UPC3231GV_13 CEL | Alldatasheet
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Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge GENERAL PURPOSE 5 V 100 MHz AGC AMPLIFIER BIPOLAR ANALOG INTEGRATED CIRCUIT PC3231GV Document No. PU10658EJ01V0DS (1st edition) Date Published May 2007 NS CP(N)
DESCRIPTION
The PC3231GV is a silicon monolithic IC designed for use as AGC amplifier for digital CATV, cable modem and digital terrestrial systems. This IC consists of gain control amplifier and video amplifier. The package is 8-pin SSOP (Shrink Small Outline Package) suitable for surface mount. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses silicon nitride passivation film. Th is material can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
- Low distortion : IM3 = 53.5 dBc TYP. @ single-ended output, Vout = 105 dBV (0.5 Vp-p) /tone
- Low noise figure : NF = 5.0 dB TYP. @ maximum gain
- Wide AGC dynamic range : GCRin = 61 dB TYP. @ input prescribe
- On-chip video amplifier : Vout = 1.0 Vp-p TYP. @ single-ended output
- Supply voltage : VCC = 5.0 V TYP.
- Packaged in 8-pin SSOP suitable for surface mounting APPLICATION
- Digital terrestrial TV/Digital CATV/Cable modem receivers
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form PC3231GV-E1 PC3231GV-E1-A 8-pin plastic SSOP (4.45 mm (175)) (Pb-Free) 3231 Embossed tape 8 mm wide Pin 1 indicates pull-out direction of tape Qty 1 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC3231GV-A
Data Sheet PU10658EJ01V0DS 2 PC3231GV INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS PRODUCT LINE-UP OF 5 V AGC AMPLIFIER Part Number ICC (mA) GMAX (dB) GMIN (dB) GCR (dB) NF (dB) IM3 (dBc) Package PC3217GV 23 53 0 53 6.5 50 Note1 8-pin SSOP (4.45 mm (175)) PC3218GV 23 63 10 53 3.5 50 Note1 PC3219GV 36.5 42.5 0 42.5 9.0 58 Note1 PC3221GV 33 60 10 50 4.2 56 Note1 PC3231GV 36 65 4 61 5.0 53.5 Note2 Notes 1. f1 = 44 MHz, f2 = 45 MHz, Vout = 0.7 Vp-p/tone, single-ended output 2. f1 = 44 MHz, f2 = 45 MHz, Vout = 0.5 Vp-p/tone, single-ended output
Data Sheet PU10658EJ01V0DS 3 PC3231GV PIN EXPLANATIONS Pin No. Pin Name Applied Voltage (V) Pin Voltage (V) Note Function and Application Internal Equivalent Circuit 1 VCC 4.5 to 5.5 Power supply pin. This pin should be externally equipped with bypass capacitor to minimize ground impedance. 2 INPUT1 1.32 Signal input pins to AGC amplifier. This pin should be coupled with capacitor for DC cut. 3 INPUT2 1.32 4 VAGC 0 to VCC Gain control pin. This pin ’s bias govern the AGC output level. Minimum Gain at VAGC : 0 to 0.1 V Maximum Gain at VAGC : 2.7 to 3.3 V Recommended to use AGC voltage with externally resister (example: 1 k). 5 GND2 0 Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. 6 OUTPUT2 1.91 Signal output pins of video amplifier. This pin should be coupled with capacitor for DC cut. 7 OUTPUT1 1.91 8 GND1 0 Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All ground pins must be connected together with wide ground pattern to decrease impedance difference. Note Pin voltage is measured at VCC = 5.0 V.
Data Sheet PU10658EJ01V0DS 4 PC3231GV ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC TA = +25C 6.0 V Gain Control Voltage Range VAGC TA = +25C 0 to VCC V Power Dissipation PD TA = +85C Note 250 mW Storage Temperature Tstg 55 to +150 C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA VCC = 4.5 to 5.5 V 40 +25 +85 C Gain Control Voltage Range VAGC 0 3.3 V Operating Frequency Range fBW 30 90 MHz
Data Sheet PU10658EJ01V0DS 5 PC3231GV
ELECTRICAL CHARACTERISTICS
(TA = +25C, VCC = 5 V, f = 45 MHz, ZS = 50 , ZL = 250 , single-ended output) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit DC Characteristics Circuit Current ICC VCC = 5 V, No input signal Note 1 28 36 44 mA AGC Voltage High Level VAGC (H) @ Maximum gain Note 1 2.7 3.3 V AGC Voltage Low Level VAGC (L) @ Minimum gain Note 1 0 0.1 V RF Characteristics IF Input Voltage Range fIFin fC = 3 dB Note 1 30 90 MHz Maximum Voltage Gain GMAX VAGC = 2.7 V, Pin = 60 dBm Note 1 62.5 65 67.5 dB Minimum Voltage Gain GMIN VAGC = 0.1 V, Pin = 30 dBm Note 1 0 4 7 dB Gain Control Range (input prescribe) GCRin VAGC = 0.1 to 2.7 V Note 1 55.5 61 dB Gain Control Range (output prescribe) GCRout Vout = 1.0 Vp-p Note 1 45 55 dB Output Voltage Vout Pin = 61 to 6 dBm Note 1 1.0 Vp-p Maximum Output Voltage Voclip VAGC = 3.0 V Note 1 2.0 3.3 Vp-p Noise Figure NF VAGC = 3.0 V Note 2 5.0 6.5 dB 3rd Order Intermodulation Distortion IM3 f1 = 44 MHz, f2 = 45 MHz, Pin = 20 dBm/tone, Vout = 105 dBV (0.5 Vp-p) /tone Note 1 50 53.5 dBc Input Impedance Zin VAGC = 0 V Note 3 1.35//6 k//pF Notes 1. By measurement circuit 1 2. By measurement circuit 2 3. By measurement circuit 3
Data Sheet PU10658EJ01V0DS 6 PC3231GV MEASUREMENT CIRCUIT 1 Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type) MEASUREMENT CIRCUIT 2 Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type)
Data Sheet PU10658EJ01V0DS 7 PC3231GV MEASUREMENT CIRCUIT 3 MEASUREMENT CIRCUIT 4 (PRESSURE IMPROVEMENT RECOMMENDATION CIRCUIT) Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type)
Data Sheet PU10658EJ01V0DS 8 PC3231GV MEASUREMENT CIRCUIT 5 (PRESSURE IMPROVEMENT RECOMMENDATION CIRCUIT) Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type) MEASUREMENT CIRCUIT 6 (PRESSURE IMPROVEMENT RECOMMENDATION CIRCUIT) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10658EJ01V0DS 9 PC3231GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD (MEASUREMENT CIRCUIT 1) Note Balun Transformer Remarks 1. Back side: GND pattern 2. Au plated on pattern : Through hole
Data Sheet PU10658EJ01V0DS 10 PC3231GV TYPICAL CHARACTERISTICS (TA = +25C , unless otherwise specified) Remark The graphs indicate nominal characteristics.
Data Sheet PU10658EJ01V0DS 11 PC3231GV Remark The graphs indicate nominal characteristics.
Data Sheet PU10658EJ01V0DS 12 PC3231GV Remark The graphs indicate nominal characteristics.
Data Sheet PU10658EJ01V0DS 13 PC3231GV Remark The graphs indicate nominal characteristics.
Data Sheet PU10658EJ01V0DS 14 PC3231GV S-PARAMETERS (TA = +25C, VCC = 5.0 V, VAGC = 0 V) S11FREQUENCY S22FREQUENCY
Data Sheet PU10658EJ01V0DS 15 PC3231GV PACKAGE DIMENSIONS 8-PIN PLASTIC SSOP (4.45 mm (175)) (UNIT: mm)
16 Data Sheet PU10658EJ01V0DS
PC3231GV NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating).