TSV AMKOR | Alldatasheet
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Silicon Via (TSV) Through Silicon Via (TSV) interconnects serve a wide range of 2.5D packaging applications and architectures. TSV technology allows state of the art packages to meet high performance, low-energy demands. Through Silicon Via (TSV) Wafer Finishing & Flip Chip Placement Through Silicon Via (TSV) interconnects have emerged to serve a wide range of 2.5D TSV packaging applications and architectures that demand very high performance and functionality at the lowest energy/performance metric. To enable the use of TSVs in these 2.5D TSV architectures, Amkor has developed a number of backend technology platforms for high volume processing of TSV-bearing wafers and assembly. It is important to distinguish that Amkor does not provide TSV formation in foundry wafers. Amkor’s TSV wafer process begins with 300 mm wafers in which “blind” TSVs have already been formed. Amkor’s wafer process includes thinning the wafers to expose the TSVs and creating backside (BS) metallization to complete the TSV interconnect structure. The TSV reveal and BS metallization process flow is commonly referred to as Middle-End-Of-Line (MEOL). Amkor’s MEOL production tooling and processes include: f Temporary wafer support bonding and de-bonding f TSV wafer thinning f TSV “soft” reveal, wafer backside passivation and chemo-mechanical planarization (CMP) f Cu redistribution as required on the interposer wafer backside f Lead-free plating of Cu micro-pillars or C4 backside interconnects Amkor’s Role in 2.5D TSV Packaging With TSV Interconnects Amkor has enabled TSV technology solutions for the backend processing of TSV wafers (MEOL), bumping and 2.5D TSV assemblies. This requires advanced capability in the following key areas: f Wafer support bonding and de-bonding of TSV-bearing wafers ▷ Temporary Wafer Support System (WSS) for thin wafer management f TSV MEOL processing ▷ Bonding and de-bonding of TSV-bearing wafers ▷ Wafer thinning to 100 μm (nominal) or thinner for 2.5D TSV products (per customer requirements) ▷ Wafer backside passivation ▷ TSV reveal process including CMP
Application GPU GPU AI GPU Large Interposer 2.5D Stacked Substrate (Cost Effective 2.5D) Configuration ASIC + HBM ASIC + 4HBM ASIC + 6HBM ASIC + 6HBM 2ASIC + 8HBM ASIC + 6HBM Pkg 41 x 31 mm 55 x 55 mm 55 x 55 mm 55 x 58 mm 85 x 85 mm 55 x 55 ABF 85 x 85 HDI Interposer 27 x 15 mm 43 x 34 mm 43 x 37 mm 47 x 34 mm 54 x 46 mm 45 x 34 mm ASIC 17 x 33 mm 32 x 26 mm 33 x 26 mm 33 x 26 mm 85 x 85 mm 32 x 24 mm Si Node 14 nm 12 nm 7 nm 5 nm TV TV Memory HBM2 HBM2 HBM2 HBM2E/3 HBM2E TV HBM2E TV Status LVM 2019 HVM 2019 HVM 2020 HVM 2023 Internally Qualified
2022 Customer Qualified
Through Silicon Via (TSV) 2.5D TSV Platform Examples of 2.5D TSV products are shown to demonstrate Amkor’s production capabilities. f Advanced assembly technology ▷ Micro-Cu pillar bumping of functional die ▷ Chip on Wafer (CoW) flip chip attach of functional die ▷ 300 mm interposer wafer molding ▷ Molded wafer backgrinding ▷ Large, molded CoW module attach to organic substrate ▷ 25-60 mm FCBGA body sizes for 2.5D TSV assembly integration ▷ Bare die (with stiffener), lidded and overmolded final assembly options available ▷ Intermediate electrical test for partially assembled modules (if customer design allows) f Advanced TSV wafer finishing ▷ Frontside and backside interposer wafer bumping ▷ 40 μm pitch Cu pillar and landing pad micro-bumps f Backside Cu redistribution qualified for the 2.5D TSV platform
Completed Si Interposer (w/TSVs) 2.5D TSV Reveal Processing (MEOL) “MEOL” TSV Reveal TSV Wafer Fabrication Frontside Bumping Backside BumpingMEOL1 MEOL2 Packaging Test Frontside (FS): Cu/Ni/Au pad Backside (BS): Cu RDL + organic passivation + Cu Pillar Completed 2.5D Structure C D E B A FS pad Fab BEOL TSV BS Cu RDL BS Cu pillar A B C D E Through Silicon Via (TSV) Fine Pitch Micro Copper Pillar Bumping – The Backbone of TSV Assemblies and Advanced Packaging
Chip on Wafer (CoW) Assembly Flow 2.5D CoW Assembly: Die Site Population on Wafer & Die Underfill 2.5D CoW Assembly: Wafer Overmold, Mold Backgrind and Module Thinning Final Stage of 2.5D CoW Assembly 2.5D CoW module Interposer wafer Top die 2 Top die 1 2.5D CoW module Top die 1 Top die 2 Top die 1 Top die 2 Interposer wafer 2.5D CoW module Top die 1 Top die 2 Singulated interposer FC substrate Top die 1 Through Silicon Via (TSV) C D E A B Top die CuP interconnect TSV BS Cu pillar Substrate A B C D E
Amkor’s 2.5D TSV Module Assembly Platform Through Silicon Via (TSV) Visit amkor.com or email sales@amkor.com for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2023 Amkor Technology, Incorporated. All Rights Reserved. TS107D-EN Rev Date: 04/23