UPG158TB CEL | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

FEATURES

NEC's ½W L, S-BAND SPDT SWITCH

DESCRIPTION

NEC's UPG158TB is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch developed for mobile phone and L, S-band applications. This device can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package. And this package is able to high-density surface mounting.

APPLICATIONS

  • L-band digital cellular or cordless telephone
  • PCS, W-LAN, WLL and BluetoothTM
  • Short Range Wireless California Eastern Laboratories

ORDERING INFORMATION

Remark To order evaluation samples, contact your nearby sales ofÞ ce. Part number for sample order: UPG158TB Caution Observe precautions when handling, because these devices are sensitive to electrostatic discharge.

  • SWITCH CONTROL VOLTAGE: Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.) V cont (L) = −0.2 to +0.2 V (0 V TYP.)
  • LOW INSERTION LOSS: L INS2 = 0.40 dB TYP. @ f = 2.0 GHz, Vcont = 3.0 V/0 V
  • HIGH ISOLATION: ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, V cont = 3.0 V/0 V ISL2 = 18 dB MIN. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
  • POWER HANDLING: Pin (1 dB) = +26.5 dBm TYP. @ f = 1.0 GHz, Vcont = 3.0 V/0 V
  • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) Part Number Package Marking Supplying Form UPG158TB-E3 6-pin super minimold G1M • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise speciÞ ed) RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise speciÞ ed) PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM TRUTH TABLE Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) V cont (H) 2.5 3.0 5.3 V Switch Control Voltage (L) V cont (L) −0.2 0 0.2 V (Top View) G1M1 (Top View) (Bottom View) Pin No. Pin Name

1 OUTPUT1

2 GND

3 OUTPUT2

5 INPUT

Parameter Symbol Ratings Unit Switch Control Voltage V cont −6.0 to +6.0 Note 1 V Input Power P in +28 dBm Power Dissipation P D 150 Note 2 mW Operating Ambient Temperature T A −45 to +85 °C Storage Temperature T stg −55 to +150 °C Notes 1. | Vcont1 − Vcont2 | ≤ 6.0 V 2. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C Vcont1 Vcont2 INPUT−OUTPUT1 INPUT −OUTPUT2 Low High ON OFF High Low OFF ON

ELECTRICAL CHARACTERISTICS

(TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise speciÞ ed) UPG158TB Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 L INS1 f = 0.5 to 1.0 GHz − 0.30 0.55 dB Insertion Loss 2 L INS2 f = 2.0 GHz − 0.40 0.65 dB Insertion Loss 3 L INS3 f = 2.0 to 2.5 GHz −− 0.90 dB Isolation 1 ISL1 f = 0.5 to 2.0 GHz 22 27 − dB Isolation 2 ISL2 f = 2.0 to 2.5 GHz 18 −− dB Input Return Loss 1 RL in1 f = 0.5 to 2.0 GHz 13 19 − dB Input Return Loss 2 RL in2 f = 2.0 to 2.5 GHz 11 −− dB Output Return Loss 1 RL out1 f = 0.5 to 2.0 GHz 13 19 − dB Output Return Loss 2 RL out2 f = 2.0 to 2.5 GHz 11 −− dB 1 dB Loss Compression Input Power Note Pin (1 dB) f = 1.0 GHz +22.0 +26.5 − dBm Switch Control Speed t SW − 50 200 ns Switch Control Current I cont − 0.5 10 A Note P in (1 dB) is measured the input power level when the insertion loss increases 1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise speciÞ ed) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 0.1 dB Loss Compression Input Power Note Pin (0.1 dB) f = 1.0 GHz − +23.0 − dBm Note P in (0.1 dB) is measured the input power level when the insertion loss increases 0.1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF.

(Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. OUTPUT2 OUTPUT1 Vcont2 INPUT V cont1 51 pF 51 pF 1 000 pF 1 000 pF 51 pF 456 321

USING THE NEC EVALUATION BOARD ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 6pin SMM SPDT SW Vc1 Vc2 IN OUT 1 OUT 2 C2C4 Vcont1 OUTPUT1 INPUT OUTPUT2 Vcont2 G1M Symbol Values C1, C2, C3 51 pF C4, C5 1 000 pF

(TA = +25°C, Vcont = 3.0 V/0 V, Pin = 0 dBm, unless otherwise speciÞ ed) UPG158TB 50 Ω OUT2 OUT1 IN 1: -0.574 dB

1 GHz

2: -0.662 dB

1.5 GHz

3: -0.795 dB

2 GHz

4: -1.111 dB

2.5 GHz

CH1 S21 log MAG 1 dB/ REF 0 dB START 0.300 000 000 GHz STOP 3.300 000 000 GHz Insertion Loss LINS (dB) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY IN-OUT1 1: -28.047 dB 2: -28.565 dB 3: -25.835 dB 4: -22.507 dB CH1 S21 log MAG 10 dB/ REF 0 dB START 0.300 000 000 GHz STOP 3.300 000 000 GHz -10 -20 -30 -40 Isolation ISL (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY IN-OUT1 1: -22.502 dB 2: -28.139 dB 3: -25.867 dB 4: -15.601 dB CH1 S22 log MAG 10 dB/ REF 0 dB START 0.300 000 000 GHz STOP 3.300 000 000 GHz -10 -20 -30 -40 Output Return Loss RLout (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY IN-OUT1 1: -23.433 dB 2: -30.102 dB 3: -25.504 dB 4: -16.018 dB CH1 S11 log MAG 10 dB/ REF 0 dB START 0.300 000 000 GHz STOP 3.300 000 000 GHz -10 -20 -30 -40 Input Return Loss RLin (dB) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY IN-OUT1 Caution Data includes loss of the test fi xture. Remark The graphs indicate nominal characteristics.

6-PIN SUPER MINIMOLD (UNIT: mm) 0.9±0.1 0.7 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 2.0±0.2 1.3 0.650.65 1.25±0.1 2.1±0.1 0.1 MIN.

RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales ofÞ ce. Soldering Method Soldering Conditions Condition Symbol Infrared Reß ow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of reß ow processes : 3 times Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) : 215 °C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reß ow processes : 3 times Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of ß ow processes : 1 time Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below HS350 Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 03/08/2004 Caution Do not use different soldering methods together (except for partial heating).