATIONS
- FPD TV sets, displays
- Mobile phones, smartphones
- Notebook PCs, tablet PCs
- DSCs, DVCs
- FA equipment
- Lighting systems, etc. R08DS0068EJ0100 Rev.1.00 Nov 07, 2012 A Busine ss Par tner of Renesas Electro nics Corpora tion.
21 fo 2 egaP 00.1.veR 0010JE8600SD80R Nov 07, 2012 PACKAGE DIMENSIONS (UNIT: mm) BOTTOM VIEW TOP VIEW SIDE VIEW (0.25) 5.055.0 0.20.220.2 1.56±0.15 2.55±0.2 2.25 2 5 Remark Pin 1 is distinguishable by the shape of the lead frame. Remark ( ) indicates nominal dimensions. Pin No. Terminal I/O Function
1 VDD − Supply Voltage
2 GND − GND
3 VIO − I2C bus interface reference supply voltage
4 SCL I I2C bus SCL
5 TEST − Test (Be sure to connect to GND.)
6 SDA IO I2C bus SDA
A Business Par tner of Renesas Electronics Corporation.
R08DS0068EJ0100 Rev.1.00 Page 3 of 12 Nov 07, 2012 MARKING (Bottom View) 1 pin Assembly code Product code
ORDERING INFORMATION
Part Number Order Number Solder Plating Specification Packing Style PH5553A2NA1-E4 PH5553A2NA1-E4-Y-A Pb-Free Embossed Tape 5 000 pcs/reel ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage VDD 4.5 V I2C Reference Voltage VIO V DD V Power Dissipation*1 PD 135 mW Operating Temperature TA −30 to +85 °C Storage Temperature Tstg −40 to +100 °C Note: *1. Mounted on glass epoxy board (18 mm × 13 mm × t0.8 mm) RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VDD 2.4 3.0 3.6 V I2C Reference Voltage VIO 1.65 − VDD V A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 4 of 12 Nov 07, 2012 ELECTRO-OPTICAL CHARACTERISTICS (TA = 25°C, VDD = 3.0 V, VIO = 1.8 V, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Current 1 IDD1 Ev = 100 lx *1 130 290 μA Supply Current 2 IDD2 Ev = 100 lx *1, power-down 0.01 1 μA Peak Sensitivity Wavelength λp PD bit = “1000” 550 nm Dark Sensor Output − Ev = 0 lx, PD bit = “1000”, GCSW bit = 1 4 count Illuminance Count − Ev = 1 000 lx *1, PD bit = “1000”, GCSW bit = 1 700 1 000 1 300 count Multiplying Factor of Illuminance Count (× 1) GCL PD bit = “1000”, GCSW bit = 1, RSLTN bit = 0 1 count/lx Multiplying Factor of Illuminance Count (× 10) GCL PD bit = “1000”, GCSW bit = 0, RSLTN bit = 0 10 count/lx H-Resolution Mode Resolution HRM GCSW bit = 1, RSLTN bit = 0 1 count L-Resolution Mode Resolution LRM GCSW bit = 1, RSLTN bit = 1 16 count Measurement Time in H-Resolution Mode HRt RSLTN bit = 0 330 495 ms Measurement Time in L-Resolution Mode LRt RSLTN bit = 1 21 32 ms I2C SCL Clock Frequency f SCL 400 kHz I2C Bus Free Time tBUF 1.3 μs I2C Hold Time for START Condition tHDSTA 0.6 μs I2C Set-up Time for START Condition tSUSTA 0.6 μs I2C Set-up Time for STOP Condition tSUSTO 0.6 μs I2C Data Hold Time tHDDAT 0 0.9 μs I2C Data Set-up Time tSUDAT 100 ns I2C ‘L’ Period of the SCL Clock t LOW 1.3 μs I2C ‘H’ Period of the SCL Clock t HIGH 0.6 μs I2C ‘L’ Output Voltage 1 at SDA V OL1 V IO > 2V, IIO = 3mA 0 0.4 V I2C ‘L’ Output Voltage 2 at SDA V OL2 V IO ≤ 2V, IIO = 2mA 0 0.2 x V IO V I2C ‘L’ Input Voltage at SCL, SDA VIL −0.5 0.3 x V IO V I2C ‘H’ Input Voltage at SCL, SDA VIH 0.7 x VIO − VIO V Note: *1 Fluorescent light A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 5 of 12 Nov 07, 2012 I2C BUS INTERFACE SPECIFICATION 1. I 2C Bus Interface Timing Chart SDA SCL tf SS r P S tHDSTA tLOW tr tHDDAT tSUDAT tf tSUSTAtHIGH tHDSTA tSUSTO tr tBUFtSP S :START Condition Sr :Repeated START Condition P :STOP Condition 2. Slave Address “1100100”. 3. I2C Protocols (1) Write Format A/AS MSB SLAVE ADDRESS R/W '0' (write) AA DATA DATA DATA P Data transferred (n bytes + acknowledge) A = Acknowledge (SDA = low) A = Not Acknowledge (SDA = high) S = START Condition P = STOP Condition From master to slave From slave to master (2) Read Format S MSB SLAVE ADDRESS R/W '1' (read) A DATA DATA DATA P Data transferred (n bytes + acknowledge) A = Acknowledge (SDA = low) A = Not Acknowledge (SDA = high) S = START Condition P = STOP Condition From master to slave From slave to master A A A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 6 of 12 Nov 07, 2012 REGISTER MAP 1. Set values with Write operation (a) Register1 0 0 0 0 0 0 0 0 default Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Timemanu Register Address SWRST STOP RSLTN GCSW PWR (b) Register2 0 0 0 0 1 0 0 0 default Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 (fixed) Reserved Reserved Reserved PD4 PD3 PD2 PD1 1) Timemanu : Measurement time manual set (1: Enable measurement time set by Register3 and Register4) 2) Register Address : Register address set during read operation 3) SWRST : Register reset (Initial values are restored by setting this bit to 1.) 4) STOP : Stops lux measurement after the current AD C cycle. The lux data measured last is retained. The ADC enters standby mode (1: Stop) 5) RSLTN : Illuminance count resolution selection (1: 16 count resolution, 0: 1 count resolution) 6) GCSW : Illuminance count gain selection (1: 1 count/lx, 0: 10 count/lx) 7) PWR : Power control switch (1: Power on, 0: Power off (standby state)) 8) PD1 to PD4 : Spectral characteristics adjustment 2. Set values with Write Operation (Control with 4 Byte Unit (When Timemanu = 1)) When Timemanu = 1, measurement time is enabled to be changed by transferring Register1 and Register2 followed by Register3 and Register4. (a) Register3 (when RSLTN = 0) 0 1 0 1 0 0 0 0 default Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Illuminance measurement time counter 0H in H-Resolution mode lower 8 bit (when RSLTN = 0) (b) Register4 (when RSLTN = 0) 1 1 0 0 0 0 1 1 default Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Illuminance measurement time counter 1H in H-Resolution mode upper 8 bit (when RSLTN = 0) (c) Register3 (when RSLTN = 1) 0 0 1 1 0 1 0 1 default Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Illuminance measurement time counter 2H in L-Resolution mode lower 8 bit (when RSLTN = 1) (d) Register4 (when RSLTN = 1) 0 0 0 0 1 1 0 0 default Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Illuminance measurement time counter 3H in L-Resolution mode upper 8 bit (when RSLTN = 1) Method for obtaining measurement time Measurement time (ms) = Set value / 600 × 4 A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 7 of 12 Nov 07, 2012 3. Return Value during Read Operation (When Register Address = 00) 0 0 0 0 0 0 0 0 default Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Illuminance count measurements Upper 8bits 0 0 0 0 0 0 0 0 default Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Illuminance count measurements Upper 8bits 4. Return Value during Read Operation (When Register Address = 01) 0 0 0 0 0 0 0 0 default Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Timemanu Register Address SWRST STOP RSLTN GCSW PWR 0 0 0 0 1 0 0 0 default Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0 (fixed) Reserved Reserved Reserved PD4 PD3 PD2 PD1 5. Return Value during Read Operation (When Register Address = 10) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Illuminance measurement time counter 0H in H-Resolution mode lower 8 bit (when RSLTN = 0) Illuminance measurement time counter 2H in L-Resolution mode lower 8 bit (when RSLTN = 1) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Illuminance measurement time counter 1H in H-Resolution mode upper 8 bit (when RSLTN = 0) Illuminance measurement time counter 3H in L-Resolution mode upper 8 bit (when RSLTN = 1) A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 8 of 12 Nov 07, 2012 TYPICAL CHARACTERISTICS (TA = 25°C, VDD = 3.0 V, VIO = 1.8 V, unless otherwise specified) 1.1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 300 400 500 600 700 800 900 0 0.5 1 1.5 2 1 000 1 100 1 200 0.2 0.4 0.6 0.8 1.2 −90 −60 −30 0 30 60 90 0 0.2 0.4 0.6 0.8 1.2 −90 −60 −30 0 30 60 90 Wavelength (nm) Ratio Angle (deg.) Angle (deg.) RatioRatio Ratio White LED Krypton light Halogen light Incandescent light Fluorescent light SPECTRAL SENSITIVITY CHARACTERISTICS DIRECTIONAL CHARACTERISTICS 1 DIRECTIONAL CHARACTERISTICS 2 LIGHT SOURCE SENSITIVITY VARIATION 0000 1111 1000 PD bit 1 pin 1 pin +− + Remark The graphs indicate nominal characteristics. A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 9 of 12 Nov 07, 2012 0.2 0.4 0.6 0.8 1.2 1.4 −40 0.2 0.4 0.6 0.8 1.2 1.4 1.6 V DD (V) RatioRatio Ratio −40 −20 0 20 40 60 80 100 −20 0 20 40 60 80 100 0.2 0.4 0.6 0.8 1.2 1.4 Illuminance (lx) AT 100 lx (NORMALIZED AT VDD = 3 V) VDD DEPENDENCY OF ILLUMINANCE COUNT COUNT AT 100 lx (NORMALIZED AT 25°C) TEMPERATURE DEPENDENCY OF ILLUMINANCE ILLUMINANCE vs. ILLUMINANCE COUNT OF ILLUMINANCE COUNT AT 0 lx TEMPERATURE DEPENDENCY (NORMALIZED AT PD BIT = 1000, FLUORESCENT LIGHT ) PD BIT SET DEPENDENCY OF ILLUMINANCE COUNT Output (count) Output (count) Temperature (°C) Temperature (°C) PD bit 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Fluorescent light White LED Incandescent light 0.1 10 000 100 00010010 1 1 000 1 000 100 10 000 100 000 GCH GCL Remark The graphs indicate nominal characteristics. A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 10 of 12 Nov 07, 2012 TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) Symbol Dimensions (mm) A B W Symbol Dimensions (mm) C D E θ θ φφ φ 13±0.2 2.0±0.5 21.0±0.8 180 +0 –1.5 60 +1 –09.0 +1 –0 1 θθ E W D C BA Perforation Direction of feed Product Carrier tape Cover tape Product Pin 1 φ φ 2.0±0.1 4.0±0.1 0.2±0.05 0.78±0.05 3.5±0.05 1.75±0.1 8.0±0.2 0.78±0.05 2.9 1.95 4.0±0.1 1.05±0.05 1.5 +0.1–0 90° 120° A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 11 of 12 Nov 07, 2012 RECOMMENDED MOUNT PAD DIMENSIONS (Unit: mm) 0.24 0.24 0.22 0.50.5 0.50.5 0.22 0.220.22 1.85 0.55 Remark All dimensions in this figure must be evaluated before use. A Busine ss Par tner of Renesas Electro nics Corpora tion.
R08DS0068EJ0100 Rev.1.00 Page 12 of 12 Nov 07, 2012 NOTES ON HANDLING 1. Recommended reflow soldering conditions (including infrared reflow, convection reflow, and infrared + convection reflow) (1) This product is dry-packed with desiccant in order to avoid moisture absorption. (2) After breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature profile shown below. (3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and reel. Baking conditions: Once, with tape and reel, 60±5°C, 10 to 24 hours After the baking process, this product must be stored under conditions of 30°C or below, 70% RH or below, and reflow soldering must be done within 168 hours. <Storage conditions after breaking seal>
- Storage conditions : 30 °C or below, 70% RH or below
- Maximum storage period after breaking seal : 168 hours (Second reflow soldering must be completed within 168 hours.) <Reflow soldering conditions>
- Peak reflow temperature : 260 °C or below (Package surface temperature)
- Maximum number of reflows : 2
- No repair by hand soldering
- Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less Time Recommended Temperature Profile of Reflow Package Surface Temperature 60 to 120 s 220°C 255°C 8 min. MAX. 150°C Ramp-up rate 3°C/s MAX. Ramp-down rate 6°C/s MAX. Peak Temperature 260°C MAX. 30 s or less 60 s or less 200°C A Busine ss Par tner of Renesas Electro nics Corpora tion.
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