EPADTSSOP AMKOR | Alldatasheet
Document overview
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Technical content
ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch. These industry standard IC packages offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. ExposedPad TSSOP/ MSOP/SOIC/SSOP DATA SHEET | LEADFRAME PRODUCTS Thermal Performance Forced Convection, Single-Layer PCB Package Body Size (mm) Pad Size (mm) θJA at (°C/W) by Velocity (LFPM) 0 200 500 *Estimated JEDEC standard test boards Electrical Performance Simulated Results @ 100 MHz Package Body Size (mm) Pad Size (mm) Center Inductance (nH) Corner Resistance (mF) *Estimated
FEATURES
f Cu wire interconnect for low cost f Standard JEDEC package outlines f Multi-die production capability f Turnkey test services, including strip test options f ExposedPad configuration for increased thermal efficiency f Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC) f Green materials are standard – Pb-free and RoHS compliant f Stealth dicing (narrow saw streets) f Larger/Higher density leadframe strips f Leadframe roughening for improved MSL capability PROCESS HIGHLIGHTS f PCC wire is standard, Au and Ag wire available f Wafer backgrinding services available f Multiple die and die stacking capability f NiPdAu (PPF) or matte Sn lead finish options f Laser mark on package body
Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD 020 moisture preconditioning. f Moisture sensitivity characterization: JEDEC level 3, 30°C/60% RH, 192 hours f uHAST: 130°C/85% RH, no bias, 96 hours f Temp cycle: -65°C/+150°C, 500 cycles f High temp storage: 150°C, 1000 hours Services And Support Amkor has a broad base of resources available to help customers bring quality products to market quickly and at the lowest possible cost. f Full package characterization f Thermal, mechanical stress and electrical performance modeling f Turnkey assembly, test and drop ship f World-class reliability testing and failure analysis ePad TSSOP/MSOP/SOIC/SSOP Cross Section ePad TSSOP Cross Section ePad SOIC Test Services f Program generation/conversion f Wafer probe f Burn-in capabilities f -55°C to +165°C test available f Strip test available Shipping f Clear anti-static tube, 20 inch f Tape and reel f Dry pack f Drop ship Wirebond Die attach adhesive Die Exposed pad A B Mold compound Ground bond Cu leadframe C E F D G Wirebond Die attach adhesive Die A B Exposed pad Mold compound Cu leadframe C D E F A E B F D C A E B G F D C
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2021 Amkor Technology, Incorporated. All Rights Reserved. DS571N-EN Rev Date: 12/21 Visit amkor.com or email sales@amkor.com for more information. Configuration Options ePad TSSOP, ePad MSOP, ePad SOIC and ePad SSOP Nominal Package Dimensions (mm) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC ExposedPad TSSOP ExposedPad MSOP ExposedPad SOIC ExposedPad ePad TSSOP/MSOP/SOIC/SSOP