UPG2012TB CEL | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge L-BAND SPDT SWITCH GaAs INTEGRATED CIRCUIT PG2012TB Document No. PG10218EJ01V0DS (1st edition) Date Published December 2002 CP(K)
DESCRIPTION
The PG2012TB is a GaAs MMIC for L -band SPDT (Single Pole Double Throw) switch which were developed for mobile phone and another L-band application. This device can operate frequency from 0.5 GHz to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 6 -pin super minimold package. And this package is able to high -density surface mounting.
FEATURES
- Supply voltage : VDD = 2.7 to 3.0 V (2.8 V TYP.)
- Switch control voltage : Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) : Vcont (L) = 0.2 to +0.2 V (0 V TYP.) value) : ISL2 = 25 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value)
- High-density surface mounting : 6-pin super minimold package (2.0 1.25 0.9 mm)
APPLICATIONS
- L-band digital cellular or cordless telephone
- PCS, W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number Package Marking Supplying Form PG2012TB-E3 6-pin super minimold G3A Embossed tape 8 mm wide Pin 1, 2, 3 face the perforation side of the tape Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2012TB-A
Data Sheet PG10218EJ01V0DS 2 PG2012TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name
1 OUTPUT1
2 GND
3 OUTPUT2
4 Vcont
5 INPUT
6 VDD
Vcont INPUTOUTPUT1 INPUTOUTPUT2 Low OFF ON High ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage VDD +6.0 V Switch Control Voltage Vcont +6.0 V Input Power Pin +26 dBm Power Dissipation PD 150 Note mW Operating Ambient Temperature TA 45 to +85 C Storage Temperature Tstg 55 to +150 C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB, TA = +85C RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VDD 2.7 2.8 3.0 V Switch Control Voltage (H) Vcont(H) 2.7 2.8 3.0 V Switch Control Voltage (L) Vcont(L) 0.2 0 0.2 V
Data Sheet PG10218EJ01V0DS 3 PG2012TB
ELECTRICAL CHARACTERISTICS
(TA = +25C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss1 LINS1 f = 0.5 to 1.0 GHz 0.27 0.50 dB Insertion Loss2 LINS2 f = 2.0 GHz 0.30 0.50 dB Isolation1 ISL1 f = 0.5 to 2.0 GHz 24 28 dB Input Return Loss RLin f = 0.5 to 2.5 GHz 15 20 dB Output Return Loss RLout f = 0.5 to 2.5 GHz 15 20 dB 0.1 dB Gain Compression Input Power Note Pin(0.1 dB) f = 2.0 GHz +17.5 +20.5 dBm Supply Current IDD 50 100 A Switching Control Current Icont 4 20 A Note Pin(0.1dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss3 LINS3 f = 2.5 GHz 0.30 dB Isolation2 ISL2 f = 2.5 GHz 25 dB 1 dB Gain Compression Input Power Note Pin(1 dB) f = 2.0 GHz +24.0 dBm Switching Control Speed tSW 300 ns Note Pin(1dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC cut capacitor value is less than 100 pF.
Data Sheet PG10218EJ01V0DS 4 PG2012TB EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PG10218EJ01V0DS 5 PG2012TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD USING THE EVALUATION BOARD Symbol Values C1, C2, C3 56 pF C4, C5 1 000 pF
Data Sheet PG10218EJ01V0DS 6 PG2012TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm)
Data Sheet PG10218EJ01V0DS 7 PG2012TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215C or below Time at temperature of 200C or higher : 25 to 40 seconds Preheating time at 120 to 150C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating).
8 Data Sheet PG10218EJ01V0DS
PG2012TB SAFETY INFORMATION ON THIS PRODUCT Caution GaAs Products The product contains gallium arsenide, GaAs. GaAs vapor and powder are hazardous to human health if inhaled or ingested.
- Do not destroy or burn the product.
- Do not cut or cleave off any part of the product.
- Do not crush or chemically dissolve the product.
- Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage.