UPC3227TB CEL | Alldatasheet

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Technical content

DESCRIPTION

PC3227TB is a silicon germanium (SiGe) monolithic integrated circuit designed as IF amplifier for DBS tuners. This IC is manufactured using our 50 GHz fmax UHS2 (UltraH ighS peed Process) SiGe bipolar process.

FEATURES

  • Low current : ICC = 4.8 mA TYP. @ VCC = 5.0 V
  • Output power : PO (sat) = 1.0 dBm TYP. @ f = 1.0 GHz : PO (sat) = 3.5 dBm TYP. @ f = 2.2 GHz
  • High linearity : PO (1dB) = 6.5 dBm TYP. @ f = 1.0 GHz : PO (1dB) = 8.0 dBm TYP. @ f = 2.2 GHz
  • Power gain : GP = 22.0 dB TYP. @ f = 1.0 GHz : GP = 22.0 dB TYP. @ f = 2.2 GHz
  • Noise Figure : NF = 4.7 dB TYP. @ f = 1.0 GHz : NF = 4.6 dB TYP. @ f = 2.2 GHz
  • Supply voltage : VCC = 4.5 to 5.5 V
  • Port impedance : input/output 50

APPLICATIONS

  • IF amplifiers in LNB for DBS converters etc.

ORDERING INFORMATION

Part Number Order Number Package Marking Supplying Form PC3227TB-E3 PC3227TB-E3-A6-pin super minimold (Pb-Free) Note C3P Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: PC3227TB CautionObserve precautions when handling because these devices are sensitive to electrostatic discharge. BIPOLAR ANALOG INTEGRATED CIRCUIT UPC3227TB

5 V, SILICON GERMANIUM MMIC

Document No. PU10557EJ02V0DS (2nd edition) Date Published July 2005 CP(K)

PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name

1 INPUT

2 GND

3 GND

4 OUTPUT

5 GND

(Top View) (Bottom View) (Top View)

6 VCC

PRODUCT LINE-UP OF 5 V-BIASSILICON MMIC WIDEBAND AMPLIFIER (TA = +25°C, f = 1 GHz, VCC = 5.0 V, ZS = ZL = 50 ) Part No. fu (GHz) PO (sat) (dBm) GP (dB) NF (dB) ICC (mA) Package Marking PC2711TB 2.9 +1.0 13 5.0 12 6-pin super minimold C1G PC2712TB 2.6 +3.0 20 4.5 12 C1H PC3215TB Note 2.9 +3.5 20.5 2.3 14 C3H PC3227TB 3.2 1.0 22 4.7 4.8 C3P Note PC3215TB is f = 1.5 GHz Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Data Sheet PU10557EJ02V0DS2 UPC3227TB

Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25°C 6.0 V Total Circuit Current ICC TA = +25°C 15 mA Power Dissipation PD TA = +85 C Note 270 mW Operating Ambient Temperature TA 40 to +85 °C Storage Temperature Tstg 55 to +150 °C Input Power Pin TA = +25°C +10 dBm Note Mounted on double-sided copper-clad 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA 40 +25 +85 °C Data Sheet PU10557EJ02V0DS 3 UPC3227TB

ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 ) Parameter Symbol TestConditions MIN. TYP. MAX. Unit Circuit Current ICC No input signal 4.0 4.8 6.0 mA Power Gain 1 GP1 f = 0.1 GHz, Pin = 40 dBm 20.5 22.5 24.5 dB Power Gain 2 GP2 f = 1.0 GHz, Pin = 40 dBm 19.5 22.0 24.5 Power Gain 3 GP3 f = 1.8 GHz, Pin = 40 dBm 19.0 22.0 25.0 Power Gain 4 GP4 f = 2.2 GHz, Pin = 40 dBm 19.0 22.0 25.0 Power Gain 5 GP5 f = 2.6 GHz, Pin = 40 dBm 19.0 22.0 25.0 Power Gain 6 GP6 f = 3.0 GHz, Pin = 40 dBm 18.0 21.0 24.5 Saturated Output Power 1 PO (sat) 1f = 1.0 GHz, P in = 12 dBm 3.5 1.0 dBm Saturated Output Power 2 PO (sat) 2f = 2.2 GHz, P in = 12 dBm 6.0 3.5 Gain 1 dB Compression Output Power 1 PO (1 dB) 1f = 1.0 GHz 9.0 6.5 dBm Gain 1 dB Compression Output Power 2 PO (1 dB) 2f = 2.2 GHz 11.0 8.0 Noise Figure 1 NF1 f = 1.0 GHz 4.7 5.5 dB Noise Figure 2 NF2 f = 2.2 GHz 4.6 5.5 Isolation 1 ISL1f = 1.0 GHz, P in = 40 dBm 35 40 dB Isolation 2 ISL2f = 2.2 GHz, P in = 40 dBm 35 43 Input Return Loss 1 RLin1f = 1.0 GHz, P in = 40 dBm 7.5 10.5 dB Input Return Loss 2 RLin2f = 2.2 GHz, P in = 40 dBm 7.5 10.5 Output Return Loss 1 RLout1f = 1.0 GHz, P in = 40 dBm 10.0 13.5 dB Output Return Loss 2 RLout2f = 2.2 GHz, P in = 40 dBm 7.5 9.5 Input 3rd Order Distortion Intercept Point 1 IIP31f1 = 1 000 MHz, f2 = 1 001 MHz, Pin = 40 dBm 18.0 dBm Input 3rd Order Distortion Intercept Point 2 IIP32f1 = 2 200 MHz, f2 = 2 201 MHz, Pin = 40 dBm 20.5 Output 3rd Order Distortion Intercept Point 1 OIP31f1 = 1 000 MHz, f2 = 1 001 MHz, Pin = 40 dBm +4.0 dBm Output 3rd Order Distortion Intercept Point 2 OIP32f1 = 2 200 MHz, f2 = 2 201 MHz, Pin = 40 dBm +1.5 2nd Order Intermodulation Distortion IM2 f1 = 1 000 MHz, f2 = 1 001 MHz, Pin = 40 dBm 30.5 dBc K factor 1 K1 f = 1.0 GHz 3.8 K factor 2 K2 f = 2.2 GHz 3.9 Data Sheet PU10557EJ02V0DS4 UPC3227TB

2, 3, 5 100 pF C2 50 OUT 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING

ELECTRICAL CHARACTERISTICS

C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF CAPACITORS FOR VCC AND INPUT PINS Bypass capacitor for V CC pin is intended to minimize V CC pin’s ground impedance.Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. Data Sheet PU10557EJ02V0DS 5 UPC3227TB

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN OUT VCC AMP-2 C1 C2 Notes 1. 30 0.4 mm double sided copper clad polyimide board. 2.Back side: GND pattern 3.Solder plated on pattern 4. : Through holes COMPONENT LIST Value C1, C2 100 pF C3, C4 1 000 pF Data Sheet PU10557EJ02V0DS6 UPC3227TB

TYPICAL CHARACTERISTICS (TA = +25 C, VCC = 5.0 V, ZS = ZL = 50 , unless otherwise specified) 01 3 24 5 6 –60 –40 0 6.0 5.5 5.0 4.5 4.0 3.5 3.0 –20 20 608010040 0.1 0.30.5 4.0 –10 –20 –30 –40 –50 –60 2.01.0 0.1 0.30.5 4.0 –10 –15 –20 –25 –30 –10 –15 –20 –25 –30 2.01.0 +25 C –40 C TA = +85 C 5.0 V VCC = 5.5 V 4.5 V VCC = 4.5 V 5.5 V5.0 V VCC = 4.5 V 5.0 V 5.5 V VCC = 4.5 V 5.5 V5.0 V CIRCUIT CURRENT vs. SUPPLY VOLTAGE Supply Voltage VCC (V) No Input Signal NoInput Signal CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE Operating Ambient Temperature T A ( POWER GAIN vs. FREQUENCY Frequency f (GHz) ISOLATION vs. FREQUENCY Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10557EJ02V0DS 7 UPC3227TB

–10 –15 –20 f = 1.0 GHz +5 –10 –15 –20 f = 2.2 GHz 6.0 5.5 5.0 4.5 4.0 3.5 3.0 0 1 000 3 0001 500 500 2 5002 000 6.0 5.5 5.0 4.5 4.0 3.5 3.0 0 1 000 3 0001 500 500 2 5002 000 VCC = 5.5 V 5.0 V 4.5 V VCC = 5.5 V 5.0 V 4.5 V VCC = 4.5 V 5.0 V5.5 V +25 C –40 C TA = +85 C OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) NOISE FIGURE vs. FREQUENCY Frequency f (MHz) NOISE FIGURE vs. FREQUENCY Frequency f (MHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10557EJ02V0DS8 UPC3227TB

+10 –10 –20 –30 –40 –50 –60 –70 f1 = 1 000 MHz f2 = 1 001 MHz IM3 Pout +10 –10 –20 –30 –40 –50 –60 –70 f1 = 2 200 MHz f2 = 2 201 MHz IM3 Pout +10 –10 –20 –30 –40 –50 –60 –70 IM2 Pout –50 OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Input Power Pin (dBm) OUTPUT POWER, IM2 vs. INPUT POWER Input Power Pin (dBm) IM2 vs. INPUT POWER Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10557EJ02V0DS 9 UPC3227TB

S-PARAMETERS (TA = +25 C, VCC = 5.0 V, Pin = 40 dBm) S11 FREQUENCY 1 : 1 000 MHz91.02 2.3789 2 : 2 200 MHz82.914 26.738 START: 100.000 000 MHz STOP: 5 100.000 000 MHz S22 FREQUENCY 1 : 1 000 MHz77.086 6.1797 2 : 2 200 MHz92.535 28.438 START: 100.000 000 MHz STOP: 5 100.000 000 MHz Data Sheet PU10557EJ02V0DS10 UPC3227TB

6-PIN SUPER MINIMOLD (UNIT: mm) 1.25±0.1 2.1±0.1 0.1 MIN. Data Sheet PU10557EJ02V0DS 11 UPC3227TB

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method SolderingConditions ConditionSymbol Infrared Reflow Peak temperature (package surface temperature) : 260 C or below Time at peak temperature : 10 seconds or less Time at temperature of 220 C or higher : 60 seconds or less Preheating time at 120 to 180 C : 120 30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350 C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10557EJ02V0DS12 UPC3227TB

Subject:Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substancesin electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZLead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Informationprovided byCELon its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by thirdparties and makes no representation or warranty asto the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary,andthus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue soldby CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.