UPG2150T5L_07 CEL | Alldatasheet

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Technical content

DESCRIPTION

The +PG2150T5L is a GaAs MMIC SP3T switch which was developed for Bluetooth and wireless LAN. This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 12-pin plastic TSQFN (T hin Small Quad Flat Non-leaded) package. And this package is able to high-density surface mounting.

FEATURES

  • Operation frequency : f opt = 0.5 to 2.5 GHz
  • Control voltage : V cont (H) = 2.3 to 3.6 V (2.85 V TYP.) V: cont (L) = <0.2 to 0.2 V (0 V TYP.)
  • Low insertion loss : L ins3 = 0.50 dB TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V, Vcont (L) =0V L: ins6 = 0.60 dB TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V, Vcont (L) = 0 V
  • High isolation : ISL3 = 35 dB TYP. @ f = 2.5 GHz, ANT to RF3, On port ANT to RF1, 2, RF1 to V,1FRotTNAtropnO,3FR cont (H) = 2.85 V, Vcont (L) =0V otTNA,zHG5.2=f@.PYTBd81=6LSI: RF1, On port ANT to RF2, 3, ANT to V,3,1FRotTNAtropnO,2FR cont (H) = 2.85 V, Vcont (L) = 0 V
  • Handling power : P in (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V, Vcont (L) =0V P: in (1 dB) = +25.0 dBm TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V, Vcont (L) =0V
  • High-density surface mounting : 12-pin plastic TSQFN package (2.0 = 2.0 = 0.37 mm)

APPLICATIONS

  • Antenna switch for Bluetooth and 802.11b/g

ORDERING INFORMATION

Part Number Order Number Package Marking Supplying Form +PG2150T5L-E2 +PG2150T5L-E2-A 12-pin plastic TSQFN (Pb-Free) 2150 % Embossed tape 8 mm wide % Pin 10, 11, 12 face the perforation side of the tape % Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: +PG2150T5L-A DATA SHEET Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. SP3T SWITCH FOR Bluetooth TM AND 802.11b/g GaAs INTEGRATED CIRCUIT +PG2150T5L Document No. PG10653EJ01V0DS (1st edition) Date Published February 2007 NS CP(N)

PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name

1 ANT

2 GND

4 RF2

5 GND

6 RF3

8 GND

10 RF1

11 N.C. (Bottom View) 456 121110 (Top View) 654 101112 2150 (Top View) 654 101112 12 N.C. Remark Exposed pad : GND TRUTH TABLE Vcont1V cont2V cont3 ANT <RF1 ANT <RF2 ANT <RF3 High Low Low ON OFF OFF Low High Low OFF ON OFF Low Low High OFF OFF ON ABSOLUTE MAXIMUM RATINGS (TA =+ 2 5$C, unless otherwise specified) Parameter Symbol Ratings Unit Switch Control Voltage V cont <6.0 to +6.0 Note V Input Power1 (ANT<RF1, ANT<RF2) P in1 +31.5 dBm Input Power2 (ANT<RF3) P in2 +25.5 dBm Operating Ambient Temperature T A <45 to +85 $C Storage Temperature T stg <55 to +150 $C Note «Vcont (H) < Vcont (L)«) 6.0 V RECOMMENDED OPERATING RANGE (TA = +25$C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit Operating Frequency f opt 0.5 < 2.5 GHz Switch Control Voltage (H) V cont (H) 2.3 2.85 3.6 V Switch Control Voltage (L) V cont (L) <0.2 0 0.2 V Data Sheet PG10653EJ01V0DS2 +PG2150T5L

ELECTRICAL CHARACTERISTICS

(TA =+ 2 5$C, V cont (H) = 2.85 V, V cont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Symbol Pass Test Conditions MIN. TYP. MAX. Unit L1ssoLnoitresnI ins1 ANT to RF1, 2 f = 0.5 to 1.0 GHz < 0.40 0.55 dB L2ssoLnoitresnI ins2 f = 1.0 to 2.0 GHz < 0.45 0.60 dB L3ssoLnoitresnI ins3 f = 2.0 to 2.5 GHz < 0.50 0.65 dB L4ssoLnoitresnI ins4 ANT to RF3 f = 0.5 to 1.0 GHz < 0.45 0.60 dB L5ssoLnoitresnI ins5 f = 1.0 to 2.0 GHz < 0.55 0.70 dB L6ssoLnoitresnI ins6 f = 2.0 to 2.5 GHz < 0.60 0.75 dB 2392zHG0.1ot5.0=f3FRotTNA1LSI1noitalosI < dB otTNAtropnO 2392zHG0.2ot0.1=f2,1FR2LSI2noitalosI < dB 3FRot1FR 5303zHG5.2ot0.2=fotTNAtropnO3LSI3noitalosI < dB 1FR 6232zHG0.1ot5.0=f1FRotTNA4LSI4noitalosI < dB otTNAtropnO 0271zHG0.2ot0.1=f3,2FR5LSI5noitalosI < dB 2FRotTNA 8151zHG5.2ot0.2=fotTNAtropnO6LSI6noitalosI < dB 3,1FR LRssoLnruteRtupnI in ANT to RF1, 2, 3 f = 0.5 to 2.5 GHz 15 20 < dB Output Return Loss RL out ANT to RF1, 2, 3 f = 0.5 to 2.5 GHz 15 20 < dB 1 dB Loss Compression P in (1 dB) ANT to RF1, 2 f = 1.0 GHz +28.0 +31.0 < dBm Input Power Note f = 2.0 GHz +28.0 +31.0 < dBm 0.13+0.82+zHG5.2=f < dBm 0.52+0.22+zHG0.1=f3FRotTNA < dBm 0.52+0.22+zHG0.2=f < dBm 0.52+0.22+zHG5.2=f < dBm Switch Control Current I cont ANT to RF1, 2, 3 RF None < 0.05 1.0 +A Switch Control Speed t SW ANT to RF1, 2, 3 50% CTL to < 50 < ns FR%01/09 Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Data Sheet PG10653EJ01V0DS 3 +PG2150T5L

The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PG10653EJ01V0DS4 +PG2150T5L

MOUNTING PAD LAYOUT DIMENSIONS 12-PIN PLASTIC TSQFN (UNIT: mm) 0.99 0.5 0.77 0.5 0.770.38 0.5 0.77 0.5 0.77 0.380.38 0.99 12–0.23 0.38 Remark The mounting pad layouts in this document are for reference only. Data Sheet PG10653EJ01V0DS 5 +PG2150T5L

12-PIN PLASTIC TSQFN (UNIT: mm) 2.0±0.1 2.0±0.1 (Bottom View) 0.23±0.1 0.94±0.1 0.94±0.1 0.23+0.07 –0.05 0.37+0.03 –0.05 Remark ( ) : Reference value Data Sheet PG10653EJ01V0DS6 +PG2150T5L

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. gniredloSdohteMgniredloS lobmySnoitidnoCsnoitidnoC Infrared Reflow Peak temperature (package surface temperature) : 260 $C or below sselrosdnoces01:erutarepmetkaeptaemiT Time at temperature of 220$C or higher : 60 seconds or less Preheating time at 120 to 180$ 021:C (30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 $C or below sselrosdnoces01:erutarepmetkaeptaemiT Preheating temperature (package surface temperature) : 120 $C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350 $C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10653EJ01V0DS 7 +PG2150T5L

Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. The information in this document is current as of February, 2007. The information is subject to change without notice. For actual de sign-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC Electronics endeavors to enhance the q uality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possib ility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (inclu ding death) to persons arising from defects in NEC Electronics products, customers must incor porate sufficient safety meas ures in their design, such as redundancy, fire-containment and anti-failure features. NEC Electronics products are classified into the fol lowing three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customer- designated "quality assurance program" for a specifi c application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) M8E 02. 11-1 (1) (2) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "Standard": "Special": "Specific": Data Sheet PG10653EJ01V0DS8 +PG2150T5L

Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points.

  • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal.
  • Do not burn, destroy, cut, crush, or chemically dissolve the product.
  • Do not lick the product or in any way allow it to enter the mouth. +PG2150T5L

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Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZLead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sol d by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.