TA2024

TA2024 TRIPATH | Alldatasheet

Document overview

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Technical content

Features

¾Class-T architecture ¾Single Supply Operation ¾“Audiophile” Quality Sound ¾0.04% THD+N @ 9W, 4Ω ¾0.18% IHF-IM @ 1W, 4Ω ¾6W @ 8Ω, 0.1% THD+N ¾11W @ 4Ω, 0.1% THD+N ¾High Power ¾10W @ 8Ω, 10% THD+N ¾15W @ 4Ω, 10% THD+N ¾High Efficiency ¾88% @ 10W, 8Ω ¾81% @ 15W, 4Ω ¾Dynamic Range = 102 dB ¾Mute and Sleep inputs ¾Turn-on & turn-off pop suppression ¾Over-current protection ¾Over-temperature protection ¾Bridged outputs ¾36-pin Power SOP package Typical Performance THD+N (%) Output Power (W) THD+N versus Output Power 0.02 0.01 0.05 0.1 0.2 0.5 1 2 5 10 20500m RL= 4ΩRL= 8Ω VDD = 12V f = 1kHz Av = 12 BW = 22Hz - 22kHz

Page 2 TA2024 Preliminary, Rev. 1.0 Absolute Maximum Ratings (Note 1) SYMBOL PARAMETER Value UNITS VDD Supply Voltage 16 V V5 Input Section Supply Voltage 6.0 V SLEEP SLEEP Input Voltage -0.3 to 6.0 V MUTE MUTE Input Voltage -0.3 to V5+0.3 V ESDHBM ESD Susceptibility, All pins except pins 1,4 Human Body Model (Note2) Pins 1, 4 2000 1000 V V ESDMM ESD Susceptibility, Machine Model (Note 3) 200 V TSTORE Storage Temperature Range -40 to 150 °C TA Operating Free-air Temperature Range 0 to 70 °C TJ Junction Temperature 150 °C Note 1 : Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Note 2 : Human Body Model, 100pF discharged through a 1.5kΩ resistor. Note 3 : Machine Model, 200pF discharged directly to each pin Note 4 : See Power Dissipation Derating in the Applications Information section. Operating Conditions (Note 5) SYMBOL PARAMETER MIN. TYP. MAX. UNITS VDD Supply Voltage 8.5 12 13.2 V VIH High-level Input Voltage (MUTE, SLEEP) 3.5 V VIL Low-level Input Voltage (MUTE, SLEEP) 1 V Note 5: Recommended Operating Conditions indicate conditions for which the device is functional. See Electrical Characteristics for guaranteed specific performance limits.

TA2024 Preliminary, Rev. 1.0 Page 3

Electrical Characteristics

See Test/Application Circuit. Unless otherwise specified, VDD = 12V, f = 1kHz, Measurement Bandwidth = 22kHz, RL = 4Ω, TA = 25 °C, Package heat slug soldered to 2.8 square-inch PC pad. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITS PO Output Power (Continuous Average/Channel) THD+N = 0.1% R L = 4Ω R L = 8Ω THD+N = 10% R L = 4Ω R L = 8Ω 5.5 W W W W IDD,MUTE Mute Supply Current MUTE = V IH 5.5 7 mA IDD, SLEEP Sleep Supply Current SLEEP = V IH 0.25 2 mA Iq Quiescent Current V IN = 0 V 61 75 mA THD + N Total Harmonic Distortion Plus Noise PO = 9W/Channel 0.04 % IHF-IM IHF Intermodulation Distortion 19kHz, 20kHz, 1:1 (IHF) 0.18 0.5 % SNR Signal-to-Noise Ratio A-Weighted, POUT = 1W, RL = 8Ω 89 dB CS Channel Separation 30kHz Bandwidth 50 55 dB PSRR Power Supply Rejection Ratio Vripple = 100mV. 60 80 dB η Power Efficiency POUT = 10W/Channel, RL = 8Ω 88 % VOFFSET Output Offset Voltage No Load, MUTE = Logic Low 50 150 mV VOH High-level output voltage (FAULT & OVERLOAD) 3.5 V VOL Low-level output voltage (FAULT & OVERLOAD) 1 V eOUT Output Noise Voltage A-Weighted, input AC grounded 100 µV Note: Minimum and maximum limits are guaranteed but may not be 100% tested.

Page 4 TA2024 Preliminary, Rev. 1.0 Pin Description Pin Function Description 2, 3 DCAP2, DCAP1 Charge pump switching pins. DCAP1 (pin 3) is a free running 300kHz square wave between VDDA and DGND (12Vpp nominal). DCAP2 (pin 2) is level shifted 10 volts above DCAP1 (pin 3) with the same amplitude (12Vpp nominal), frequency, and phase as DCAP1. 4, 9 V5D, V5A Digital 5VDC, Analog 5VDC 5, 8, AGND1, AGND2, AGND3 Analog Ground 6 REF Internal reference voltage; approximately 1.0 VDC. 7 OVERLOADB A logic low output indicates the input signal has overloaded the amplifier. 10, 14 VP1, VP2 Input stage output pins. 11, 15 IN1, IN2 Single-ended inputs. Inputs are a “virtual” ground of an inverting opamp with approximately 2.4VDC bias. 12 MUTE When set to logic high, both amplifiers are muted and in idle mode. When low (grounded), both amplifiers are fully operational. If left floating, the device stays in the mute mode. This pin should be tied to GND if not used. 16 BIASCAP Input stage bias voltage (approximately 2.4VDC). 18 SLEEP When set to logic high, device goes into low power mode. If not used, this pin should be grounded

19 FAULT A logic high output indicates thermal overload, or an output is shorted to ground,

or another output. 20, 35 PGND2, PGND1 Power Grounds (high current)

22 DGND Digital Ground

24, 27; 31, 28 OUTP2 & OUTM2; OUTP1 & OUTM1 Bridged outputs 25, 26, 29, 30 VDD2, VDD2 VDD1, VDD1 Supply pins for high current H-bridges, nominally 12VDC. 13, 21, 23, 32, NC Not connected. Not bonded internally.

33 VDDA Analog 12VDC

36 CPUMP Charge pump output (nominally 10V above VDDA)

1 5VGEN Regulated 5VDC source used to supply power to the input section (pins 4 and 9). FAULT PGND2 NC NC VDD2 OUTM2 OUTM1 VDD1 NC VDDA NC PGND1 CPUMP DCAP2 AGND3 BIASCAP IN2 VP2 MUTE IN1 VP1 V5A AGND2 OVERLOADB REF AGND1 V5D DCAP1 36-pin Power SOP Package (Top View) +5VGEN 36 OUTP1 VDD1 VDD2 OUTP2 DGND NC SLEEP

TA2024 Preliminary, Rev. 1.0 Page 5 Application / Test Circuit TA2024 RL 4Ω or *8Ω MUTE FAULT OVERLOADB (+12V) CI 2.2uF VP1 VP2 IN1 IN2 OUTP1 OUTM1 OUTP2 OUTM2 VDDA +5VGEN BIASCAP DCAP2 DCAP1 CI 2.2uF CA 0.1uF CD 0.1uF CPUMP RF 20KΩ RZ 10Ω, 1/2W RZ 10Ω, 1/2W CZ 0.47uF CP 1uF SLEEP +12V 0.1uF REF RREF 8.25KΩ, 1% 1meg Ω All Diodes Motorola MBRS130T3 * Use Co = 0.22µF for 8 Ohm loads VDD1 PGND1 VDD1 PGND1 VDD2 VDD2 PGND2 PGND2 Note: Analog and Digital/Power Grounds must be connected locally at the TA2024 CS 0.1uF CS 0.1uF To Pin 1 V5D AGND1 AGND2 V5A CS 0.1uFDGND VDD1 PGND2 35PGND1 180uF, 16V VDD2 VDD Processing Modulation Processing Modulation *Co 0.47uF Lo 10uH, 2A (Pin 8) Analog Ground Digital/Power Ground (Pin 35) (Pin 35) (Pin 20) (Pin 20) To Pins 4,9 RI 20KΩ (Pin 8) RF 20KΩ RI 20KΩ AGND317 180uF, 16V CSW CSW *Co 0.47uF Lo 10uH, 2A RL 4Ω or *8Ω Lo 10uH, 2A Lo 10uH, 2A *Co 0.47uF *Co 0.47uF CZ 0.47uF CSW 0.1uF CSW 0.1uF CS 0.1uF DO DO DO DO CCM 0.1uF CCM 0.1uF (Pin 35) (Pin 20) NC VDD1 VDD2

Page 6 TA2024 Preliminary, Rev. 1.0 External Components Description (Refer to the Application/Test Circuit) Components Description RI Inverting Input Resistance to provide AC gain in conjunction with R F. This input is biased at the BIASCAP voltage (approximately 2.4VDC). RF Feedback resistor to set AC gain in conjunction with R I; )R/R(12A IFV = . Please refer to the Amplifier Gain paragraph in the Application Information section. CI AC input coupling capacitor which, in conjunction with R I, forms a highpass filter at )CR2(1f IIC π= RREF Bias resistor. Locate close to pin 6 and ground at pin 8. CA BIASCAP decoupling capacitor. Should be located close to pin 16. CD Charge pump input capacitor. This capacitor should be connected directly between pins 2 and 3 and located physically close to the TA2024. CP Charge pump output capacitor that enables efficient high side gate drive for the internal H- bridges. To maximize performance, this capacitor should be connected directly between pin 36 (CPUMP) and pin 34 (VDDA). Please observe the polarity shown in the Application/ Test Circuit. CS Supply decoupling for the low current power supply pins. For optimum performance, these components should be located close to the pin and returned to their respective ground as shown in the Application/Test Circuit. CSW Supply decoupling for the high current, high frequency H-Bridge supply pins. These components must be located as close to the device as possible to minimize supply overshoot and maximize device reliability. Both the high frequency bypassing (0.1uF) and bulk capacitor (180uF) should have good high frequency performance including low ESR and low ESL. Panasonic HFQ or FC capacitors are ideal for the bulk capacitor. CZ Zobel Capacitor. RZ Zobel resistor, which in conjunction with C Z, terminates the output filter at high frequencies. The combination of RZ and CZ minimizes peaking of the output filter under both no load conditions or with real world loads, including loudspeakers which usually exhibit a rising impedance with frequency. DO Schottky diodes that minimize undershoots of the outputs with respect to power ground during switching transitions. For maximum effectiveness, these diodes must be located close to the output pins and returned to their respective PGND. Please see Application/Test Circuit for ground return pin. LO Output inductor, which in conjunction with C O, demodulates (filters) the switching waveform into an audio signal. Forms a second order filter with a cutoff frequency of )CL2(1f OOC π= and a quality factor of OOOL CLCRQ = . CO Output capacitor. CCM Common Mode Capacitor.

TA2024 Preliminary, Rev. 1.0 Page 7 Typical Performance Characteristics Channel Separation versus Frequency Frequency (Hz) Channel Separation (dBr) VDD = 12V Pout = 1W/Channel RLoad = 4Ω Av = 12 BW = 22Hz - 22kHz -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 20 20k50 100 200 500 1k 2k 5k 10k THD+N (%) Frequency (Hz) THD+N versus Frequency 10 20k20 50 100 200 500 1k 2k 5k 10k VDD = 12V Pout = 5W/Channel Av = 12 BW = 22Hz - 22kHz 0.01 0.02 0.05 0.1 0.2 0.5 RL = 4Ω RL = 8Ω Intermodulation Performance Frequency (Hz) FFT (dBr) 50 30k1k 2k 5k 10k 20k -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 VDD = 12V Pout = 1W/Channel RLoad = 4Ω 0dBr = 12Vrms 19kHz, 20kHz, 1:1 Av = 11.7 BW = 10Hz - 80kHz Output Amplitude (dBr) Frequency (Hz) Frequency Response VDD = 12V Pout = 1W RLoad = 4Ω Av = 12 BW = 22Hz - 22kHz -1.5 -0.5 +0.5 +1.5 +2.5 -2.5 10 20k20 50 100 200 500 1k 2k 5k 10k RL = 4Ω RL = 8Ω Efficiency versus Output Power Output Power (W) Efficiency (%) VDD = 12V f = 1kHz Av = 12 THD+N < 10% 0 5 10 15 20 100 Noise Floor Frequency (Hz) Noise FFT (dBV) -140 -120 -100 -80 -60 -40 -20 20 20k50 100 200 500 1k 2k 5k 10k VDD = 12V Pout = 0W RLoad = 4Ω Av = 12 BW = 22Hz - 22kHz A-Weighted Filter

Page 8 TA2024 Preliminary, Rev. 1.0

Application Information

The TA2024 is a power (high current) amplifier that operates at relatively high switching frequencies. The outputs of the amplifier switch between the supply voltage and ground at high speeds while driving high currents. This high-frequency digital signal is passed through an LC low-pass filter to recover the amplified audio signal. Since the amplifier must drive the inductive LC output filter and speaker loads, the amplifier outputs can be pulled above the supply voltage and below ground by the energy in the output inductance. To avoid subjecting the TA2024 to potentially damaging voltage stress, it is critical to have a good printed circuit board layout. It is recommended that Tripath’s layout and application circuit be used for all applications and only be deviated from after careful analysis of the effects of any changes. Please contact Tripath Technology for further information regarding reference design material regarding the TA2024. Amplifier Gain The gain of the TA2024 is set by the ratio of two external resistors, R I and R F, and is given by the following formula: I F I O R R12V V = where VI is the input signal level and VO is the differential output signal level across the speaker. 9 Watts of RMS output power results from an 8.485V RMS signal across an 8 Ω speaker load. If RF = RI, then 9 Watts will be achieved with 0.707V RMS of input signal. )W98()PR(V485.8 OLRMS ∗Ω=∗= Protection Circuits The TA2024 is guarded against over-temperature and over-current conditions. When the device goes into an over-temperature or over-current state, the FAULT pin goes to a logic HIGH state indicating a fault condition. When this occurs, the amplifier is muted, all outputs are TRI-STATED, and will float to 1/2 of V DD. Over-temperature Protection An over-temperature fault occurs if the junction temperature of the part exceeds approximately 155°C. The thermal hysteresis of the part is approximately 45 °C, therefore the fault will automatically clear when the junction temperature drops below 110°C.

TA2024 Preliminary, Rev. 1.0 Page 9 Over-current Protection An over-current fault occurs if more than approximately 7 amps of current flows from any of the amplifier output pins. This can occur if the speaker wires are shorted together or if one side of the speaker is shorted to ground. An over-current fault sets an internal latch that can only be cleared if the MUTE pin is toggled or if the part is powered down. Alternately, if the MUTE pin is connected to the FAULT pin, the HIGH output of the FAULT pin will toggle the MUTE pin and automatically reset the fault condition. Overload The OVERLOADB pin is a 5V logic output. When low, it indicates that the level of the input signal has overloaded the amplifier resulting in increased distortion at the output. The OVERLOADB signal can be used to control a distortion indicator light or LED through a simple buffer circuit, as the OVERLOADB cannot drive an LED directly. Sleep Pin The SLEEP pin is a 5V logic input that when pulled high (>3.5V) puts the part into a low quiescent current mode. This pin is internally clamped by a zener diode to approximately 6V thus allowing the pin to be pulled up through a large valued resistor (1meg Ω recommended) to V DD. To disable SLEEP mode, the sleep pin should be grounded. Fault Pin The FAULT pin is a 5V logic output that indicates various fault conditions within the device. These conditions include: low supply voltage, low charge pump voltage, low 5V regulator voltage, over current at any output, and junction temperature greater than approximately 155 °C. All faults except overcurrent all reset upon removal of the condition. The FAULT output is capable of directly driving an LED through a series 200 Ω resistor. If the FAULT pin is connected directly to the MUTE input an automatic reset will occur in the event of an over-current condition.

Page 10 TA2024 Preliminary, Rev. 1.0 Power Dissipation Derating For operating at ambient temperatures above 25 °C the device must be derated based on a 150 °C maximum junction temperature, TJMAX as given by the following equation: JA AJMAX DISS )TT(P θ where… P DISS = maximum power dissipation TJMAX = maximum junction temperature of TA2024 TA = operating ambient temperature θJA = junction-to-ambient thermal resistance Where θJA of the package is determined from the following graph: In the above graph Copper Area is the size of the copper pad on the PC board to which the heat slug of the TA2024 is soldered. The heat slug must be soldered to the PCB to increase the maximum power dissipation capability of the TA2024 package. Soldering will minimize the likelihood of an over- temperature fault occurring during continuous heavy load conditions. The vias used for connecting the heatslug to the copper area on the PCB should be 0.013” diameter. ΘΘΘΘ JA vs Copper Area 0123456 Copper Area (square inches) JA (oC/W) Pdiss - 1.35W Pdiss - 2W Pdiss - 3.4W

TA2024 Preliminary, Rev. 1.0 Page 11 Performance Measurements of the TA2024 The TA2024 operates by generating a high frequency switching signal based on the audio input. This signal is sent through a low-pass filter (external to the Tripath amplifier) that recovers an amplified version of the audio input . The frequency of the switching pattern is spread spectrum and typically varies between 100kHz and 1.0MHz, which is well above the 20Hz – 20kHz audio band. The pattern itself does not alter or distort the audio input signal but it does introduce some inaudible components. The measurements of certain performance parameters, particularly noise related specifications such as THD+N, are significantly affected by the design of the low-pass filter used on the output as well as the bandwidth setting of the measurement instrument used. Unless the filter has a very sharp roll-off just beyond the audio band or the bandwidth of the measurement instrument is limited, some of the inaudible noise components introduced by the Tripath amplifier switching pattern will degrade the measurement. One feature of the TA2024 is that it does not require large multi-pole filters to achieve excellent performance in listening tests, usually a more critical factor than performance measurements. Though using a multi-pole filter may remove high-frequency noise and improve THD+N type measurements (when they are made with wide-bandwidth measuring equipment), these same filters degrade frequency response. The TA2024 Evaluation Board uses the Test/Application Circuit in this data sheet, which has a simple two-pole output filter and excellent performance in listening tests. Measurements in this data sheet were taken using this same circuit with a limited bandwidth setting in the measurement instrument.

Page 12 TA2024 Preliminary, Rev. 1.0

Package Information

36-Lead Power Small Outline Package (PSOP), compliant with JEDEC outline MO-166, variation AE: 3 2 1 E TOP VIEW BOTTOM VIEW e b D END VIEWSIDE VIEW SEE DETAIL "A"

2 PLACES

3.10 REF

3.35 REF

0.20 +/- 0.10 3.15 +/- 0.15 Dimension Min. Nom. Max. b 0.22 --- 0.38 c 0.23 --- 0.32 D 15.80 15.90 16.00 D1 9.40 --- 9.80 E 13.90 14.20 14.50 E1 10.90 11.00 11.10 E2 --- --- 2.90 E3 5.80 --- 6.20 e 0.65 BSC. L1 0.35 BSC. L 0.80 --- 1.10 L

1.60 REF

0.15 REF

4º +/- 4º DETAIL "A" c GAUGE PLANE Note: All dimensions are in millimeters. Package Dimensions for TYPE 1

TA2024 Preliminary, Rev. 1.0 Page 13 3 2 1 E TOP VIEW BOTTOM VIEW e b D END VIEWSIDE VIEW SEE DETAIL "A" 2.24 0.20 +/- 0.10 3.15 +/- 0.15 Dimension Min. Nom. Max. b 0.25 --- 0.38 c 0.23 --- 0.32 D 15.80 15.90 16.00 D1 9.00 --- 13.00 E 13.90 14.20 14.50 E1 10.90 11.00 11.10 E2 --- --- 2.90 E3 5.80 --- 6.20 e 0.65 BSC. L1 0.35 BSC. L 0.80 --- 1.10 L 4º +/- 4º DETAIL "A" c GAUGE PLANE Note: All dimensions are in millimeters. Package Dimensions for TYPE 2

Page 14 TA2024 Preliminary, Rev. 1.0 Tripath, Class T, Combinant Digital, DPP and Digital Power Processing are trademarks of Tripath Technology Inc. Other trademarks referenced in this document are owned by their respective companies. Tripath Technology Inc. reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Tripath does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. TRIPATH’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITOUT THE EXPRESS WRITTEN CONSENT OF THE PRESIDENT OF TRIPATH TECHNOLOGY INC. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in this labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. For more information on Tripath products, visit our web site at: www.tripath.com TRIPATH TECHNOLOGY, INC.

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