CERPAK AMKOR | Alldatasheet
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Technical content
Features: CERAMIC / HERMETIC www.amkor.com VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION Ceramic Pack (CerPak) Amkor Technology continues to service this established industry package. The Amkor Technology CerPak capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CerPak is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "flat unformed" leadframe. This package can have leads extending from two sides of the package (dual) or extending from four sides of the package (quad). The ceramic / LF / ceramic system is held together hermetically by glass The frit lid is sealed/reflowed over the package cavity at temperatures between 400° - 460° Centigrade. Applications: Along with the other standard industry packages, the CerPak has a proven track record and is still being used by semiconductor technologies such as: Digital to Analog converters, Microwave, Logic, Memory, Microcontrollers, and Video controllers. Some end applications are: Military electronics, Commercial electronics, Consumer electronics, Automotive and Telecommunications. The CerPak offers a variety of features: 14-256 lead count, 50-30 mil lead pitch's Hermetic package High thermal conductive ceramic Solder Plate lead finish JEDEC standard compliant Wide selection of available cavity sizes to meet most die size needs Commercial or full Military flows DS802 Rev Date: 08’02