MEMS AMKOR | Alldatasheet

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Microelectromechanical Systems (MEMS) are micron-size devices that can sense or manipulate the physical world. MEMS are created using micromachining processes, similar to those used to produce integrated circuit (IC) devices. This allows a two or three-dimensional mechanical system to be created in the same small area typical of an IC device. Because the fab process is similar to that of IC fabrication, MEMS are most typically created on silicon wafers but can also employ other substrate types as well. Due to their size, tens of thousands of these devices can be fabricated on a single wafer. MEMS Applications Amkor Technology is the world’s leader in microelectronic packaging technologies and the world’s largest outsource provider of MEMS and Micro Optical Electronic Mechanical Systems (MOEMS). MEMS Technology MEMS are micron-size devices that can sense or manipulate the physical world. MEMS are typically created on silicon wafers, but can also use other substrate types as well. Due to size, tens of thousands of these devices can be fabricated on a single wafer. Courtesy Sandia National Laboratories SUMMiT™ Technologies www.mems.sandia.gov MEMS/Sensor Consumer Devices Automotive Health & Fitness Home/ Industrial Accelerometer     Biosensors  Chemical/Gas   Fingerprint   Gyroscope     Humidity    Inertial (IMU)    IR     Light/Optical     Magnetometer   Microphone     Pressure    Temperature     Amkor’s Value Proposition MEMS Manufacturing f Standard platforms = Faster development ▷ Faster introduction of new products ▷ Lower development cost f Amkor experience ▷ Dedicated MEMS team ▷ Constantly updating the MEMS toolbox with investments in new equipment and materials and leveraging other core technologies like TSV and Cu Pillar ▷ In-house test development capability MEMS PACKAGING CONSIDERATIONS Amkor Technology is the world leader in microelectronic packaging technologies and the world’s largest outsource provider of MEMS and MOEMS. GENERAL REQUIREMENTS f Controlling stresses to the MEMS structure f Allowing the stimuli to reach the MEMS structure f Protecting the MEMS and ASIC devices CONSUMER MARKET f Quick turnaround time f Highly reusable packaging f Miniaturization roadmap AUTOMOTIVE MARKET f More stringent device package protection f Customized requirements

Visit amkor.com or email sales@amkor.com for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2021 Amkor Technology, Incorporated. All Rights Reserved. TS103L-EN Rev Date: 01/21 MEMS Technology Open Tool Available (Sample Builds) Lead Count Body Width (mm) Body Length (mm) Body Thickness (mm) Pkg Type Lid Type Die Qty Interconnect Factory POD Dwg Unit Dwg 8 2 2 0.8 Cavity LGA Metal Multi-die WB P3 TBD – 8 4 4 0.9 Cavity LGA Metal Multi-die WB P3 643113PO – 8 5 5 1 Cavity LGA Metal Multi-die WB P3 TBD – 8 7 7 1 Cavity LGA Metal Multi-die WB P3 647876PO 647874UD 8 4 3 1 Cavity LGA L2L Multi-die WB P3 698505P0 698275UD 8 5 2 1 Molded Cavity LGA/BGA Glass/Filter Single Die WB C3 TBD – 22 6.8 4.9 1.2 Molded Cavity LGA/BGA Glass/Filter Single Die WB C3 TBD – 20 6 6 1.9 Cavity LF Polymer Multi-Die WB P3 610182PO 640993UD 18 15 25 0.45 Molded Cavity LGA/BGA Microlens Single Die WB C3 TBD – Cavity MEMS Packages MEMS/Sensor Package Standards Package Type Overmolded Exposed Die Surface Cavity Package Molded Cavity Package Leadframe SOIC/MLF® ChipArray® LGA/FPBGA Material Characterization DMA, DSC, TGA, TMA, thermo moiré, FTIR, interferometer, hardness, ARES, diffusivity, solubility and more. Modeling And Simulation Complete electrical and thermo-mechanical capabilities (mechanical, thermal, electrical, EMI/RFI modeling). Package And Board Level Reliability Amkor offers a full range of reliability test capabilities in multiple locations. Amkor presently conducts MEMS/sensor-related activities at the following strategic manufacturing locations: f Philippines (ATP) f Korea (ATK) f China (ATC) f Japan (ATJ)