UPC3224TB CEL | Alldatasheet

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Technical content

DESCRIPTION

The µPC3224TB is a silicon monolithic IC desi gned as IF amplifier for DBS tuners. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.

FEATURES

  • Wideband response : f u = 3.2 GHz TYP. @ 3 dB bandwidth
  • Low current : I CC = 9.0 mA TYP.
  • Power gain : G P = 21.5 dB TYP. @ f = 1.0 GHz : GP = 21.5 dB TYP. @ f = 2.2 GHz
  • Supply voltage : V CC = 4.5 to 5.5 V
  • Port impedance : input/output 50 Ω APPLICATION
  • IF amplifiers in DBS converters etc. ORDERING INFORMATION (Solder Contains Lead) Part Number Package Marking Supplying Form µPC3224TB-E3 6-pin super minimold C3K • Embossed tape 8 mm wide
  • 1, 2, 3 pins face the perforation side of tape
  • Qty 3 kpcs/reel ORDERING INFORMATION (Pb-Free) Part Number Package Marking Supplying Form µPC3224TB-E3-A 6-pin super minimold C3K • Embossed tape 8 mm wide
  • 1, 2, 3 pins face the perforation side of tape
  • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPC3224TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. BIPOLAR ANALOG INTEGRATED CIRCUIT UPC3224TB Document No. PU10490EJ01V0DS (1st edition) Date Published May 2004 CP(K) © NEC Compound Semiconductor Devices 2004

5 V, SILICON MMIC

Pin No. Pin Name

1 INPUT

2 GND

3 GND

4 OUTPUT

5 GND

(Top View) (Bottom View)

6 VCC

PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM WIDEBAND AMPLIFIER (TA = +25°C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω) Part No. fu (GHz) PO (sat) (dBm) GP (dB) NF (dB) ICC (mA) Package Marking µPC2711TB 2.9 +1.0 13 5.0 12 6-pin super minimold C1G µPC2712TB 2.6 +3.0 20 4.5 12 C1H µPC3215TB Note 2.9 +3.5 20.5 2.3 14 C3H Note µPC3215TB is f = 1.5 GHz Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Data Sheet PU10490EJ01V0DS 2 UPC3224TB

No. Pin Name Applied Voltage (V) Pin Voltage (V) Note Function and Applications INPUT – 0.91 Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. A multi-feedback circuits is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 4 OUTPUT – 4.42 Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. 6 VCC 4.5 to 5.5 – Power suplly pin. This pin should be externally equipped with bypass capacitor to minimize its impedance. GND 0 – Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Note Pin Voltage is measured at V CC = 5.0 V Data Sheet PU10490EJ01V0DS 3 UPC3224TB

Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25°C 6.0 V Total Circuit Current ICC TA = +25°C 25 mA Power Dissipation PD TA = +85°C Note 270 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Power Pin TA = +25°C +10 dBm Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No input signal 7.0 9.0 12.0 mA Power Gain GP f = 1.0 GHz, Pin = −30 dBm 19.0 21.5 24.0 dB f = 2.2 GHz, Pin = −30 dBm 18.5 21.5 24.5 Saturated Output Power PO (sat) f = 1.0 GHz, Pin = −5 dBm +1.5 +4.0 − dBm f = 2.2 GHz, Pin = −5 dBm −1.5 +1.5 − PO (1 dB) f = 1.0 GHz −6.5 −3.5 − dBm Gain 1 dB Compression Output Power f = 2.2 GHz −8.5 −5.5 − Noise Figure NF f = 1.0 GHz − 4.3 5.8 dB f = 2.2 GHz − 4.3 5.8 Upper Limit Operating Frequency fu 3 dB down below flat gain at f = 0.1 GHz 2.8 3.2 − GHz Isolation ISL f = 1.0 GHz, Pin = −30 dBm 35.0 40.0 − dB f = 2.2 GHz, Pin = −30 dBm 37.0 42.0 − Input Return Loss RLin f = 1.0 GHz, Pin = −30 dBm 9.0 12.0 − dB f = 2.2 GHz, Pin = −30 dBm 10.0 14.0 − Output Return Loss RLout f = 1.0 GHz, Pin = −30 dBm 11.0 17.0 − dB f = 2.2 GHz, Pin = −30 dBm 8.0 12.0 − Gain Flatness ∆GP f = 0.1 to 2.2 GHz − ±0.8 − dB Data Sheet PU10490EJ01V0DS 4 UPC3224TB

OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω) Parameter Symbol Test Conditions Reference Value Unit Output Intercept Point OIP3 f = 1.0 GHz +7.0 dBm f = 2.2 GHz +5.5 Data Sheet PU10490EJ01V0DS 5 UPC3224TB

50 Ω 2, 3, 5 100 pF C2 50 Ω OUT 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1000 pF are recommendable as the bypass capacitor for the V CC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the V CC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connec ted to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upw ards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 πRfc). Data Sheet PU10490EJ01V0DS 6 UPC3224TB

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN OUT VCC AMP-2 C1 C2 Notes 1. 30 × 30 × 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes COMPONENT LIST Value C1, C2 100 pF C3, C4 1 000 pF Data Sheet PU10490EJ01V0DS 7 UPC3224TB

TYPICAL CHARACTERISTICS (TA = +25°C , unless otherwise specified) 001 23 4 5 6 0.1 1.1 2.1 5.1 − 20 − 40 − 60 − 80 − 100 − 10 − 20 − 30 − 60 − 40 − 20 0 +20 +40 +60 +80 +100 VCC = 5.0 V VCC = 4.5 to 5.5 V TA = − 40˚C TA = +25˚C TA = +85˚C VCC = 5.0 V TA = +25˚C VCC = 5.5 V − 10 − 20 − 30 TA = +25˚C VCC = 5.5 V 3.1 4.1 VCC = 4.5 V VCC = 5.0 V TA = +25˚C VCC = 4.5 V VCC = 5.0 to 5.5 V TA = +25˚C VCC = 4.5 V No input signal CIRCUIT CURRENT vs. SUPPLY VOLTAGECircuit Current ICC (mA) Supply Voltage VCC (V) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE Circuit Current ICC (mA) Operating Ambient Temperature TA (°C) No input signal POWER GAIN vs. FREQUENCY Frequency f (GHz) Power Gain GP (dB) INPUT RETURN LOSS vs. FREQUENCY Input Return Loss RLin (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY Isolation ISL (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) Output Return Loss RLout (dB) Remark The graphs indicate nominal characteristics. Data Sheet PU10490EJ01V0DS 8 UPC3224TB

0.1 1.1 2.1 5.1 TA = +85˚C TA = +25˚C VCC = 5.0 V TA = − 40˚C − 10 − 20 − 30 VCC = 5.0 V 3.1 4.1 TA = +25 to +85˚C TA = − 40˚C − 20 − 40 − 60 − 80 − 100 TA = − 40 to +85˚C VCC = 5.0 V − 10 − 20 − 30 VCC = 5.0 V TA = +85˚C TA = − 40˚C TA = +25˚C POWER GAIN vs. FREQUENCY Frequency f (GHz) Power Gain GP (dB) INPUT RETURN LOSS vs. FREQUENCY Input Return Loss RLin (dB) Frequency f (GHz) ISOLATION vs. FREQUENCY Isolation ISL (dB) Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) Output Return Loss RLout (dB) Remark The graphs indicate nominal characteristics. Data Sheet PU10490EJ01V0DS 9 UPC3224TB

− 5 − 10 − 15 − 20 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 55 100 f = 1.0 GHz TA = +25˚C VCC = 4.5 V − 5 − 10 − 15 − 20 − 35 − 30 − 25 − 20 − 15 − 10 − 55 0 10 f = 2.2 GHz VCC = 5.0 V VCC = 5.0 V VCC = 5.5 V − 5 − 10 − 15 − 20− 40 − 35 − 30 − 25 − 20 − 15 − 10 − 55 0 10 f = 1.0 GHz VCC = 5.0 V TA = − 40˚C TA = − 40˚C − 5 − 10 − 15 − 20− 40 − 35 − 30 − 25 − 20 − 15 − 10 − 55 100 f = 2.2 GHz TA = +25˚C VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V − 10 − 20 − 30 − 40 − 50 − 60 − 70 − 80 VCC = 5.5 V IM3 5.0 V VCC = 5.0 V VCC = 5.5 V VCC = 4.5 V f1 = 1 000 MHz f2 = 1 001 MHz Pout 4.5 V − 10 − 20 − 30 − 40 − 50 − 60 − 70 − 80 IM3 f1 = 2 200 MHz f2 = 2 201 MHz Pout − 40 TA = +25 to +85˚C TA = +25 to +85˚C VCC = 5.5 V 5.0 V 4.5 V 5.0 V 4.5 V 5.5 V 5.5 V 5.0 V 4.5 V OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) Input Power Pin (dBm) OUTPUT POWER (2 tones), IM3 vs. INPUT POWER 3rd Order Intermodulation Distortion IM3 (dBm) Output Power (2 tones) Pout (dBm) Input Power Pin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Output Power (2 tones) Pout (dBm) Input Power Pin (dBm) OUTPUT POWER (2 tones), IM3 vs. INPUT POWER Remark The graphs indicate nominal characteristics. Data Sheet PU10490EJ01V0DS 10 UPC3224TB

S-PARAMETERS (TA = +25°C, VCC = 5.0 V) S11−FREQUENCY

1.0 GHz

2.2 GHz

S22−FREQUENCY Data Sheet PU10490EJ01V0DS 11 UPC3224TB

6-PIN SUPER MINIMOLD (UNIT: mm) 0.9±0.1 0.7 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 2.0±0.2 1.3 0.650.65 1.25±0.1 2.1±0.1 0.1 MIN. Data Sheet PU10490EJ01V0DS 12 UPC3224TB

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to mi nimize ground impedance (to pr event undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to V CC line. (4) The DC cut capacitor must be eac h attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260° C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating). Data Sheet PU10490EJ01V0DS 13 UPC3224TB

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