UPB1514TU CEL | Alldatasheet

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Technical content

DESCRIPTION

The µPB1514TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 8 prescaler IC for satellite communications and point-to-point/multi-point radios. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.

FEATURES

  • Operating frequency : fin = 8 to 16 GHz
  • Low current consumption : ICC = 50 mA @ VCC = 5.0 V
  • High-density surface mounting : 8-pin lead-less minimold
  • Supply voltage : VCC = 4.5 to 5.5 V
  • Division ratio : 8

APPLICATIONS

  • Point-to-point/Multi-point radios
  • VSAT radios

ORDERING INFORMATION

Part Number Order Number Package Markin g Supplying Form µPB1514TU-E2 µPB1514TU-E2-A 8-pin lead-less minimold (Pb-Free) Note 1514 • 8 mm wide embossed taping

  • Pin 5, 6, 7, 8 indicates pull-out direction of tape
  • Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPB1514TU Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1514TU

16 GHz INPUT DIVIDE BY 8 PRESCALER IC

FOR SATELLITE COMMUNICATIONS Document No. PU10541EJ02V0DS (2nd edition) Date Published March 2005 CP(K) © NEC Compound Semiconductor Devices, Ltd. 2004, 2005 The mark  shows major revised points.

INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS Pin No. Pin Name

1 VCC1

3 GND

5 OUT

6 GND

7 OUT

(Top View) Regulator 1/2 1/2 1/2

8 VCC2

SYSTEM APPLICATION EXAMPLE PLL

16 GHz Prescaler

PB1514TUµ LNA Down-Converter Up-ConverterPA Diplexer Data Sheet PU10541EJ02V0DS 2 µPB1514TU

Pin No. Pin Name Applied Voltage (V) Function and Applications 1 VCC1 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. 2 IN − Signal input pin. This pin should be coupled to signal source with capasitor (example : 100 pF) for DC cut. 3 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 IN − Signal input bypass pin. This pin must be equipped with bypass capacitor (example : 100 pF) to minimize ground impedance. 5 OUT − Divided frequency output pin. This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC cut. 6 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 OUT − Divided frequency output pin. This pin should be coupled to load device with capasitor (example : 100 pF) for DC cut. 8 VCC2 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. Data Sheet PU10541EJ02V0DS 3 µPB1514TU

Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC TA = +25°C 6 V Total Power Dissipation PD TA = +85°C Note 867 mW Thermal Resistance (junction to ground paddle) Rth(j-c) TA = +85°C Note 75 °C/W Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on 33 × 21 × 0.4 mm polyimide PCB, with copper patterning on both sides. RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = −40 to +85°C, ZS = ZL = 50 Ω) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No Signals − 50 75 mA Input Sensitivity Pin1 fin = 8 to 13.5 GHz −2 − +6 dBm Pin2 fin = 13.5 to 16 GHz −5 − +6 dBm Output Power Pout fin = 8 to 16 GHz, Pin = 0 dBm −11 −5 +2 dBm Data Sheet PU10541EJ02V0DS 4 µPB1514TU

TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) Pin = 0 dBm Input Sensitivity Pin (dBm) Frequency f (GHz) INPUT SENSITIVITY vs. FREQUENCY –10 –15 –20 –25 –30 –3551 0 15 20 Guaranteed operating range VCC = 5.0 V TA = –40˚C TA = +25˚C TA = +85˚C Output Power Pout (dBm) Frequency f (GHz) OUTPUT POWER vs. FREQUENCY –10 –11 –1251 0 15 20 Guaranteed operating range TA = –40˚C TA = +25˚C TA = +85˚C VCC = 5.0 V Pin = 0 dBm Output Power Pout (dBm) Frequency f (GHz) Input Sensitivity Pin (dBm) Frequency f (GHz) INPUT SENSITIVITY vs. FREQUENCY OUTPUT POWER vs. FREQUENCY –10 –15 –20 –25 –30 –35 51 0 15 20 Guaranteed operating range VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V –10 –11 –1251 0 15 20 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V Guaranteed operating range 1234 65 Circuit Current ICC (mA) Supply Voltage VCC (V) CIRCUIT CURRENT vs. SUPPLY VOLTAGE TA = –40˚C TA = +25˚C TA = +85˚C Remark The graphs indicate nominal characteristics. Data Sheet PU10541EJ02V0DS 5 µPB1514TU

S-PARAMETERS (TA = +25°C, VCC = 5.0 V) S11−FREQUENCY FREQUENCY S11 GHz MAG ANG 8.0 0.667 70.3 9.0 0.718 57.8 10.0 0.768 51.2 11.0 0.752 46.0 12.0 0.700 36.8 13.0 0.733 38.1 14.0 0.779 34.0 15.0 0.726 27.6 16.0 0.705 20.0 1 : 9.0 GHz 2 : 10.0 GHz 3 : 12.0 GHz 4 : 14.0 GHz 5 : 15.0 GHz START : 8.0 GHz STOP : 16.0 GHz S22−FREQUENCY START : 1.0 GHz STOP : 2.0 GHz FREQUENCY S22 GHz MAG ANG 1.0 0.011 18.3 1.1 0.009 51.4 1.2 0.012 88.8 1.3 0.018 99.5 1.4 0.026 105.6 1.5 0.034 106.6 1.6 0.045 103.7 1.7 0.053 99.1 1.8 0.063 89.9 1.9 0.064 80.5 2.0 0.028 60.9 Data Sheet PU10541EJ02V0DS 6 µPB1514TU

50 Ω Spectrum Analyzer100 pF 51 Ω 100 pF 51 Ω 100 pF Signal Generator 50 Ω OUT GND OUT VCC2 5 V Power Supply 100 pF 10 nF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PU10541EJ02V0DS 7 µPB1514TU

ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD 51 Ω 51 Ω 100 pF 10 nF 100 pF 100 pF 100 pF 100 pF Remarks 1. 33 × 21 × 0.4 mm double-sided copper-clad polyimide PCB 2. Back side: GND pattern 3. Solder plated on pattern 4. represents cutout 5. : Through holes Data Sheet PU10541EJ02V0DS 8 µPB1514TU

8-PIN LEAD-LESS MINIMOLD (UNIT: mm) 12 3 4 8 7 6 5 2.2±0.05 2.0±0.1 (Top View) 0.5±0.03 4 3 2 1 56 7 8 (0.75)(0.75) (0.25) (0.25) 0.16±0.05 (Bottom View) 2.0±0.1 (0.35)(0.35) (0.35)(0.35) (0.5)(0.5) (0.6)(0.6) (0.65)(0.65) (0.6) (0.3) 0.125+0.1 –0.05 Data Sheet PU10541EJ02V0DS 9 µPB1514TU

(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to mi nimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the gr ound terminals as short as possible. (4) Bypass capacitance must be attached to V CC line. (5) Exposed heatsink at bottom on package must be soldered to PCB RF/DC ground. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 °C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260° C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 °C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering met hods together (except for partial heating). Data Sheet PU10541EJ02V0DS 10 µPB1514TU

When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. M8E 00. 4 - 0110 The information in this document is current as of March, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use o f such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility o f customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications o f a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard" : Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special" : Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific" : Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC' s willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). Data Sheet PU10541EJ02V0DS 11 µPB1514TU

NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 For further information, please contact µPB1514TU

4590 Patrick Henry Drive

Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZ Lead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.