PSMC AMKOR | Alldatasheet
Document overview
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Technical content
With both 2 and 3 lead versions available, the PSMC package is suitable for high‑efficiency diode as well as transistor applications. f Schottky Barrier Diodes (SBDs) f Rectifier & Zener Diodes f Transient Voltage Suppressors (TVS) f MOSFETs Reliability Qualification Amkor devices are assembled with proven reliable semiconductor materials. f All reliability test include JSTD‑020 moisture pre‑conditioning except high temperature storage f Moisture sensitivity characterization: JEDEC level 1 85°C/85% RH, 168 hours, IR reflow 260°C 3x f uHAST: 130°C/85% RH, no bias, 96 hours f Temperature cycle: ‑65~150°C, 2000 cycles f High temperature storage: 150°C for 1000 hours Test Services Amkor offers full turnkey business for all power products, with the capability to test various types of power devices including MOSFETs, bipolar transistors, IGBTs, diodes and regulator ICs/intelligent power devices. f Amkor power test capability ▷ Static test (DC) ▷ Dynamic test (AC, switching/trr, capacitance/Rg) ▷ Destruction test (inductive load/VSUS) ▷ Thermal resistance (ΔVDS, ΔmV, etc.) f Program generation/conversion f Failure analysis f Available test/handling technology f Integrated marking, vision inspection and tape & reel services The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization. The Cu clip structure of interconnect features reduces electrical resistance and enhances thermal performance compared to wirebonded products. f This package may also be known as ▷ TO277-A ▷ SMPC ▷ CFP15 PSMC DATA SHEET | POWER PRODUCTS
FEATURES
f Cu connector structure to reduce inductance and resistance f Enhanced thermal properties f Turnkey with test and packing services f Green materials: Pb‑free plating & halogen-free mold compound NEW DEVELOPMENTS f Larger/higher‑density leadframe strips f Environmentally‑friendly Pb‑free solder paste PROCESS HIGHLIGHTS f Bare copper leadframe with no plating f Interconnect: Cu clips technology for better electrical and thermal performance f Plating: 100% Matte Sn f Marking: Pen‑type laser
Visit amkor.com or email sales@amkor.com for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2021 Amkor Technology, Incorporated. All Rights Reserved. DS616D-EN Rev Date: 02/21 Package Outline Drawing
3 Lead
Cross Sections (3 Lead) Single Clip Standard Materials f Leadframe: Bare copper f Die attach: Solder paste f Interconnect: Cu clips f Mold compound: Halogen‑free Shipping f Tape and reel packing ▷ 6000 pcs per reel ▷ Tape width: 12 mm ▷ Reel Ф = 330 mm f Barcode packing label f Drop ship PSMC
2 Lead (Future Development)
A B C D E C A B B C D E C A B B C D E Mold compound Die Cu clip Leadframe Solder paste A B C D E