TC3741 TRANSCOM | Alldatasheet
Document overview
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Technical content
REV0_20070111 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 9.5 10.5 GHz 2W Single Bias MMIC FEATURES PHOTO ENLARGEMENT ! P-1 dB: 33 dBm ! Small Signal Gain: 11 dB ! Power Added Efficiency: 25 % ! IP3: 42 dBm ! Input/Output 50 Ω Match ! Bias condition: 1100 mA @ 10 V
DESCRIPTION
The TC3741 is a 2-stage PHEMT Single Bias MMIC power amplifier. It is designed for use in low cost and high volume 9.5~10.5 GHz band applications. The MMIC is matched to 50 Ω operation. It provides a typical gain of 11 dB and P1dB power of 33 dBm. Typical bias condition is 10V at 1100 mA. The MMIC is packaged in a copper based ceramic 10 pins power package. The copper based carrier of the package allows direct soldering of the device to the PCB. ELECTRICAL SPECIFICATIONS (TA=25 °°°°C) @ 10GHz, Vd=10V , Id=1100mA Symbol Conditions MIN TYP MAX UNIT SSG Small Signal Gain 10 11 dB P-1 dB Output Power at 1 dB Gain Compression 31.5 33 dBm IP3 Third Order Intercept Point 40 42 dBm VDD Supply V oltage 10 V olt IDD Current Supply Without RF 1100 mA ηa Power Added Efficiency 25 % Absolute Maximum Ratings Symbol Parameter/Conditions Min. Max. Units Vdd Drain-Source V oltage 11 V olts Pin RF Input Power 26 dBm Pt Power Dissipation 13 W Tch Operating Channel Temperature 175 °C TSTG Storage Temperature -65 175 °C Note: 1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2. Specifications subject to change without notice.
REV0_20070111 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 Evaluation Board PCB Material: RO4003 ER = 3.38 Thickness = 20 mil Unit: mil * DXF file of the PCB can be downloaded from our web-site at www.transcominc.com.tw * Application Notes: For better heat sinking and grounding, it's recommended to have the via holes beneath TC3741 filled with solder and have two screws installed on required heat sink plate besides TC3741 on the PCB area. C6, 1000pF ATC 0.7pF 0805 C1 TC3741 YYWW 386-350019-002 12ohm 9~11GHz_V1 T5+T6_ ATC 1pF 0805 Vd1 Diode, D1 C4, 0.1uF C3, 1000pF Vd2 C5, 10uF Evaluation Board Parts List Qty Part Type Reference Designator Description Manufacturer Part Number 1 Capacitor C1 Chip CAP (0805) 0.7PF±0.1PF A TC 600F0R7BT 1 Capacitor C2 Chip CAP (0805) 1.0PF±0.1PF A TC 600F1R0BT
2 Capacitor C3, C6 Chip CAP (0603) 1000PF±10% Murata GRM39X7R102K50V
1 Capacitor C4 Chip CAP (0603) 0.1µF±20% Murata GRM39Y5V104Z25V
1 Capacitor C5 Chip CAP (1210) 10µF±20% or
Chip CAP (1206) 10µF±20% Murata GRM42-6Y5V106Z25V or GRM31CF5E106ZA01L
1 Diode D1 Diode, 400V , 1A (SOD-123)
1 Resistor R1 Chip resistor (0603) 12 Ω±5%
Connection Diagram and PIN Descriptions Physical Dimensions (Unit:inchs)