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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- Small and thermally enhanced package with the same power dissipation but 64% less footprint area than SOIC 8 ld
- Dual Cu Clip interconnect for better heat dissipation efficiency
- Al strap + wire option is also available
- Turnkey with test and packing services
- Green materials: Pb-free plating & halogen free mold compound New Developments
- Dual exposed pad for better thermal performance
- Thin wafer dicing with narrow saw streets
- Larger/higher density leadframe strips
- Environmentally friendly Pb-free solder paste
Questions? Contact us: marketing@amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2014, Amkor Technology Incorporated. All Rights Reserved. Visit Amkor Technology online for locations and to view the most current product information. DS612A Rev Date: 5-14 Cross-section – Option 1: Al Strap + Wire Cross-section – Option 2: Dual Cu Clip Shipping
- Tape and reel packing – 3000 pcs or 5000 pcs per reel – Tape width 12 mm – Reel Ф = 330 mm
- Barcode packing label
- Drop ship TSON8-FL