UPC2710TB-E3-A

UPC2710TB CEL | Alldatasheet

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Technical content

5V, SUPER MINIMOLD MEDIUM POWER SI MMIC AMPLIFIER NEC's UPC2710TB is a Silicon RFIC manufactured using the NESAT III process. This device is suitable as a PA driver amplifier for cellular radio and other communication receivers. The UPC2710TB is pin compatible and has comparable per- formance to the larger UPC2710T, so it is suitable for use as a replacement to help reduce system size. The IC is housed in a 6 pin super minimold or SOT-363 package. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. UPC2710TB

DESCRIPTION

FEATURES

• HIGH DENSITY SURFACE MOUNTING:

6 Pin Super Minimold or SOT-363 package

• HIGH GAIN: 33 dB TYP
• SATURATED OUTPUT POWER: +13.5 dBm
• SUPPLY VOLTAGE: VCC = 4.5 to 5.5 V GAIN vs. FREQUENCY and TEMPERATURE Frequency, f (GHz) Gain, G S (dB) ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 5 V, f = 0.5 GHz) VCC = 5.0 V TA = -40¡C TA = +85¡C 2.01.00.30.1 TA = +25¡C PART NUMBER UPC2710TB PACKAGE OUTLINE S06 SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX ICC Circuit Current (no signal) mA 16 22 29 GS Small Signal Gain dB 30 33 36.5 fU Upper Limit Operating Frequency (The gain at fU is 3 dB down from the gain at 0.1 GHz) GHz 0.7 1.0 ∆GS Gain Flatness, f = 0.1 ~ 0.6 GHz dB ±0.8 f = 0.1 ~ 0.8 GHz PSAT Saturated Output Power dBm +11 +13.5 P1dB Output Power at 1dB Compression Point dBm +7.5 NF Noise Figure dB 3.5 5 RL IN Input Return Loss dB 3 6 RLOUT Output Return Loss dB 9 12 ISOL Isolation dB 34 39 T Gain -Temperature Coefficient dB/ °C -0.006 RTH Thermal Resistance (Junction to Ambient) °C/W 325 California Eastern Laboratories

ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS PARAMETERS UNITS RATINGS VCC Supply Voltage V 6 PIN Input Power dBm +10 PT Power Dissipation2 mW 200 TOP Operating Temperature °C -40 to +85 TSTG Storage Temperature °C -55 to +150 Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85°C). RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER UNITS MIN TYP MAX VCC Supply Voltage V 4.5 5.0 5.5 UPC2710TB Pin No. Symbol Applied Pin Description Voltage (V) Voltage (V) 1 Input – 0.9 Signal input pin. An internal matching circuit, configured with resistors, enables 50 Ω connection over a wide bandwidth. A multi-feedback circuit is designed to cancel the deviations of h FE and resistance. This pin must be coupled to the signal source with a blocking capacitor. 4 Output – – Signal output pin. Connect an inductor between this pin and V CC to supply current to the internal output transistors. 6V CC 4.5 to 5.5 Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize ground impedance. 2 GND 0 – Ground pins. These pins should be connected to system 3 ground with minimum inductance. Ground pattern on the 5 board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to minimize impedance difference. PIN DESCRIPTIONS Internal Equivalent Circuit VCC OUT IN GND 3 2 GND CIRCUIT CURRENT vs. VOLTAGE TYPICAL PERFORMANCE CURVES (TA = 25°C) Supply Voltage, VCC (V) Operating Temperature, TOP (°C) Circuit Current, I CC (mA) Circuit Current, I CC (mA) CIRCUIT CURRENT vs. TEMPERATURE 0 1 2 3 4 5 6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 UPC2710T -60 -40 -20 0 20 40 60 80 100 UPC2710T

OUTPUT POWER vs. INPUT POWER AND VOLTAGE Output Power, P OUT (dBm) Input Power, PIN (dBm) OUTPUT POWER vs. INPUT POWER AND TEMPERATURE Output Power, P OUT (dBm) Input Power, PIN (dBm) UPC2710TB TYPICAL PERFORMANCE CURVES (TA = 25° C) POWER vs. FREQUENCY Power (dBm) Input Return Loss, RL IN (dB) Output Return Loss, RL OUT (dB) Frequency, f (GHz) Frequency, f (GHz) Isolation, ISOL (dB) Frequency, f (GHz) X: Typical SSB Third Order Intercept Point ISOLATION vs. FREQUENCY RETURN LOSS vs. FREQUENCY -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 -10 -15 VCC = 5.0 V f = 0.5 GHz VCC = 5.5 V VCC = 4.5 V -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 -10 -15 VCC = 5.0 V f = 0.5 GHZ TA = 25˚ CTA = -45˚ C TA = 85˚ C -10 -20 -30 -40 -50 0.1 0.3 1.0 2.0 RLIN RLOUT VCC = 5.0 V 0.1 0.3 1.0 2.0 VCC = 5.0V -10 -20 -30 -40 -50 0 0.5 1.0 1.5 2.0 PSAT P1dB x NOISE FIGURE AND INSERTION GAIN vs. FREQUENCY Insertion Power Gain, G P (dB) Noise Figure, NF (dB) 0.1 0.3 1.0 2.0 VCC = 5.0 V NF Gp VCC = 5.0 V VCC = 5.5 V VCC = 4.5 V VCC = 5.5 V VCC = 4.5 V Frequency, f (GHz)

Noise Figure, NF (dB) Frequency, f (GHz) NOISE FIGURE vs. FREQUENCY TYPICAL PERFORMANCE CURVES (TA = 25°C) UPC2710TB 0 0.5 1.0 1.5 UPC2710T OUTPUT POWER vs. INPUT POWER AND VOLTAGE Output Power, P OUT (dBm) Input Power, PIN (dBm) +20 -15 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V f = 1.0 GHz +15 -10 +10 +20 -15 VCC = 5.0 V +15 -10 +10 f = 0.5 GHz f = 1.0 GHz SATURATED OUTPUT POWER vs. FREQUENCY AND VOLTAGE Saturated Output Power, P OUT (sat) (dBm) +20 +14 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V PIN = -8 dBm +18 +16 +12 +10 THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE and VOLTAGE Third Order Intermodulation Distortion, IM 3 (dBc) Output Power, POUT (dBm) VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V f1 = 0.500 GHz f2 = 0.502 GHz -10 0-2 +8 +6+4+2 -20 -4-6-8 -30 -40 -50 -60 +10-10 Frequency, f (GHz) OUTPUT POWER vs. INPUT POWER AND FREQUENCY Output Power, P OUT (dBm) Input Power, PIN (dBm)

SYSTEM APPLICATION EXAMPLE PLL PLL RX φ DEMO UPC2710TB Driver I Q I Q 90˚ TX SW PA Example of 900 MHz Band Digital Cellular Telephone UPC2710TB

1.0 GHz

0.1 GHz

2.0 GHz

3.0 GHz

FREQUENCY S 11 S21 S12 S22 K GHz MAG ANG MAG ANG MAG ANG MAG ANG TYPICAL SCATTERING PARAMETERS (TA = 25°C) UPC2710TB VCC = VOUT = 5 V, ICC = 22 mA S

11 S22

OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE S06 (Top View) PIN CONNECTIONS TEST CIRCUIT IN OUT VCC 1000 pF L = 1000 nH 1000 pF1000 pF 2, 3, 5 50 Ω C1 50 Ω C1F 1. INPUT 2. GND 3. GND 4. OUTPUT 5. GND 6. V CC 2.1 ± 0.1 1.25 ± 0.1 0 ~ 0.1 0.13 ± 0.05 2.0 ± 0.2 0.65 1.3 3 4 0.22 (All Leads) +0.10 - 0.05 0.45 0.6 ± 0.1 EQUIVALENT CIRCUIT IN GND OUT VCC 2, 3, 5

ORDERING INFORMATION

UPC2710TB-E3-A C1F 3K/Reel Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated side of tape. 1. INPUT 2. GND 3. GND 4. OUTPUT 5. GND 6. V CC (Top View) (Bottom View) EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 07/17/2000DATA SUBJECT TO CHANGE WITHOUT NOTICE Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.

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Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZLead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substan ce content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway t o better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and ac curate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.