UPG2012TK

UPG2012TK CEL | Alldatasheet

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Technical content

FEATURES

NEC's ¼ W SINGLE CONTROL L, S-BAND SPDT SWITCH

DESCRIPTION

NEC's UPG2012TK is a single control GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and L, S-band applications. This device can operate frequency from 0.5 GHz to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin lead-less minimold pack- age suitable for high-density surface mounting.

APPLICATIONS

• L, S-band digital cellular or cordless handsets
• BluetoothTM , W-LAN and WLL
• Short Range Wireless California Eastern Laboratories

ORDERING INFORMATION

Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2012TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

• SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.)
• SINGLE SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
• LOW INSERTION LOSS: (Reference value)
• HIGH ISOLATION: ISL2 = 30 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value )
• HIGH-DENSITY SURFACE MOUNTING: 6-pin lead-less minimold package Part Number Package Marking Supplying Form UPG2012TK-E2-A 6-pin lead-less minimold (1511) G3H • Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) RECOMMENDED OPERATING RANGE (TA = 25°C) PIN CONNECTIONS (Top View) 3 4 G3H (Top View) 3 4 (Bottom View) 4 3 Pin No. Pin Name

1 OUTPUT1

2 GND

3 OUTPUT2

4 Vcont

5 INPUT

6 VDD

Vcont INPUT−OUTPUT1 INPUT−OUTPUT2 Low OFF ON High ON OFF Parameter Symbol Ratings Unit Supply Voltage VDD +6.0 V Switch Control Voltage Vcont +6.0 V Input Power Pin +26 dBm Power Dissipation PD 150 Note mW Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VDD 2.7 2.8 3.0 V Switch Control Voltage (H) Vcont(H) 2.7 2.8 3.0 V Switch Control Voltage (L) Vcont(L) −0.2 0 0.2 V

ELECTRICAL CHARACTERISTICS

(TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Note P in (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. UPG2012TK UPG2012TK Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of the system. The range of recommended DC blocking capacitor value is less than 100 pF. Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss1 LINS1 f = 0.5 to 1.0 GHz − 0.27 0.50 dB Insertion Loss2 LINS2 f = 2.0 GHz − 0.30 0.50 dB Isolation1 ISL1 f = 0.5 to 2.0 GHz 24 30 − dB Input Return Loss RLin f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RLout f = 0.5 to 2.5 GHz 15 20 − dB 0.1 dB Gain Compression Input Power Note Pin(0.1 dB) f = 2.0 GHz +17.5 +20.5 − dBm Supply Current IDD − 50 100 μA Switching Control Current Icont − 4 20 μA STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VDD = 2.8 V,Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss3 LINS3 f = 2.5 GHz − 0.30 − dB Isolation2 ISL2 f = 2.5 GHz − 30 − dB 1 dB Gain Compression Input Power Note Pin(1 dB) f = 2.0 GHz − +24.0 − dBm Switching Control Speed tSW − 300 − ns Note P in (1dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range.

(VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) VDD Vcont OUTPUT1 OUTPUT2 INPUT 56 pF 56 pF56 pF 1 000 pF1 000 pF 456 321 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 6pin L2MM SPDT SW Vc1 Vc2 IN OUT 1 OUT 2 C2C4 Vcont OUTPUT2 INPUT OUTPUT1 VDD G3H USING THE NEC EVALUATION BOARD Symbol Values C1, C2, C3 56 pF C4, C5 1 000 pF

6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) Remark ( ): Reference value 0.48±0.050.48±0.05

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 08/30/2004 Caution Do not use different soldering methods together (except for partial heating).

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