TC1985 TRANSCOM | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
PRE.1_06/21/2006 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P 1 / 4 Preliminary 29 – 36 GHz 2W PA MMIC
FEATURES
- Pout: 34 dBm
- Small Signal Gain: 11 dB
- Bias Condition: 1300 mA @ 6 V
DESCRIPTION
The TC1985 is a two stages PHEMT high power amplifier MMIC that operates from 29 to 36 GHz. The amplifier provides a typical 11 dB of gain and delivers 34 dBm of Pout. The MMIC is fabricated using Transcom’s proprietary matured GaAs PHEMT process. The process features full passivation for increased performance and reliability. All devices are 100 % DC tested to assure consistent quality. Bond pads are gold plated for either thermocompression or thermosonic wire bonding. Backside gold plating is compatible with standard AuSn die-attach. ELECTRICAL SPECIFICATIONS (Ta = 25 °C) SYMBOL DESCRIPTION MIN TYP MAX UNITS FREQ Frequency Range 29 36 GHz SSG Small Signal Gain 11 dB Pout Output Power 34 dBm VSWR, IN Input VSWR 2:1 - VSWR, OUT Output VSWR 2:1 - VDD Supply V oltage 6 V olt Vg Gate V oltage -0.5 -0.8 -1.5 V olt IDD Current Supply Without RF 1300 mA IDRF Current Supply @ Pout 1800 mA PHOTO ENLARGEMENT
PRE.1_06/21/2006 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P 2 / 4 TYPICAL CHARACTERISTICS Pout VS Freq. & Gain VS Freq. 29 30 31 32 33 34 35 36 Frequency (GHz) Output Power (dBm) Gain (dB) øPout Gain÷
PRE.1_06/21/2006 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P 3 / 4 MECHANICAL OUTLINE Units: micrometer (inch) Thickness: 50.8 (0.002) Chip Size: ± 50.8 (0.002)
PRE.1_06/21/2006 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P 4 / 4 ASSEMBLY DIAGRAM RF IN RF OUT 190pF x 4 190pF x 4 Note: 1. Using 1mil Au wire. 2. Substrate Material : Al2O3 3. Substrate Thickness : 10 mil To Vd 10 mil Ag Ribbon To Vg 10 mil Ag Ribbon RIB : 130 x 280 x 8 mil