UPC8128TB

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 27

Technical content

DESCRIPTION

The μPC8178TK is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC can realize low current consumption with external chip inductor which can not be realized on internal 50 Ω wide band matched IC. μPC8178TK adopts 6-pin lead-less minimold package using same chip as the conventional μPC8178TB in 6-pin super minimold. TK suffix IC which is smaller package than TB suffix IC contributes to reduce mounting space by 50 %. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.

FEATURES

Low current consumption : ICC = 1.9 mA TYP. @ VCC = 3.0 V V : egatlov ylppuS • CC = 2.4 to 3.3 V
Excellent isolation : ISL = 40 dB TYP. @ f = 1.0 GHz zHG 9.1 = f @ .PYT Bd 14 = LSI zHG 4.2 = f @ .PYT Bd 24 = LSI G : niag rewoP • P = 11.0 dB TYP. @ f = 1.0 GHz G P = 11.0 dB TYP. @ f = 1.9 GHz G P = 11.0 dB TYP. @ f = 2.4 GHz
Gain 1 dB compression output power : PO (1 dB) = −5.5 dBm TYP. @ f = 1.0 GHz P O (1 dB) = −8.0 dBm TYP. @ f = 1.9 GHz P O (1 dB) = −8.0 dBm TYP. @ f = 2.4 GHz
Operating frequency : 0.1 to 2.4 GHz (Output port LC matching)
High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.3 × 0.55 mm) )eulav dradnatS( gm 3 : thgiew thgiL • APPLICAION
Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system DATA SHEET Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The informati on in this document is subject to change w ithout notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT μPC8178TK SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS Document No. PU10063EJ02V0DS (2nd edition) Date Published March 2005 CP(K) The mark shows major revised points.

ORDERING INFORMATION

Part Number Order Number Package Marking Supplying Form µPC8178TK-E2 µPC8178TK-E2-A 6-pin lead-less minimold (1511) (Pb-Free) Note 6B Embossed tape 8 mm wide Pin 1, 2, 3 face the perforation side of the tape Qty 5 kpcs/reel Note With regards to terminal solder (the solder contai ns lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPC8178TK PRODUCT LINE-UP (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω) Parameter 1.0 GHz output port matching frequency

1.66 GHz output port

1.9 GHz output port

2.4 GHz output port

Part No. ICC (mA) GP (dB) ISL (dB) PO(1dB) (dBm) GP (dB) ISL (dB) PO(1dB) (dBm) GP (dB) ISL (dB) PO(1dB) (dBm) GP (dB) ISL (dB) PO(1dB) (dBm) Remarks 1. Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2. To know the associated product, please refer to each latest data sheet. Data Sheet PU10063EJ02V0DS 2 µPC8178TK

SYSTEM APPLICATION EXAMPLE Location examples in digital cellular RX Low Noise Tr. SW TX ÷N PLL PLL I Q I Q DEMOD. 90˚PA φ These ICs can be added to your system around parts, when you need more isolat ion or gain. The application herein, however, shows only examples, therefore the application can depend on your kit evaluation. Data Sheet PU10063EJ02V0DS 3 µPC8178TK

Pin No. Pin Name

1 INPUT

2 GND

3 GND

4 OUTPUT

5 GND

(Top View) (Bottom View)

6 V CC

No. Pin Name Applied Voltage (V) Pin Voltage (V) Note Function and Applications Inte rnal Equivalent Circuit 1 INPUT − 0.90 Signal input pin. A internal matching circuit, configured with resisters, enables 50 Ω connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut. GND 0 − Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be con- nected together with wide ground pattern to decrease impedance defference.

4 OUTPUT Voltage

− Signal output pin. This pin is de- signed as collector output. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. For L, a size 1 005 chip inductor can be chosen. 6 V CC 2.4 to 3.3 − Power supply pin. This pin should be externally equipped with bypass capacitor to minimize its impedance. 3 5 Note Pin voltage is measured at V CC = 3.0 V. Data Sheet PU10063EJ02V0DS 4 µPC8178TK

Parameter Symbol Test Conditions Ratings Unit Supply Voltage V CC T A = +25°C, Pin 4, Pin 6 3.6 V Circuit Current I CC T A = +25°C 15 mA Power Dissipation P D T A = +85°C Note 232 mW Operating Ambient Temperature T A −40 to +85 °C Storage Temperature T stg −55 to +150 °C Input Power P in T A = +25°C +5 dBm Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Remarks Supply Voltage V CC 2.4 3.0 3.3 V The same voltage should be applied to pin 4 and pin 6. Operating Ambient Temperature T A −40 +25 +85 °C

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω, at LC matched frequency) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current I CC No signal 1.4 1.9 2.4 mA Power Gain G P f = 1.0 GHz, P in = −30 dBm f = 1.9 GHz, Pin = −30 dBm f = 2.4 GHz, Pin = −30 dBm 9.0 9.0 9.0 11.0 11.0 11.0 13.0 13.5 13.5 dB Isolation ISL f = 1.0 GHz, P in = −30 dBm f = 1.9 GHz, Pin = −30 dBm f = 2.4 GHz, Pin = −30 dBm 35.0 36.0 37.0 40.0 41.0 42.0 dB Gain 1 dB Compression Output Power PO(1 dB) f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz −8.0 −11.0 −11.5 −5.5 −8.0 −8.0 dBm Noise Figure NF f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz 5.5 5.5 5.5 7.0 7.0 7.0 dB Input Return Loss RL in f = 1.0 GHz, P in = −30 dBm f = 1.9 GHz, Pin = −30 dBm f = 2.4 GHz, Pin = −30 dBm 4.0 5.0 6.5 7.0 8.0 9.5 dB Data Sheet PU10063EJ02V0DS 5 µPC8178TK

<1> f = 1.0 GHz Strip Line : 5 mm IN OUT 2, 3, 5 1C1 C2 C3 Output port matching circuit DUT VCC Strip Line : 1 mm <2> f = 1.9 GHz IN OUT 2, 3, 5 1C1 C2 C3 Output port matching circuit C5 C4 DUT VCC Strip Line : 7 mm <3> f = 2.4 GHz IN OUT 2, 3, 5 1C1 C2 Output port matching circuit C4 C3 DUT VCC Strip Line : 3 mm Strip Line : 4 mm Data Sheet PU10063EJ02V0DS 6 µPC8178TK

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD <1> f = 1.0 GHz VCC OUT IN PC8178TKµ Top View Mounting direction VCC (∗1) 42 × 35 × 0.4 mm polyimide board, double-sided copper clad (∗2) Back side: GND pattern (∗3) Gold plated on pattern (∗4) { : Through holes COMPONENT LIST Form Symbol Value Type code Maker Chip capacitor C 1, C3 1 000 pF GRM40CH102J50PT murata C 2 0.75 pF GRM39CKR75C50PT murata C 4 20 pF GRM39CH200J50PT murata C 5 10 pF GRM39CH100D50PT murata Feed-though Capacitor C 6 1 000 pF DFT301-801 × 7R102S50 murata Chip inductor L 1 12 nH LL1608-FH12N TOKO Data Sheet PU10063EJ02V0DS 7 µPC8178TK

<2> f = 1.9 GHz VCC C4 C6 C2 C3 OUT IN PC8178TKµ Top View Mounting direction VCC (∗1) 42 × 35 × 0.4 mm polyimide board, double-sided copper clad (∗2) Back side: GND pattern (∗3) Gold plated on pattern (∗4) { : Through holes COMPONENT LIST Form Symbol Value Type code Maker Chip capacitor C 1, C3, C5, C6 1 000 pF GRM40CH102J50PT murata C 2 0.5 pF GRM39CKR5C50PT murata C 4 8 pF GRM39CH080D50PT murata Feed-though Capacitor C 7 1 000 pF DFT301-801 × 7R102S50 murata Chip inductor L 1 2.7 nH LL1608-FH2N7S TOKO Data Sheet PU10063EJ02V0DS 8 µPC8178TK

<3> f = 2.4 GHz VCC OUT IN PC8178TKµ Top View Mounting direction VCC (∗1) 42 × 35 × 0.4 mm polyimide board, double-sided copper clad (∗2) Back side: GND pattern (∗3) Gold plated on pattern (∗4) { : Through holes COMPONENT LIST Form Symbol Value Type code Maker Chip capacitor C 1, C2, C4, C5 1 000 pF GRM40CH102J50PT murata C 3 10 pF GRM39CH100D50PT murata Feed-though Capacitor C 6 1 000 pF DFT301-801 × 7R102S50 murata Chip inductor L 1 2.7 nH LL1608-FH2N7S TOKO L 2 1.8 nH LL1608-FH1N8S TOKO Data Sheet PU10063EJ02V0DS 9 µPC8178TK

TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) 0.5 0.5 1.0 1.0 1.5 1.5 2.0 2.0 2.5 2.5 3.0 3.0 3.5 4.0 –40°C TA = +25°C +50°C +85°C –20°C Circuit Current ICC (mA) CIRCUIT CURRENT vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Remark The graph indicates nominal characteristics. Data Sheet PU10063EJ02V0DS 10 µPC8178TK

f = 1.0 GHz MATCHING –10 –12 –14 –16 –18 –20 –10 –12 –14 –16 –18 START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz S21-FREQUENCY S22-FREQUENCY S21 log MAG 2 dB/ REF 0 dB 1 : 11.235 dB S11 log MAG 2 dB/ REF 0 dB 1 : –6.9156 dB S22 log MAG 2 dB/ REF 0 dB 1 : –16.86 dB 1: 63.219 Ω –64.27 Ω 2.4764 pF 1: 54.049 Ω –12.43 Ω 12.804 pF 3.0 V 2.4 V 2.7 V VCC = 3.3 V 3.3 V 3.0 V VCC = 2.4 V 2.7 V VCC = 2.4 V 2.7 V 3.0 V 3.3 V MARKER 1

1.0 GHz

Pin = −30 dBm, MARKER 1 f = 1.0 GHz VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm Pin = –30 dBm, MARKER 1 f = 1.0 GHz Pin = −30 dBm, MARKER 1 f = 1.0 GHz –20 S11-FREQUENCY S22-FREQUENCY S11-FREQUENCY S12-FREQUENCY –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 START 100.000 000 MHz STOP 3 100.000 000 MHz S12 log MAG 5 dB/ REF –20 dB 1 : –40.104 dB Pin = −30 dBm, MARKER 1 f = 1.0 GHz –70 VCC = 2.4 V 2.7 V 3.0 V 3.3 V Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 11 µPC8178TK

START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz TA = –40°C +25°C +85°C TA = –40°C +25°C +85°C –10 –12 –14 –16 –18 –20 –10 –12 –14 –16 –18 –20 TA = –40°C +25°C +85°C S21-FREQUENCY S11-FREQUENCY S12-FREQUENCY S22-FREQUENCY S21 log MAG 2 dB/ REF 0 dB 1 : 11.053 dB S22 log MAG 2 dB/ REF 0 dB 1 : –13.758 dB S11 log MAG 2 dB/ REF 0 dB 1 : –6.8297 dB Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz START 100.000 000 MHz STOP 3 100.000 000 MHz TA = –40°C –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 S12 log MAG 5 dB/ REF –20 dB 1 : –39.127 dB Pin = −30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz +85°C +25°C Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 12 µPC8178TK

VCC = 3.3 V 3.0 V 2.4 V 2.7 V –10 –15 –20 –25 –30 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –80 –10 –20 –30 –10 –15 –20 –25 –3001 0–10–20 –30 –30 –40 –50 –60 –70 –80 –10 –20 –30 –30 –40 –50 –60 –70 –80 –10 –20 –300–10–20 0–10–20 01 0–10–20 +25°C TA = –40°C +85°C OIP3 = 5.0 dBm OIP3 = 4.2 dBm OIP3 = 5.3 dBm 0–10–20 –30 0–10–20 IM3 (des) Pout (des) Pout (undes) IM3 (undes) Pout (des) Pout (undes) IM3 (des) IM3 (undes) IM3 (des) IM3 (undes) Pout (des) Pout (undes) Pout (des) Pout (undes) IM3 (des) VCC = 3.0 V f = 1.0 GHz OIP3 = 3.5 dBm VCC = 2.4 V f1 = 1 000 MHz f2 = 1 001 MHz VCC = 3.3 V f1 = 1 000 MHz f2 = 1 001 MHz IM3 (undes) VCC = 3.0 V f1 = 1 000 MHz f2 = 1 001 MHz VCC = 2.7 V f1 = 1 000 MHz f2 = 1 001 MHz f = 1.0 GHz Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 13 µPC8178TK

–30 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –80 –10 –20 –30 –30 –40 –50 –60 –70 –80 –10 –20 –30 6.5 5.5 4.5 2 2.5 3 3.5 4 IM 3 (undes) Pout (undes) Pout (des) IM3 (des) IM3 (des) IM3 (undes) Pout (undes) Pout (des) Pout (undes) Pout (des) IM3 (des) IM3 (undes) 2.4 V 2.7 V VCC = 3.0 V 3.3 V OIP3 = 5.0 dBm f = 1.0 GHz –40°C TA = +85°C VCC = 3.0 V f1 = 1 000 MHz f2 = 1 001 MHz OIP3 = 3.0 dBm VCC = 3.0 V TA = –40°C f1 = 1 000 MHz f2 = 1 001 MHz OIP3 = 5.0 dBm VCC = 3.0 V TA = +85°C f1 = 1 000 MHz f2 = 1 001 MHz f1 = 1 000 MHz f2 = 1 001 MHz +25°C Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE Output Power of Each Tone Pout (each) (dBm) Noise Figure NF (dB) NOISE FIGURE vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 14 µPC8178TK

f = 1.9 GHz MATCHING VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz 1: 33.535 Ω –44.393 Ω 1.8869 pF MARKER 1

1.9 GHz

1: 43.529 Ω –16.648 Ω 5.0314 pF START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz S21 log MAG 2 dB/ REF 0 dB 1 : 11.5 dB S22 log MAG 2 dB/ REF 0 dB 1 : –15.578 dB S11 log MAG 2 dB/ REF 0 dB 1 : –8.4012 dB 2.4 V 3.3 V VCC = 3.0 V 2.7 V –10 –12 –14 –16 –18 –20 VCC = 2.4 V 3.3 V 3.0 V 2.7 V START 100.000 000 MHz STOP 3 100.000 000 MHz –10 –12 –14 –16 –18 –20 VCC = 2.4 V 2.7 V 3.0 V 3.3 V S11-FREQUENCY S 22-FREQUENCY S21-FREQUENCY S11-FREQUENCY S12-FREQUENCY S22-FREQUENCY VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm Pin = –30 dBm, MARKER 1 f = 1.9 GHz Pin = –30 dBm, MARKER 1 f = 1.9 GHz Pin = –30 dBm, MARKER 1 f = 1.9 GHz S12 log MAG 5 dB/ REF –20 dB 1 : –41.705 dB START 100.000 000 MHz STOP 3 100.000 000 MHz –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 P in = −30 dBm, MARKER 1 f = 1.9 GHz VCC = 2.4 V 2.7 V 3.0 V 3.3 V Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 15 µPC8178TK

START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz –10 –12 –14 –16 –18 –20 S21 log MAG 2 dB/ REF 0 dB 1 : 11.553 dB S11 log MAG 2 dB/ REF 0 dB 1 : –8.2405 dB TA = –40°C TA = –40°C +25°C +85°C +85°C +25°C TA = –40°C +25°C +85°C START 100.000 000 MHz STOP 3 100.000 000 MHz −10 −12 −14 −16 −18 −20 S22 log MAG 2 dB/ REF 0 dB 1 : –14.437 dB S21-FREQUENCY S11-FREQUENCY S12-FREQUENCY S22-FREQUENCY Pin = −30 dBm, VCC = 3.0 V MARKER 1 f = 1.9 GHz Pin = –30 dBm, VCC = 3.0 V, MARKER 1 f = 1.9 GHz START 100.000 000 MHz STOP 3 100.000 000 MHz –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 S12 log MAG 5 dB/ REF −20 dB 1 : –40.84 dB Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 1.9 GHz TA = –40°C +85°C +25°C Pin = −30 dBm, VCC = 3.0 V MARKER 1 f = 1.9 GHz Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 16 µPC8178TK

–30 0 10–10–20 0 10–10–20 –10 –15 –20 –25 –30 –10 –15 –20 –25 VCC = 3.3 V 2.4 V 2.7 V 3.0 V TA = –40°C +25°C +85°C –30 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –10 –20 –30 OIP3 = 2.3 dBm OIP3 = 1.6 dBm OIP3 = 2.5 dBm OIP3 = 0.8 dBm Pout (undes) Pout (des) Pout (undes) Pout (undes) Pout (undes) Pout (des) Pout (des) 0–10–20 –80 –30 0–10–20 –30 –30 –40 –50 –60 –70 –80 –10 –20 –30 0–10–20 0–10–20 IM3 (undes) IM3 (des) IM3 (undes) IM3 (undes) Pout (des) IM3 (des) IM3 (undes) IM3 (des) IM3 (des) f = 1.9 GHz f = 1.9 GHz, VCC = 3.0 V VCC = 3.0 V f1 = 1 900 MHz f2 = 1 901 MHz VCC = 2.4 V f1 = 1 900 MHz f2 = 1 901 MHz VCC = 2.7 V f1 = 1 900 MHz f2 = 1 901 MHz VCC = 3.3 V f1 = 1 900 MHz f2 = 1 901 MHz Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 17 µPC8178TK

–30 –40 –50 –60 –70 –80 –10 –20 –30 –30 –40 –50 –60 –70 –80 –10 –20 –30 –30 –40 –50 –60 –70 –80 –10 –20 –30 0–10–200–10–20 0–10–20 IM3 (undes) IM3 (des) OIP3 = 2.3 dBm OIP3 = 2.3 dBm Pout (undes) Pout (des) Pout (undes) Pout (des) IM3 (undes) IM3 (des) IM3 (undes) IM3 (des) Pout (des) Pout (undes) VCC = 3.0 V 3.3 V 2.4 V 2.7 V f1 = 1 900 MHz f2 = 1 901 MHz OIP3 = 2.1 dBm VCC = 3.0 V f1 = 1 900 MHz f2 = 1 901 MHz VCC = 3.0 V TA = –40°C f1 = 1 900 MHz f2 = 1 901 MHz VCC = 3.0 V TA = +85˚C f1 = 1 900 MHz f2 = 1 901 MHz Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE Output Power of Each Tone Pout (each) (dBm) 6.5 5.5 4.5 2 2.5 3 3.5 4 TA = +85°C –40°C +25°C f = 1.9 GHz Noise Figure NF (dB) NOISE FIGURE vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 18 µPC8178TK

f = 2.4 GHz MATCHING START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz MARKER 1

2.4 GHz

1: 26.945 Ω –32.572 Ω 2.0359 pF 1: 47.047 Ω 13.205 Ω 875.69 pH S21 log MAG 2 dB/ REF 0 dB 1 : 11.623 dB S11 log MAG 2 dB/ REF 0 dB 1 : –10.022 dB VCC = 3.3 V 2.4 V 3.0 V 2.7 V S22 log MAG 2 dB/ REF 0 dB 1 : –16.424 dB –10 –12 –14 –16 –18 –10 –12 –14 –16 –18 –20 VCC = 2.4 V 2.7 V 3.3 V 3.0 V S11-FREQUENCY S22-FREQUENCY S21-FREQUENCY S12-FREQUENCYS11-FREQUENCY S22-FREQUENCY VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm Pin = –30 dBm, MARKER 1 f = 2.4 GHz Pin = –30 dBm, MARKER 1 f = 2.4 GHz –20 VCC = 2.4 V 2.7 V 3.0 V 3.3 V Pin = –30 dBm, MARKER 1 f = 2.4 GHz START 100.000 000 MHz STOP 3 100.000 000 MHz S12 log MAG 5 dB/ REF –20 dB 1 : –41.967 dB –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 Pin = –30 dBm, MARKER 1 f = 2.4 GHz VCC = 2.4 V 2.7 V 3.0 V 3.3 V VCC = 2.4 V 2.7 V 3.0 V 3.3 V Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 19 µPC8178TK

S11-FREQUENCY S12-FREQUENCY S22-FREQUENCY S11 log MAG 2 dB/ REF 0 dB 1 : –10.156 dB START 100.000 000 MHz STOP 3 100.000 000 MHz TA = –40°C +25°C +85°C START 100.000 000 MHz STOP 3 100.000 000 MHz –10 –12 –14 –16 –18 –20 –10 –12 –14 –16 –18 –20 S 22 log MAG 2 dB/ REF 0 dB 1 : –12.302 dB –40°C TA = +85°C +25°C Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz S21-FREQUENCY S21 log MAG 2 dB/ REF 0 dB 1 : 10.851 dB START 100.000 000 MHz STOP 3 100.000 000 MHz TA = –40°C +25°C +85°C Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz START 100.000 000 MHz STOP 3 100.000 000 MHz –20 –25 –30 –35 –40 –45 –50 –55 –60 –65 –70 S12 log MAG 5 dB/ REF –20 dB 1 : –39.14 dB Pin = –30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz +85°C TA = –40°C +25°C Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 20 µPC8178TK

–30 –10 –15 –20 –25 –10 –15 –20 –25 01 0–10–20 –30 01 0–10–20 VCC = 3.0 V 3.3 V 2.7 V 2.4 V f = 2.4 GHz TA = +85°C –40°C +25°C –20 –30 –30 –20 –10 0 –30 –20 –10 0 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –80 –10 –30 –20 –30 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –80 –10 OIP3 = 2.1 dBm OIP3 = 1.4 dBm OIP3 = 2.6 dBm OIP3 = 1.0 dBm –20 –10 0 –30 –20 –10 0 IM3 (des) IM3 (des) IM3 (undes) IM3 (undes) Pout (des) Pout (des) Pout (undes) Pout (undes) Pout (undes) IM3 (des) IM3 (undes) Pout (undes) Pout (des) Pout (des) IM3 (des) IM3 (undes) f = 2.4 GHz, VCC = 3.0 V VCC = 3.0 V f1 = 2 400 MHz f2 = 2 401 MHz VCC = 2.4 V f1 = 2 400 MHz f2 = 2 401 MHz VCC = 2.7 V f1 = 2 400 MHz f2 = 2 401 MHz VCC = 3.3 V f1 = 2 400 MHz f2 = 2 401 MHz Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 21 µPC8178TK

–30 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –80 –10 –20 –30 –40 –50 –60 –70 –80 –10 –20 –30 0–10–20 –30 0–10–20 –30 0–10–20 Pout (undes) Pout (des) IM3 (des) IM3 (undes) OIP3 = 2.1 dBm OIP3 = 1.1 dBm IM3 (des) IM3 (undes) Pout (undes) Pout (des) IM3 (des) IM3 (undes) Pout (undes) Pout (des) OIP3 = 2.2 dBm 6.5 5.5 4.5 42 2.5 3 3.5 4 +25°C TA = +85°C –40°C f = 2.4 GHz VCC = 3.0 V f1 = 2 400 MHz f2 = 2 401 MHz VCC = 3.0 V TA = –40°C f1 = 2 400 MHz f2 = 2 401 MHz VCC = 3.0 V TA = +85°C f1 = 2 400 MHz f2 = 2 401 MHz Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE Output Power of Each Tone Pout (each) (dBm) Noise Figure NF (dB) NOISE FIGURE vs. SUPPLY VOLTAGE Supply Voltage VCC (V) 2.4 V 2.7 V VCC = 3.0 V 3.3 V f1 = 2 400 MHz f2 = 2 401 MHz Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 22 µPC8178TK

f = 3.0 GHz MATCHING 424 3 2 1: 67.34 Ω –63.512 Ω

1 GHz

2: 34.416 Ω –46.209 Ω 3: 27.732 Ω –34.887 Ω 4: 24.257 Ω –25.16 Ω 2.1086 pF START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz STOP 3 100.000 000 MHz MARKER 4

3 GHz

1: 100.98 Ω –350.69 Ω 2: 61.047 Ω –216.37 Ω 3: 45.648 Ω –180.84 Ω 4: 29.031 Ω –149.79 Ω 354.18 fF S11-FREQUENCY S 22-FREQUENCY VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm, TA = +25°C (at L loaded) VCC = 3.0 V, ICC = 2.11 mA Pin = –30 dBm, TA = +25°C (at L loaded) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 23 µPC8178TK

6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 0.48±0.050.48±0.05 1.5±0.1 1.3±0.05 1.1±0.1 0.55±0.03 0.11+0.1 –0.05 0.16±0.05 0.9±0.10.2±0.1 (Bottom View)(Top View) Data Sheet PU10063EJ02V0DS 24 µPC8178TK

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to mi nimize ground impedance (to prev ent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to V CC line. (4) The inductor (L) should be attached between output and V CC pins. The L and series capacitor (C) values should be adjusted for applied frequency to match impedance to next stage. (5) The DC capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120 ±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperatur e (terminal temperature) : 350 °C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating). Data Sheet PU10063EJ02V0DS 25 µPC8178TK

When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. M8E 00. 4 - 0110 The information in this document is current as of March, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). Data Sheet PU10063EJ02V0DS 26 µPC8178TK

NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 For further information, please contact µPC8178TK

Summary

SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS

Description