SOT-23 AMKOR | Alldatasheet
Document overview
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Technical content
Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD‑020 moisture preconditioning. f Moisture sensitivity characterization: JEDEC level 3, 85°C/85% RH, 168 hours f uHAST: 130°C/85% RH, no bias, 96 hours f Temp cycle: ‑65°C/+150°C, 500 cycles f High temp storage: 150°C, 1000 hours Services and Support Amkor has a broad base of resources available to help customers bring quality products to market quickly and at the lowest possible cost. f Full package characterization f Thermal, mechanical stress and electrical performance modeling f Turnkey assembly, test and drop‑ship f World‑class reliability testing and failure analysis Test Services f Program generation/conversion f Wafer probe f Burn‑in capabilities f ‑55°C to +165°C test available f Strip test available Shipping Options f Aluminum canister f Tape and reel f Dry pack f Drop‑ship SOT‑23 (Small Outline Transistor) and TSOT (Thin Small Outline Transistor Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring very small footprints. These industry standard packages run in very high volume and provide a cost‑effective solution for a wide range of applications. Having up to 8 leads, these packages can handle small ICs that may have previously been placed in SOIC or TSSOP packages. SOT-23/TSOT DATA SHEET | LEADFRAME PRODUCTS
FEATURES
f Cu wire interconnect for low cost f Standard JEDEC and EIAJ package outlines f Turnkey test services, including strip test options f Green materials are standard – Pb‑free and RoHS compliant PROCESS HIGHLIGHTS f Au plated PCC wire is standard, Au and Ag wire available f Wafer backgrinding services available f Optional chip‑on‑lead construction using film die attach material f Matte Sn lead finish is standard f Laser mark on package body
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2021 Amkor Technology, Incorporated. All Rights Reserved. DS581O-EN Rev Date: 06/21 Visit amkor.com or email sales@amkor.com for more information. Cross Sections Die Up SOT-23/TSOT Die Down Configuration Options SOT-23/TSOT Nominal Package Dimensions (mm) Package Type Lead Count Body Width Body Length Body Thickness Overall Height Lead Pitch Tip-to-Tip JEDEC/EIAJ SOT‑23 TO‑236/SC‑59 TO‑253 TSOT* *TSOT may also be referenced as a TSOP Cu leadframe Wirebond Die A B Die attach adhesive Reduced pad Mold compoundC D E F Cu leadframe Die attach adhesive Mold compound A B Reduced pad Die WirebondC D E F B A FE DC A C B D E F