UM4302

UM4302 UNITPOWER | Alldatasheet

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z High Frequency Point-of-Load Synchronous Buck Converter for MB/NB/UMPC/VGA z Networking DC-DC Power System z CCFL Back-light Inverter Absolute Maximum Ratings Thermal Data SOP8 Pin Configuration Product Summery S2 G2 D1 D1 D2 D2

N-Ch and P-Ch Fast Switching MOSFETs Symbol Parameter Conditions Min. Typ. Max. Unit BV DSS Drain-Source Breakdown Voltage V GS =0V , I D △BV DSS /△T J BVDSS Temperature Coefficient Reference to 25℃ , I D V GS =10V , I D =8A --- 12 15 R DS(ON) Static Drain-Source On-Resistance V GS =4.5V , I D =6A --- 16 20 mΩ V GS(th) Gate Threshold Voltage 1.0 1.5 2.5 V GS(th) V GS(th) Temperature Coefficient V GS DS , I D =250uA --- -5.64 --- mV/℃ V DS =32V , V GS =0V , T J =25℃ --- --- 1 I DSS Drain-Source Leakage Current V DS =32V , V GS =0V , T J =55℃ --- --- 5 uA I GSS Gate-Source Leakage Current V GS =±20V , V DS gfs Forward Transconductance V DS =5V , I D =8A --- 20 --- S R g Gate Resistance V DS =0V , V GS Q g Total Gate Charge (4.5V) --- 10.7 --- Q gs Gate-Source Charge --- 3.3 --- Q gd Gate-Drain Charge V DS =20V , V GS =4.5V , I D =8A --- 4.2 --- nC T d(on) Turn-On Delay Time --- 8.6 --- T r Rise Time --- 3.4 --- T d(off) Turn-Off Delay Time --- 24.8 --- T f Fall Time V DD =12V , V GS =10V , R G =3.3Ω I D =6A --- 2.2 --- ns C iss Input Capacitance --- 1314 --- C oss Output Capacitance --- 120 --- C rss Reverse Transfer Capacitance V DS =15V , V GS =0V , f=1MHz --- 88 --- pF Symbol Parameter Conditions Min. Typ. Max. Unit EAS Single Pulse Avalanche Energy V DD =25V , L=0.1mH , I AS =20A 45 --- --- mJ Symbol Parameter Conditions Min. Typ. Max. Unit I S Continuous Source Current 1,6 --- --- 11.6 A I SM Pulsed Source Current 2,6 V G D =0V , Force Current --- --- 23 A V SD Diode Forward Voltage V GS =0V , I S =1A , T J =25℃ --- --- 1.2 V Note : 1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper. 2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3.The EAS data shows Max. rating . The test condition is V DD =25V,V GS =10V,L=0.1mH,I AS =25A 4.The power dissipation is limited by 150℃ junction temperature 5.The Min. value is 100% EAS tested guarantee. 6.The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation. N-Channel Electrical Characteristics (T J =25 ℃, unless otherwise noted) Guaranteed Avalanche Characteristics Diode Characteristics UM4302

N-Ch and P-Ch Fast Switching MOSFETs Symbol Parameter Conditions Min. Typ. Max. Unit BV DSS Drain-Source Breakdown Voltage V GS =0V , I D △BV DSS /△T J BV DSS Temperature Coefficient Reference to 25℃ , I D V GS =-10V , I D =-6A --- 26 32 R DS(ON) Static Drain-Source On-Resistance V GS =-4.5V , I D =-3A --- 38 46 mΩ V GS(th) Gate Threshold Voltage -1.0 -1.6 -2.5 V GS(th) V GS(th) Temperature Coefficient V GS DS , I D =-250uA --- 3.72 --- mV/℃ V DS =-32V , V GS =0V , T J =25℃ --- --- 1 I DSS Drain-Source Leakage Current V DS =-32V , V GS =0V , T J =55℃ --- --- 5 uA I GSS Gate-Source Leakage Current V GS =±20V , V DS gfs Forward Transconductance V DS =-5V , I D =-8A --- 13 --- S Q g Total Gate Charge (-4.5V) --- 11.5 --- Q gs Gate-Source Charge --- 3.5 --- Q gd Gate-Drain Charge V DS =-15V , V GS =-4.5V , I D =-1A --- 3.3 --- nC T d(on) Turn-On Delay Time --- 22 --- T r Rise Time --- 15.7 --- T d(off) Turn-Off Delay Time --- 59 --- T f Fall Time V DD =-15V , V GS =-10V , R G =3.3Ω, I D =-1A --- 5.5 --- ns C iss Input Capacitance --- 1415 --- C oss Output Capacitance --- 134 --- C rss Reverse Transfer Capacitance V DS =-15V , V GS =0V , f=1MHz --- 102 --- pF Symbol Parameter Conditions Min. Typ. Max. Unit EAS Single Pulse Avalanche Energy V DD =-25V , L=0.1mH , I AS Symbol Parameter Conditions Min. Typ. Max. Unit I S Continuous Source Current 1,6 --- --- -8.6 A I SM Pulsed Source Current 2,6 V G D =0V , Force Current --- --- -17 A V SD Diode Forward Voltage V GS =0V , I S =-1A , T J Note : 1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper. 2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3.The EAS data shows Max. rating . The test condition is V DD =-25V,V GS =-10V,L=0.1mH,I AS =-28.6A 4.The power dissipation is limited by 150℃ junction temperature 5.The Min. value is 100% EAS tested guarantee. 6.The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation. P-Channel Electrical Characteristics (T J =25 ℃, unless otherwise noted) Guaranteed Avalanche Characteristics Diode Characteristics UM4302

N-Ch and P-Ch Fast Switching MOSFETs 0 0.25 0.5 0.75 1 V DS Drain-to-Source Voltage (V) I D Drain Current (A) V GS =10V V GS =7V V GS =5V V GS =4.5V V GS =3V 2468 1 0 V GS (V) R DSON (mΩ) I D =8A V SD , Source-to-Drain Voltage (V) I S Source Current(A) T J =150℃ T J =25℃ 0 5 10 15 20 25 Q G , Total Gate Charge (nC) V GS , Gate to Source Voltage (V) V DS =20V I D =8A 0.2 0.6 1.4 1.8 -50 0 50 100 150 T J ,Junction Temperature (℃ ) Normalized V GS(th) 0.2 0.6 1.0 1.4 1.8 -50 0 50 100 150 T J , Junction Temperature (℃) Normalized On Resistance N-Channel Typical Characteristics Fig.1 Typical Output Characteristics Fig.2 On-Resistance vs. G-S Voltage Fig.3 Forward Characteristics of Reverse Fig.4 Gate-Charge Characteristics Fig.5 Normalized V GS(th) vs. T J Fig.6 Normalized R DSON vs. T J UM4302

N-Ch and P-Ch Fast Switching MOSFETs 100 1000 10000 1 5 9 1 31 72 12 5 V DS Drain to Source Voltage (V) Capacitance (pF) F=1.0MHz Ciss Coss Crss 0.01 0.10 1.00 10.00 100.00 0.1 1 10 100 1000 V DS (V) I D (A) 10us 100us 10ms 100ms DC T C =25℃ Single Pulse 0.01 0.1 t , Pulse Width (s) Normalized Thermal Response (R θJC 0.01 0.02 0.05 0.1 0.2 SINGLE P DM D = T ON T Jpeak = T C DM XR θJC T ON T DUTY=0.5 Fig.8 Safe Operating Area Fig.9 Normalized Maximum Transient Thermal Impedance Fig.7 Capacitance Fig.10 Switching Time Waveform Fig.11 Unclamped Inductive Switching Wave UM4302

N-Ch and P-Ch Fast Switching MOSFETs 0 0.5 1 1.5 2 DS , Drain-to-Source Voltage (V) D Drain Current (A) V GS =-10V V GS =-7V V GS =-5V V GS =-4.5V V GS =-3V 468 1 0 GS (V) R DSON (mΩ) I D =-8A 0.2 0.4 0.6 0.8 1 SD , Source-to-Drain Voltage (V) S Source Current(A) T J =150℃ T J =25℃ 2.5 7.5 0 5 10 15 20 25 Q G , Total Gate Charge (nC) GS Gate to Source Voltage (V) V DS =-15V I D =-1A 0.5 1.5 -50 0 50 100 150 T J ,Junction Temperature (℃) Normalized V GS(th) 0.5 1.0 1.5 2.0 -50 0 50 100 150 T J , Junction Temperature (℃) Normalized On Resistance P-Channel Typical Characteristics Fig.1 Typical Output Characteristics Fig.2 On-Resistance v.s Gate-Source Fig.3 Forward Characteristics of Reverse Fig.4 Gate-Charge Characteristics Fig.5 Normalized V GS(th) v.s T J Fig.6 Normalized R DSON v.s T J UM4302

N-Ch and P-Ch Fast Switching MOSFETs 100 1000 10000 1 5 9 13 17 21 25 DS , Drain to Source Voltage(V) Capacitance (pF) F=1.0MHz Ciss Coss Crss 0.01 0.10 1.00 10.00 100.00 0.1 1 10 100 DS (V) D (A) Tc=25 o C Single Pulse 100ms 100us 1ms 10ms DC 0.01 0.1 t , Pulse Width (s) Normalized Thermal Response (R θJC 0.01 0.02 0.05 0.1 0.2 SINGLE P DM D = T ON T Jpeak = T C DM XR θJC T ON T DUTY=0.5 Fig.8 Safe Operating Area Fig.9 Normalized Maximum Transient Thermal Impedance Fig.7 Capacitance Fig.10 Switching Time Waveform Fig.11 Unclamped Inductive Waveform UM4302