SSOP-V01 AMKOR | Alldatasheet

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Technical content

JEDEC standard test boards Reliability Qualification Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD‑020 moisture preconditioning. f Moisture sensitivity characterization: JEDEC level 3, 30°C/60% RH, 192 hours f uHAST: 130°C/85% RH, no bias, 96 hours f Temp cycle: ‑65°C/+150°C, 500 cycles f High temp storage: 150°C, 1000 hours SSOP (Shrink Small‑Outline Package) and QSOP (Quarter‑Size Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. These industry standard IC packages yield a significant reduction in size while running in high volume and provide value added, low‑cost solutions for a wide range of applications. SSOP/QSOP DATA SHEET | LEADFRAME PRODUCTS Thermal Performance Forced Convection, Single-Layer PCB Package Body Size (mm) Pad Size (mm) θJA at (°C/W) by Velocity (LFPM) 0 200 500 Electrical Performance Simulated Results @ 100 MHz Package Body Size (mm) Pad Size (mm) Lead Inductance (nH) Bulk Capacitance (pF) Self Resistance (mF) 20 Ld 5.3 x 7.2 3.9 x 5.4 Longest Shortest 2.260 0.958 0.395 0.209 19.0 9.10 28 Ld 3.9 x 9.9 2.4 x 4.8 Longest Shortest 1.590 0.757 0.376 0.198 14.1 7.53 28 Ld 5.3 x 10.2 3.9 x 5.1 Longest Shortest 2.510 0.928 0.463 0.206 21.5 9.57

FEATURES

f Cu wire interconnect for low cost f Standard JEDEC package outlines f Multi‑die production capability f Turnkey test services, including strip test options f Green materials are standard – Pb‑free and RoHS compliant f Stealth dicing (narrow saw streets) f Larger/Higher density leadframe strips f Leadframe roughening for improved MSL capability PROCESS HIGHLIGHTS f Au plated PCC wire is standard, Au and Ag wire available f Wafer backgrinding services available f Multiple die and die stacking capability f NiPdAu (PPF) lead finish is standard, matte Sn is optional f Laser mark on package body

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2021 Amkor Technology, Incorporated. All Rights Reserved. DS360R-EN Rev Date: 12/21 Visit amkor.com or email sales@amkor.com for more information. Shipping f Clear anti‑static tube, 20 inch f Tape and reel f Dry pack f Drop ship SSOP/QSOP Cross Section SSOP/QSOP Configuration Options SSOP/QSOP Nominal Package Dimensions (Inches – Unless Otherwise Specified) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC Factory Package Outline Drawing # SSOP 14/16 5.3 mm

150 P1 32289

20 5.3 mm 24 5.3 mm 28 5.3 mm

137 P1 32864

Amkor has a broad base of resources available to help customers bring quality products to market quickly and at the lowest possible cost. f Full package characterization f Thermal, mechanical stress and electrical performance modeling f Turnkey assembly, test and drop ship f World‑class reliability testing and failure analysis Test Services f Program generation/conversion f Wafer probe f Burn in capabilities f ‑ 55°C to +165°C test available f Strip test available Wirebond Die attach adhesive Mold compound A B Die attach pad Cu leadframe C D E CA B E D