UPG2010TB

UPG2010TB CEL | Alldatasheet

Document overview

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Technical content

FEATURES

NEC's HIGH POWER SINGLE CONTROL L-BAND SPDT SWITCH UPG2010TB California Eastern Laboratories

APPLICATIONS

• L-band digital cellular or cordless handsets
• PCS, W-LAN, WLL and Bluetooth TM
• Short Range Wireless NEC's UPG2010TB is a single control GaAs MMIC L-band SPDT (Single Pole Double Throw) switch for mobile phone and L-band applications. This device can operate from 0.5 to 2.5 GHz, with low inser - tion loss and high isolation. This device is housed in a 6-pin super minimold package, suitable for high-density surface mounting.

DESCRIPTION

• SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.)
• SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
• LOW INSERTION LOSS: (Reference value)
• HIGH ISOLATION: ISL 2 = 25 dB TYP . @ f = 2.5 GHz, VDD = 2.8 V , Vcont = 2.8 V/0 V (Reference value)
• POWER HANDLING:
• HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) Part Number Package Marking Supplying Form μPG2010TB-E3-A 6-pin super minimold G2Y • Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel

ORDERING INFORMATION

Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2010TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specified) Pin No. Pin Name

1 OUTPUT1

2 GND

3 OUTPUT2

4 VCont

5 INPUT

6 VDD

Vcont1 INPUT−OUTPUT1 INPUT−OUTPUT2 Low ON OFF High OFF ON PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Parameter Symbol Ratings Unit Supply Voltage VDD 6.0 V Switch Control Voltage Vcont 6.0 V Input Power Pin +36 dBm Power Dissipation PD 150 Note mW Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Parameter Symbol MIN. TYP. MAX. Unit Switch Voltage VDD 2.7 2.8 3.0 V Switch Control Voltage (H) Vcont (H) 2.7 2.8 3.0 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V (Top View) G2Y1 (Top View) (Bottom View) Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C

ELECTRICAL CHARACTERISTICS

(TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 51 pF, unless otherwise specified) Note P in (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2010TB UPG2010TB Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 LINS1 f = 0.5 to 1.0 GHz − 0.25 0.45 dB Insertion Loss 2 LINS2 f = 2.0 GHz − 0.30 0.50 dB Isolation 1 ISL1 f = 0.5 to 2.0 GHz 24 28 − dB Input Return Loss RLin f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RLout f = 0.5 to 2.5 GHz 15 20 − dB 0.1 dB Gain Compression Input Power Note Pin (0.1 dB) f = 1.0 GHz +31.5 +33.0 − dBm 2nd Harmonics 2f0 f = 1.0 GHz, Pin = +30.5 dBm 65 75 − dBc 3rd Harmonics 3f0 f = 1.0 GHz, Pin = +30.5 dBm 65 75 − dBc Supply Current IDD − 50 100 μA Switch Control Current Icont − 4 20 μA Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 3 LINS3 f = 2.5 GHz − 0.35 − dB Isolation 2 ISL2 f = 2.5 GHz − 25 − dB Switch Control Speed tSW − 1 − μs

EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 3 LINS3 f = 2.5 GHz − 0.35 − dB Isolation 2 ISL2 f = 2.5 GHz − 25 − dB Switch Control Speed tSW − 1 − μs OUTPUT1 OUTPUT2 VDD INPUT Vcont 56 pF 56 pF 1 000 pF 1 000 pF56 pF 1 2 3 6 5 4

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD USING THE NEC EVALUATION BOARD Symbol Values C1, C2, C3 56 pF C4, C5 1 000 pF VC 2 VC 1 IN OUT 1 OUT 2 6Pin SMM SPDT SW C1C5 C1C1 G2Y VDD Vcont INPUT OUTPUT1 OUTPUT2

Remark The graphs indicate nominal characteristics. TYPICAL CHARACTERISTICS (TA = 25ºC, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) 0.4 0.3 0.1 0.2 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6 Insertion Loss LINS (dB) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY INPUT–OUTPUT1 –10 –30 –20 –40 –50 Isolation ISL (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY INPUT–OUTPUT1 –10 –30 –20 –40 –50 Input Return Loss RLin (dB) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT1 –10 –30 –20 –40 –50 Isolation ISL (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY INPUT–OUTPUT2 –10 –30 –20 –40 –50 Input Return Loss RLin (dB) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT2 0.4 0.3 0.2 0.1 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6 Insertion Loss LINS (dB) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY INPUT–OUTPUT2

Remark The graphs indicate nominal characteristics. +40 +35 +30 +25 +20 +15 +10 +45 Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER f = 1.0 GHz –10 –30 –20 –40 –50 Output Return Loss RLout (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT1 –10 –30 –20 –40 –50 Output Return Loss RLout (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT2 –55 –60 –65 –70 –75 –80 –85 –50 –90 2nd Harmonics 2f0, 3rd Harmonics 3f0 (dBc) Input Power Pin (dBm) vs. INPUT POWER 2ND HARMONICS, 3RD HARMONICS f = 1.0 GHz 2f0 3f0

6-PIN SUPER MINIMOLD (UNIT: mm) 0.9±0.1 0.7 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 2.0±0.2 1.3 0.650.65 1.25±0.1 2.1±0.1 0.1 MIN.

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 02/19/2004

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Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZLead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and ac curate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.