UPG2009TB CEL | Alldatasheet

Document overview

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Technical content

  • Low insertion Loss: 0.25 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz 0.30 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz
  • HigH isoLation: 28 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz
  • power HanDLing: Pin (0.1dB) = 34 dBm TYP . @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz
  • BiDireCtionaL, sYMMetriCaL
  • 6-pin super MiniMoLD paCkage (2.0 × 1.25 × 0.9 mm) Features DesCription upg2009tB NEC's UPG2009TB is a L, S-band SPDT (Single Pole Double Throw) GaAs FET switch for digital cellu- lar or cordless telephone application. The device can operate from 500 MHz to 2.5 GHz, with low insertion loss and high isolation.

appLiCations

  • L-band digital cellular or cordless telephone
  • Bluetooth tM , w-Lan and wLL
  • short range wireless California Eastern Laboratories

orDering inForMation

part number package Marking supplying Form UPG2009TB-E3-A 6-pin super minimold G2U • Embossed tape 8 mm wide

  • Pin 1, 2, 3 face the perforation side of the tape
  • Qty 3 kpcs/reel remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2009TB-A Caution observe precautions when handling because these devices are sensitive to electrostatic discharge. neC's L, s-BanD HigH power spDt switCH

aBsoLute MaXiMuM ratings (TA = 25°C, unless otherwise specified) reCoMMenDeD operating range (TA = 25°C) pin no. pin name

1 OUT1

2 GND

3 OUT2

4 VCont2

6 VCont1

parameter symbol ratings unit Control Voltage 1, 2 Vcont1, 2 −6.0 to +6.0 note1 V Input Power Pin +36 dBm Total Power Dissipation Ptot 0.15 W Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C note | Vcont1 - Vcont2 | ≤ 6.0 V parameter symbol Min. tYp. MaX. unit Control Voltage (High) Vcont (H) +2.7 +2.8 +3.0 V Control Voltage (Low) Vcont (L) −0.2 0 +0.2 V (Top View)G2U 6 (Bottom View)

eLeCtriCaL CHaraCteristiCs

(TA = +25°C, Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = 2.8, Zo = 50 Ω, off chip DC blocking capacitors value; 56 pF, unless otherwise specified) note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. All other characteristics are measured in linear range. upg2009tB upg2009tB parameter symbol test Conditions Min. tYp. MaX. unit Insertion Loss LINS f = 0.5 to 1.0 GHz − 0.25 0.45 dB f = 2.0 GHz − 0.30 0.50 dB f = 2.5 GHz − 0.40 − dB Isolation ISL f = 0.5 to 2.0 GHz 24 28 − dB f = 2.5 GHz − 25 − dB Input Return Loss RLin f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RLout f = 0.5 to 2.5 GHz 15 20 − dB Input Power at 0.1 dB Compression Point note Pin(0.1 dB) f = 1.0 GHz, Vcont = 2.8 V/0 V 32.5 34 − dBm 2nd Harmonics 2f0 f = 1.0 GHz, Vcont = 2.8 V/0 V, Pin = 30.5 dBm 65 75 − dBc 3rd Harmonics 3f0 f = 1.0 GHz, Vcont = 2.8 V/0 V, Pin = 30.5 dBm 65 75 − dBc Switching Speed tSW − 150 − ns Control Current Icont Vcont = 2.8 V/0 V, RF Non − 1 50 μA Caution it is necessary to use DC blocking capacitors with the device. the value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switch- ing speed and the condition with actual board of your system. the range of recommended DC blocking capacitor value is less than 100 pF.

eVaLuation CirCuit (Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 2.8 V, off chip DC blocking capacitors value C1 = 56 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board) 4Vcont2 IN Vcont1 OUT2 OUT1 G2U eVaLuation BoarD 6pin SMM SPDT SW Vcont2 G2U OUT2 OUT1 Vcont1 IN NEC trutH taBLe Vcont1 Vcont2 IN−OUT1 IN−OUT2 Low High OFF ON High Low ON OFF

(TA = +25°C Vcont1/2 = 2.8 V/0 V, Pin = 0 dBm, OUT2 side is 50 Ω termination) Input Return Loss RLin (dB) Frequency f (GHz) -20 -40 INPUT RETURN LOSS vs. FREQUENCY START 0.500 000 000 GHz S TOP 3.000 000 000 GHz S11 log MAGCH1 10 dB/ REF 0 dB 2: -30.339 dB

1.5 GHz

1: -25.43 dB

1.0 GHz

3: -30.025 dB

2.0 GHz

4: -23.812 dB

2.5 GHz

5: -17.85 dB

3.0 GHz

Insertion Loss LINS (dB) Frequency f (GHz) -2.0 -4.0 INSERTION LOSS vs. FREQUENCY START 0.500 000 000 GHz S TOP 3.000 000 000 GHz S21 log MAGCH1 1 dB/ REF 0 dB 2: -0.744 dB 1: -0.620 dB 3: -0.881 dB 4: -1.057 dB 5: -1.302 dB Isolation ISL (dB) Frequency f (GHz) -20 -40 ISOLATION vs. FEQUENCY START 0.500 000 000 GHz STOP 3.000 000 000 GHz S21 log MAGCH1 10 dB/ REF 0 dB 2: -28.871 dB 1: -28.787 dB 3: -27.75 dB 4: -24.902 dB 5: -21.582 dB Output Return Loss RLout (dB) Frequency f (GHz) -20 -40 OUTPUT RETERN LOSS vs. FREQUENCY START 0.500 000 000 GHz STOP 3.000 000 000 GHz S22 log MAGCH1 10 dB/ REF 0 dB 2: -31.882 dB 1: -25.992 dB 3: -32.46 dB 4: -25.087 dB 5: -18.145 dB Caution these characteristics values include the losses of the neC evaluation board. remark The graphs indicate nominal characteristics.

(f = 2 GHz, OUT2 side is 50 Ω termination) Input Power Pin (dBm) Insersion Loss LINS (dB) 0.5 0.6 25 27 29 31 33 35 37 0.4 0.3 0.2 0.1 RELATION BETWEEN CONTROL VOLTAGE OF INSERSION LOSS Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 26 28 30 32 34 36 0.7 0.8 0.9 Input Power Pin (dBm) 2nd Harmonics 2f0 (dBc) 25 27 29 31 33 35 37 RELATION BETWEEN CONTROL VOLTAGE OF 2nd HARMONICS Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 26 28 30 32 34 36 Input Power Pin (dBm) 3rd Harmonics 3f0 (dBc) 25 27 29 31 33 35 37 Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 26 28 30 32 34 36 RELATION BETWEEN CONTROL VOLTAGE OF 3rd HARMONICS remark The graphs indicate nominal characteristics.

6-PIN SUPER MINIMOLD (UNIT: mm) 0.9±0.1 0.7 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 2.0±0.2 1.3 0.650.65 1.25±0.1 2.1±0.1 0.1 MIN.

reCoMMenDeD soLDering ConDitions This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering Method soldering Conditions Condition symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 02/14/2007 Caution Do not use different soldering methods together (except for partial heating).

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