UPC3237TK CEL | Alldatasheet

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Technical content

DESCRIPTION

The PC3237TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for the mobile digital TV etc. This device exhibits low noise figure and high power gain characteristics. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our UHS 2 (Ultra High Sp eed Process) Si Ge b ip o lar p rocess.

FEATURES

  • S u p p l y v o l t a g e : V CC = 2.4 t o 3.3 V (2.8 V TYP.)
  • Low current consumpt ion : I CC =5m AT Y P .@ VCC =2 . 8V
  • L o w n o i s e : N F = 1 . 4 d B T Y P . @ f = 4 7 0 M H z NF = 1.5 dB TYP. @ f = 770 MHz
  • P o w e r g a i n : G P = 15.3 dB TYP. @ f = 470 MHz G P = 13.5 dB TYP. @ f = 770 MHz
  • High-density surface mounting : 6-pin lead-less minimold package (1.5 1.1 0.55 mm) APPLICATION
  • Low noise amplifier forthe mobile digital T V etc.

ORDERING INFORMATION

P art Number Order Number P ackage Marking S upplying Form PC3237TK-E 2 PC3237TK-E 2-A 6-pin lead-less minimold (1511 PKG) (Pb-Free) 6N • 8 mm wide embossed taping

  • P in 1, 6 face the perforation s ide of the tape
  • Qty 5 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC3237TK-A PRELIMINARY PRODUCT INFORMATION BIPOLAR ANALOG INTEGRATED CIRCUIT PC3237TK LOW NOISE WIDE BAND SILICON GERMANIUM MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS Document No. ( WK edition) Date Published May 2007 NS CP(N) NEC Electronics Corporation 2007 The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Caution Observe precautions when handling because these devices are sensitive to electrostaic discharge.

Pi n No . Pi n Nam e 1N C 2G N D 3I N P U T 4V CC 5G N D 6O U T P U T ABSOLUTE MAXIMUM RATINGS P arameter S ymbol T es t C onditions R atings Unit S upply V oltage V CC T A =+ 2 5C3 . 6 V C ircuit C urrent I CC T A =+ 2 5C1 0 m A Po w er Di ssi pat io n P D T A =+ 8 5 ° C Note 203 mW Operating Ambient T emperature T A 40 to +85 C S torage T emperature T st g 55 to +150 C Input P ower P in +8 dB m Note Mounted on double-side copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Pa r am e t e r Sy m b o l M I N. TYP. M AX. Un i t S upply V oltage V CC 2.4 2.8 3.3 V Operating Ambient T emperature T A 40 +25 +85 C PC3237TK ( Top View ) ( Bottom View ) ( Top View ) 㻧㻶 ( Top View ) ( Bottom View ) ( Top View ) 㻧㻶 6N㻧㻶 㻧㻶

ELECTRICAL CHARACTERISTICS

(T A =+ 2 5C, VCC =2 . 8V ,ZS =Z L=5 0Ȑ, unless otherwise specified ) P arameter S ymbol T es t C onditions MIN. T Y P . MAX. Unit C ircuit C urrent I CC No Signal 3.5 5 7 mA G P 1 f = 470MHz, Pin = 㸢30 dBm 13.0 15.3 17.5 dBPo w e r Gai n G P 2 f = 770MHz, Pin = 㸢30 dBm 11.0 13.5 16.0 dB NF1 f = 470MHz 㸢 1.4 1.9 dBNo i se Figure NF2 f = 770MHz 㸢 1.5 2.0 dB RL in1 f = 470MHz, Pin = 㸢30 dBm 6.5 9.5 㸢 dBInput R eturn Loss RL in2 f = 770MHz, Pin = 㸢30 dBm 5.5 8.5 㸢 dB RL out1 f = 470MHz, Pin = 㸢30 dBm 91 4 㸢 dBOut putRet urn Lo ss RL out2 f = 770MHz, Pin = 㸢30 dBm 10 15 㸢 dB IS L1 f = 470MHz, Pin = 㸢30 dBm 17 22 㸢 dBIsolation IS L2 f = 770MHz, Pin = 㸢30 dBm 16 21 㸢 dB P O( 1d B )1 f = 470MHz 㸢8 㸢5.5 㸢 dB mG ain 1 dB C ompres s ion Output Po w e r P O( 1d B )2 f = 770MHz 㸢8 㸢5.5 㸢 dB m TEST CIRCUIT COMPONENTS LIST Sy m b o l Ty p e Val u e C1, C2 Chip Capacitor 100pF C3 Chip Capacitor 1000pF C4 Feed-through Capacitor 1000pF PC3237TK 50䂿 50䂿 INPUT OUTPUT VCC 䕸 䕵 50䂿 50䂿 INPUT OUTPUT VCC 䕸 䕵 䕸 䕵 䕸 䕵

STANDARD CHARACTERISTICS FOR REFERENCE (T A =㸠25 C, VCC =2 . 8V ,ZS =Z L =5 0Ȑ, unless otherwise specified ) P arameter S ymbol T est C onditions R eference Unit P O( s a t )1 f = 470MHz, P in = 2 dB m 1.3 dB mS aturated O utput P ower P O( s a t )2 f = 770MHz, P in = 2 dB m 1.3 dB m IIP 3 1 f1=470MHz, f2=471MHz 㸢10.5 dB mInput 3rd Order Distortion Intercept P oint IIP 3 2 f1=770MHz, f2=771MHz 㸢9.5 dB m OIP 3 1 f1=470MHz, f2=471MHz 4.8 dB mOut put 3rd Order Di st o rt ion Intercept P oint OIP 3 2 f1=770MHz, f2=771MHz 4.0 dB m K 1 f = 470MHz 1.15 㸢Kf a c t o r K 2 f = 770MHz 1.20 㸢 PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) PC3237TK

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals mus t be connected together with wide ground pattern to decreas e impedance difference. (3) T he bypas s capacitor should be attached to VCC line. (4) T he DC cut capacitor s hould be attached to Input and Output pin. (5) P in 1 (NC ) s hould be connected to the ground pattern. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. F or soldering methods and conditions other than those recommended below, contact your nearby sales office. S oldering Method S oldering C onditions C ondition S ymbol Infrared R eflow Peak temperat ure (package surface temperat ure) : 260 Co r b e l o w Time at peak temperature : 10 seconds or less Time at temperat ure of 220 C o rh i g h e r :6 0s e c o n d so rl e s s Pre heat i n g t i m e at120 t o 180C: 1 2 0 30 seconds Maximum number of reflow process es : 3 times Maximu m ch lo rine co nt en t o f ro si n fl ux (% mass) : 0.2%(Wt .) o r belo w IR 260W ave S oldering P eak temperature (molten solder temperature) : 260 Co r b e l o w Time at peak temperature : 10 seconds or less P reheating temperature (pac kage s urfac e temperature) : 120 Co r b e l o w Maximum number of flow process es : 1 time Maximu m ch lo rine co nt en t o f ro si n fl ux (% mass) : 0.2%(Wt .) o r belo w W S 260 P artial H eating P eak temperature (terminal temperature) : 350 Co r b e l o w S oldering time (per s ide of device) : 3 s econds or les s Maximu m ch lo rine co nt en t o f ro si n fl ux (% mass) : 0.2%(Wt .) o r belo w HS350 Caution Do not use different soldering methods together (except for partial heating). PC3237TK

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