UPC2710TB

UPC3223TB CEL | Alldatasheet

Document overview

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Technical content

DESCRIPTION

PC3223TB is a silicon monolithic IC designed as IF amplifier for DBS tuners. This IC is manufactured using our 30 GHz fmax UHS0 (UltraH ighS peed Process) silicon bipolar process.

FEATURES

• Wideband response : f u = 3.2 GHz TYP. @ 3 dB bandwidth
• Medium output power : P O (sat) = +12.0 dBm @ f = 1.0 GHz : PO (sat) = +9.0 dBm @ f = 2.2 GHz
• High linearity : P O (1 dB) = +6.5 dBm @ f = 1.0 GHz : PO (1 dB) = +5.0 dBm @ f = 2.2 GHz
• Power gain : G P = 23.0 dB TYP. @ f = 1.0 GHz : GP = 23.0 dB TYP. @ f = 2.2 GHz
• Supply voltage : V CC = 4.5 to 5.5 V
• Port impedance : input/output 50 APPLICATION
• IF amplifiers in DBS converters etc. ORDERING INFORMATION (Solder Contains Lead) Part Number Package Marking Supplying Form PC3223TB-E36-pin super minimold C3J Embossed tape 8 mm wide 1, 2, 3 pins face the perforation side of tape Qty 3 kpcs/reel ORDERING INFORMATION (Pb-Free) Part Number Package Marking Supplying Form PC3223TB-E3-A6-pin super minimold C3J Embossed tape 8 mm wide 1, 2, 3 pins face the perforation side of tape Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC3223TB CautionObserve precautions when handling because these devices are sensitive to electrostatic discharge. BIPOLAR ANALOG INTEGRATED CIRCUIT UPC3223TB Document No. PU10491EJ01V0DS (1st edition) Date Published May 2004 CP(K)

5 V, SILICON MMIC

MEDIUM OUTPUT POWER AMPLIFIER

Pin No. Pin Name

1 INPUT

2 GND

3 GND

4 OUTPUT

5 GND

(Top View) (Bottom View)

6 VCC

PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT AMPLIFIER (TA = +25 C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Part No. fu (GHz) PO(sat) (dBm) GP (dB) NF (dB) ICC (mA) Package Marking PC2708TB 2.9 +10.0 15 6.5 26 6-pin super minimold C1D PC2709TB 2.3 +11.5 23 5.0 25 C1E PC2710TB 1.0 +13.5 33 3.5 22 C1F PC2776TB 2.7 +8.5 23 6.0 25 C2L PC3223TB 3.2 +12.0 23 4.5 19 C3J Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Data Sheet PU10491EJ01V0DS 2 UPC3223TB

No. Pin Name Applied Voltage (V) Pin Voltage (V) Note Function and Applications 1 INPUT – 0.96 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuits is designed to cancel the deviations of h FE and resistance. This pin must be coupled to signal source with capacitor for DC cut.

4 OUTPUT Voltage as

– Signal output pin. The inductor must be attached between V CC and output pins to supply current to the internal output transistors. 6 VCC 4.5 to 5.5 – Power suplly pin. Witch biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. GND 0 – Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Note Pin Voltage is measured at V CC = 5.0 V Data Sheet PU10491EJ01V0DS 3 UPC3223TB

Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25 C, Pin 4 and 6 6.0 V Total Circuit Current ICC TA = +25 C 40 mA Power Dissipation PD TA = +85 C Note 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin TA = +25 C +10 dBm Note Mounted on double-sided copper-clad 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC The same voltage should be applied to pin 4 and 6. 4.5 5.0 5.5 V Operating Ambient Temperature TA 40 +25 +85 C ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Symbol TestConditions MIN. TYP. MAX. Unit Circuit Current ICC No input signal 15.0 19.0 24.0 mA Power Gain GP f = 1.0 GHz, Pin = 30 dBm 20.5 23.0 25.5 dB f = 2.2 GHz, Pin = 30 dBm 20.0 23.0 26.0 Saturated Output Power PO (sat) f = 1.0 GHz, Pin = 5 dBm +9.0 +12.0 dBm f = 2.2 GHz, Pin = 5 dBm +6.0 +9.0 PO (1 dB) f = 1.0 GHz +4.5 +6.5 dBmGain 1 dB Compression Output Power f = 2.2 GHz +3.0 +5.0 Noise Figure NF f = 1.0 GHz 4.5 6.0 dB f = 2.2 GHz 4.0 5.5 Upper Limit Operating Frequency fu 3 dB down below flat gain at f = 0.1 GHz 2.8 3.2 GHz Isolation ISLf = 1.0 GHz, P in = 30 dBm 28.0 33.0 dB f = 2.2 GHz, Pin = 30 dBm 28.0 33.0 Input Return Loss RLin f = 1.0 GHz, Pin = 30 dBm 9.0 12.0 dB f = 2.2 GHz, Pin = 30 dBm 12.0 17.5 Output Return Loss RLout f = 1.0 GHz, Pin = 30 dBm 9.0 12.0 dB f = 2.2 GHz, Pin = 30 dBm 9.0 12.0 Gain Flatness GP f = 0.1 to 2.2 GHz 0.9 dB Data Sheet PU10491EJ01V0DS 4 UPC3223TB

OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25 C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Symbol Test Conditions Reference Value Unit Output Intercept Point OIP3 f = 1.0 GHz +17.8 dBm f = 2.2 GHz +14.8 Data Sheet PU10491EJ01V0DS 5 UPC3223TB

2, 3, 5 100 pF C2 50 OUT L 1 000 pF 100 nH The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF L Chip Inductor 100 nH INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output mediumpower.To supply current for output transistor, connect an inductor between the V CC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. Theinductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1000 pF are recommendable as the bypass capacitor for the V CC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the V CC pin is used to minimize groundimpedanceofV CC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins,areused to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. Toobtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the valueof coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). Data Sheet PU10491EJ01V0DS 6 UPC3223TB

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN OUTC1 C2 L Notes 1. 30 0.4 mm double sided copper clad polyimide board. 2.Back side: GND pattern 3.Solder plated on pattern 4. : Through holes COMPONENT LIST Value C1, C2 100pF C3, C4 1 000 pF L 100nH Data Sheet PU10491EJ01V0DS 7 UPC3223TB

TYPICAL CHARACTERISTICS (TA = +25 C , unless otherwise specified) 01 23 4 5 6 0.1 1.1 2.1 5.1 No input signal 200 100 VCC = 5.0 V VCC = 4.5 to 5.5 V VCC = 4.5 V TA = 40˚C TA = 25˚C TA = 85˚C VCC = 5.0 V TA = 25˚C VCC = 5.5 V TA = 25˚C VCC = 5.5 V 3.1 4.1 VCC = 5.0 to 5.5 V VCC = 5.0 V VCC = 4.5 V TA = 25˚C VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V TA = 25˚C CIRCUIT CURRENT vs. SUPPLY VOLTAGE Supply Voltage VCC (V) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE Operating Ambient Temperature T A ( No input signal POWER GAIN vs. FREQUENCY Frequency f (GHz) ISOLATION vs. FREQUENCY Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10491EJ01V0DS 8 UPC3223TB

0.1 1.1 2.1 5.1 TA = 85˚C TA = 25˚C VCC = 5.0 V TA = 40˚C VCC = 5.0 V 3.1 4.1 TA = 85˚C TA = 25˚C TA = 40˚C TA = 40 to 85˚C VCC = 5.0 V VCC = 5.0 V TA = 40 to 85˚C POWER GAIN vs. FREQUENCY Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) ISOLATION vs. FREQUENCY Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10491EJ01V0DS 9 UPC3223TB

f = 1.0 GHz TA = 25˚C VCC = 4.5 V 55 0 10 f = 2.2 GHz VCC = 5.0 V VCC = 5.0 VVCC = 5.5 V 55 0 10 f = 1.0 GHz VCC = 5.0 V TA = 40 to 85˚C TA = 40 to 85˚C 5510 0 f = 2.2 GHz TA = 25˚C VCC = 4.5 V VCC = 5.0 VVCC = 5.5 V VCC = 5.5 V IM3 5.0 V VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V f1 = 1 000 MHz f2 = 1 001 MHz Pout 5510 0 4.5 V VCC = 5.5 V IM3 5.0 V f1 = 2 200 MHz f2 = 2 201 MHz Pout 4.5 V 55 0 10 VCC = 4.5 to 5.5 V OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER Input Power Pin (dBm) OUTPUT POWER (2 tones), IM3 vs. INPUT POWER Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER (2 tones), IM3 vs. INPUT POWER Remark The graphs indicate nominal characteristics. Data Sheet PU10491EJ01V0DS 10 UPC3223TB

S-PARAMETERS (T A = +25 C, VCC = Vout = 5.0 V) S11 FREQUENCY

1.0 GHz

2.2 GHz

Data Sheet PU10491EJ01V0DS 11 UPC3223TB

6-PIN SUPER MINIMOLD (UNIT: mm) Data Sheet PU10491EJ01V0DS 12 UPC3223TB

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to V CC line. (4) The inductor must be attached between V CC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be each attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method SolderingConditions ConditionSymbol Infrared Reflow Peak temperature (package surface temperature) : 260 C or below Time at peak temperature : 10 seconds or less Time at temperature of 220 C or higher : 60 seconds or less Preheating time at 120 to 180 C : 120 30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260 C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) : 350 C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10491EJ01V0DS 13 UPC3223TB

Subject:Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substancesin electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZLead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Informationprovided byCELon its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by thirdparties and makes no representation or warranty asto the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary,andthus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue soldby CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.