CABGA_V01 AMKOR | Alldatasheet
Document overview
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Technical content
Amkor assures reliable performance by continuously monitoring key indices: f Moisture sensitivity characterization: JEDEC level 3 @ 260°C, L2 & L1 achievable in some structures/BOMs*, 85°C/85% RH, 168 hours f HAST: 130°C/85% RH, 96 hours f Temp/Humidity: 85°C/85% RH, 1000 hours f Temperature cycle: -55°C/+125°C, 1000 cycles f High temperature storage: 150°C, 1000 hours f Automotive AEC-Q100 grade 0 reliability available** *Contact Amkor for additional information **Board level reliability available Body Size (mm) ΘJA at 1.0W and 0 Airflow (°C/W) LFBGA TFBGA VFBGA 8 x 8 37.28 36.45 37.52 10 x 10 29.86 29.04 26.7 15 x 15 20.1 N/A N/A 19 x 19 17.04 N/A N/A Thermal Performance (Standard BOM) Thin core laminate (2 to 6 metal layer) from the strongest supply chain in the industry, ultra-thin mold cap thickness and Si thinning to 50 μm enable next-generation tablets, smartphones, game controllers, digital and video cameras and remote devices. Advances in substrate surface finishes and routing techniques reduce gold costs while improving electrical and board level reliability performance. Innovative thermal package structures offer cost competitive solutions for the most challenging thermal management needs.
Applications
The ChipArray® package family is applicable for a wide range of semiconductors from high end FPGAs, ASICS to memory, analog, RF devices, MCUs and simple PLDs requiring a package size smaller than conv entional PBGAs or leadframe packages. ChipArray ® packages fill the need for the low cost, minimum space, high performance and reliability requirements of mobile and gaming devices, notebooks, personal computers, networking, automotive and industrial applications. Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (FBGA) offers a broad selection of ball array pitches (≥0.3 mm pitch), ball counts and body sizes (1.5 mm to 27 mm body), single and multi-die layouts, stacked die (1-16) and passive component integration. ChipArray® CABGA/FBGA DATA SHEET | LAMINATE PRODUCTS
FEATURES
f Cutting-edge technology and expanding package offerings provide a platform from prototype-to- production f Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities f Lowest cost using Amkor standard CABGA bill of materials selection f 1.5-27 mm body size available f Square or rectangle packages available f 4-700 ball/lead counts pitch available f JEDEC publication 95 design guide 4.5 (JEP95) f RoHS-6 (green) BOM options for 100% of CABGA family f Thermal conductivity epoxy (8 W/mk) and thermal conductivity compound (3 W/mK) are available
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2019 Amkor Technology Incorporated. All Rights Reserved. DS550V-EN Rev Date: 06/19 Visit amkor.com or email sales@amkor.com for more information. Standard Materials f Package substrate ▷ Conductor: Copper ▷ Dielectric: Epoxy resin glass reinforced f Die attach adhesive: Low-stress elastomer f Encapsulant: Epoxy mold compound f Low-alpha material available f Solder balls: Pb-free f Wire type ▷ Copper (PCC, Au Pcc) ▷ Silver and gold (2N, 4N) Package View TOP VIEW SIDE VIEW BOTTOM VIEW Process Highlights f Die thickness: 0.040-0.27 mm f Marking: Laser f Ball inspection: Optical f Wafer backgrinding available f Encapsulated SMT components available f Micro Pb-free covered LGA pads/LGAs available Test Services f Program generation/conversion f Product engineering f Wafer sort f 256 pin x 20 MHz test system available f -55°C to +165°C test available f Burn-in capabilities Shipping f Standard JEDEC trays f Tape and reel f Dry pack LFBGA > 1.2 mm TFBGA 1.2 mm (max) VFBGA 1.0 mm (max) WFBGA 0.8 mm (max) UFBGA 0.65 mm (max) XFBGA 0.50 mm (max) XFBGA 0.45 mm (max) X2FBGA 0.40 mm (max) CA-LFBGA CABGA-TFBGA CTBGA/CASON CABGA-VFBGA CVBGA/CASON CA-WFLGA CASON CA-XFBGA CA-XFLGA CA-XFBGA CA-XFLGA CA-XFBGA CA-XFLGA CA-X2FBGA CA-X2FLGA Mold Cap Thickness 0.70 mm 0.95 mm 0.60 mm 0.53 mm 0.45 mm (BGA) 0.53 mm (LGA) 0.40 mm (BGA) 0.45 mm (LGA) 0.32/0.35 mm (BGA)* 0.40 mm (LGA) 0.25 mm (BGA)* 0.32 mm (LGA) 0.2 mm (BGA)* 0.25 mm (LGA) 0.18 mm (BGA)* Substrate Layer
2 Lyr
0.32 mm, 0.56 mm
4 Lyr or 6 Lyr
0.34 mm, 0.56 mm
2 Lyr or 4 Lyr
0.21 mm, 0.26 mm 0.21 mm 0.21 mm, 0.13 mm 0.13 mm 0.13 mm 0.1 mm 0.085 mm Die Thickness** Availability 0.7 mm All Sites 0.95 mm P3, K4 All Sites All Sites 0.45 mm All Sites 0.40 mm C3, K4 0.32 mm, K4, P3 0.35 mm, All Sites 0.25 mm All Sites 0.2 mm 0.18 mm *Options are available with microballs **Die thickness is also dependent on the wirebond loop height requirement ChipArray® CABGA/FBGA