PH5502B2NA1-E4 CEL | Alldatasheet

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01 fo 1 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 Preliminary Data Sheet PH5502B2NA1-E4 Ambient Illuminance Sensor

DESCRIPTION

The PH5502B2NA1-E4 is an ambient illuminance sensor with a photo diode and current amplifier. This product has spectral characteristics close to human eye sensitivity and outputs light current proportional to the ambient brightness. The PH5502B2NA1-E4 can be used to improve the performance and reduce the power consumption of digital equipment such as FPD-TV sets and mobile phones, by enabling automatic brightness control and automatic switching on and off of lighting systems.

FEATURES

  • Small and thin SON package 2.55 x 1.56 x 0.55 mm
  • Spectral characteristics close to human eye sensitivity Peak sensitivity wavelength 555 nm TYP.
  • Output characteristics proportional to illuminance
  • Large output light current 230 µA TYP.@100 lx (Fluorescent light)
  • Low voltage operation VCC = 1.8 to 5.5 V
  • Pb-free

APPLICATIONS

  • FPD TV sets, displays
  • Mobile phones, smartphones
  • Notebook PCs, tablet PCs
  • DSCs, DVCs
  • FA equipment
  • Lighting systems, etc. R08DS0038EJ0100 Rev.1.00 Oct 05, 2011 A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 2 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 PACKAGE DIMENSIONS (UNIT: mm) BOTTOM VIEW TOP VIEW SIDE VIEW (0.25) 5.055.0 0.20.220.2 1.56±0.15 2.55±0.2 2.25 2 5 Remark Pin 1 is distinguishable by the shape of the lead frame. Remark ( ) indicates nominal dimensions. Pin No. Terminal

1 OUT

2 GND

3 VCC

Remark 1. Connect all the NC terminals to GND or VCC. 2. The bypass capacitor between VCC and GND is to be mounted within 20 mm of the package body. A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 3 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 BLOCK DIAGRAM OUT Light Source GND VCC MARKING EXAMPLE (Bottom View) 1 pin Assembly code Product code A 2 A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 4 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit V egatloV ylppuS CC 6 V I tnerruC thgiL O 5 mA Power Dissipation *1 PD 135 mW Operating Temperature Topt −30 to +85 °C Storage Temperature Tstg −40 to +100 °C Note: *1. Mounted on glass epoxy board (18 mm × 13 mm × t0.8 mm) RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit V egatloV ylppuS CC 1.8 3.0 5.5 V ELECTRO-OPTICAL CHARACTERISTICS (TA = 25°C, VCC = 3.0 V, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Current *1 ICC EV = 100 lx *2 − 260 − µA Peak Sensitivity Wavelength λp ʵ − 555 − nm Light Current *1 IO0 EV = 0 lx − ʵ 0.1 µA I O1 EV = 10 lx *2 − 23 − µA I O2 EV = 100 lx *3 − 330 − µA I O3 EV = 100 lx *2 195 230 265 µA Saturation Output Voltage *4 VO EV = 100 lx, RL = 150 kΩ *2 2.6 2.9 − V Switching Rise Time tr RL = 5 kΩ *6 − 200 ʵ µs Time *5 Fall Time tf − 250 ʵ µs Delay Time td − 400 ʵ µs Storage Time ts − 10 ʵ µs Note: *1 Measured under load resistance conditions of an output current unsaturated *2 Fluorescent light *3 Incandescent light *4 Saturation output voltage measurement method: Light Source Illuminance (lx) VCC PH5502B GND OUT RL VCC VCC VO A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 5 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 *5 Switching Time Pulse input Input Output VCC PH5502B GND OUT RL VCC td ts 90% 10% tr tf *6 White LED A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 6 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 TYPICAL CHARACTERISTICS (TA = 25°C, VCC = 3.0 V, unless otherwise specified) 1.1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 25.115.00009008007006005004003 1 000 1 100 1 200 0.2 0.4 0.6 0.8 1.2 −90 −60 −30 0 30 60 90 0 0.2 0.4 0.6 0.8 1.2 −90 −60 −30 0 30 60 90 oitaR)mn( htgnelevaW ).ged( elgnA).ged( elgnA RatioRatio Ratio 1 pin 1 pin White LED Krypton light Halogen light Incandescent light Fluorescent light + +- - SPECTRAL SENSITIVITY CHARACTERISTICS DIRECTIONAL CHARACTERISTICS 1 DIRECTIONAL CHARACTERISTICS 2 LIGHT SOURCE SENSITIVITY VARIATION Remark The graphs indicate nominal characteristics. A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 7 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 0.2 0.4 0.6 0.8 1.2 1.4 −40 0 0.01 0.1 0.001 VCC (V) Ratio Ratio −40 −20 0 20 40 60 80 100 −20 0 20 40 60 80 100 0.2 0.4 0.6 0.8 1.2 1.4 2.533.544.555.5 6 0.1 1 10 100 1 000 10 000 0.1 100 1 000 10 000 Illuminance (lx) a b c AT 100 lx (NORMALIZED AT VCC = 3 V) VCC DEPENDENCY OF LIGHT CURRENT CURRENT AT 100 lx (NORMALIZED AT 25°C) TEMPERATURE DEPENDENCY OF LIGHT OF LIGHT CURRENT AT 0 lx TEMPERATURE DEPENDENCY IO (μA) IO (μA) LIGHT CURRENT VS. ILLUMINANCE Load between Out-GND a: No load c: 10 k/uni03A9 b: 1 k/uni03A9 Temperature (°C) Temperature (°C) Remark The graphs indicate nominal characteristics. A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 8 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) Tape Direction Outline and Dimensions (Reel) Symbol Dimensions (mm) A B W Symbol Dimensions (mm) C D E θ θ φφ φ 13±0.2 2.0±0.5 21.0±0.8 180 +0–1.5 60 +1–0 9.0 +1–0 θθ E W D C B A Perforation Direction of feed Product Carrier tape Cover tape Product Pin 1 φ φ 2.0±0.1 50.0±2.01.0±0.4 0.78±0.05 3.5±0.05 1.75±0.1 8.0±0.2 0.78±0.05 2.9 1.95 4.0±0.1 1.05±0.05 1.5 +0.1–0 90° 120° A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 9 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 RECOMMENDED MOUNT PAD DIMENSIONS (Unit: mm) 0.24 0.24 0.22 0.50.5 0.50.5 0.22 0.220.22 1.85 0.55 Remark All dimensions in this figure must be evaluated before use. A Business Par tner of Renesas Electronics Corporation.

PH5502B2NA1-E4 Chapter Title 01 fo 01 egaP 00.1.veR 0010JE8300SD80R Oct 05, 2011 NOTES ON HANDLING 1. Recommended reflow soldering conditions (including infrared reflow, convection reflow, and infrared + convection reflow) (1) This product is dry-packed with desiccant in order to avoid moisture absorption. (2) After breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature profile shown below. (3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and reel. Baking conditions: Once, with tape and reel, 60±5°C, 10 to 24 hours After the baking process, this product must be stored under conditions of 30°C or below, 70% RH or below, and reflow soldering must be done within 168 hours. <Storage conditions after breaking seal>

  • 03 : snoitidnoc egarotS °C or below, 70% RH or below
  • Maximum storage period after breaking seal : 168 hours (Second reflow soldering must be completed within 168 hours.) <Reflow soldering conditions>
  • 062 : erutarepmet wolfer kaeP °C or below (Package surface temperature)
  • 2 : swolfer fo rebmun mumixaM
  • No repair by hand soldering
  • Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less Time Recommended Temperature Profile of Reflow Package Surface Temperature 60 to 120 s 220°C 255°C 8 min. MAX. 150°C Ramp-up rate 3°C/s MAX. Ramp-down rate 6°C/s MAX. Peak Temperature 260°C MAX. 30 s or less 60 s or less 200°C A Business Par tner of Renesas Electronics Corporation.

All trademarks and registered trademarks are the property of their respective owners. C - 1 Rev. Date Page Summary

1.00 Oct 05, 2011 − First edition issued

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