AG-ALLOY AMKOR | Alldatasheet

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Note: Contact Amkor for detailed production and development status of specific package families Free Air Ball (FAB) Hardness (Hv) A huge increase in the price of gold (Au) has driven the need for lower cost wire materials. Bare copper, Palladium-Coated Copper (PCC), Au-coated PCC (Au PCC) and silver (Ag) alloy wires have emerged as alternatives to gold bond wires. Copper-based wires are low cost and have excellent electrical resistivity. However, the hardness of copper makes it difficult to use in many applications such as those with fragile bond pad structures. For these applications, Ag-Alloy offers properties similar to those of gold while its cost is similar to that of Au PCC. Package Families Using Ag-Alloy Wire Devices CABGA PSOP LQFP SC70 MicroLeadFrame® (QFN) SCSP MQFP SOIC PBGA SOT-23 PDIP SSOP PLCC TQFP fcCSP TSSOP Silver Wirebonding TECHNOLOGY SOLUTIONS In Production In Development Process Nodes 14 nm <14 nm Wire Diameter 18 µm 15 µm Inline Bond Pad Pitch 40 µm 35 µm Staggered Bond Pad Pitch 25/50 µm 20/40 µm Standoff Stitch Bonding Pad Pitch 50 µm 40 µm Ag-Alloy Wire Readiness AMKOR OVERVIEW Amkor entered volume manufacturing in 2013. Five package families (laminate/leadframe) are in volume production with >50 other packages under qualification and evaluation. KEY FEATURES f Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage f Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures BENEFITS Ag-Alloy wire is the best low-cost replacement for applications that need: f Die-to-die bonding, waterfall bonding and very thin AI pad f Ultra-fine bond pad pitch (BPP) and small bond pad openings (BPO) with less AI splash f Ultra-low loop height f Ag alloy has higher resistivity than Au and PCC

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2022 Amkor Technology, Incorporated. All Rights Reserved. TS108E-EN Rev Date: 02/22 Visit amkor.com or email sales@amkor.com for more information. Silver Wirebonding Note: Numbers in the table above are based on wire diameter of 0.8 mil Ag-Alloy Au Au PCC Impact Wire Cost Lower Cost Expensive Lowest Cost Au PCC And Ag-Alloy Wires Are Significantly Cheaper Than Au Wire FAB Hardness Soft Soft Hard Harder Materials Cause Cratering, Bond Pad Crack Process Windows (Force, Power, Time) Wide Wide Narrow Wider Process Window Improves Manufacturability For Devices With Fragile Bond Pad Structures AI Splash Minimal Minimal More Less Aluminum Splash Is Better For Fine Pitch And Small BPO Ultra-low Loop Capability Excellent Excellent Limited Ultra-low Loop Capability Allows Thinner Packages Resistivity Good Better Best Lower Resistivity Is Better For High Current Carrying Applications Ag-Alloy Wire Readiness Ag-Alloy Au Au PCC Physical Properties Hardness (Hv) Free Air Ball (EFO = 120 mA) 50~60 44~49 70~80 HAZ 50~60 44~49 55~65 Wire 60~70 49~55 60~70 HAZ Length (µm) 60~80 60~80 80~100 Density (g/cm2) 10.58 19.2 8.98 Elastic Modulus (Gpa) 60~70 80~90 90~100 Recrystallization Temp. (°C) 500~550 500~550 500~550 Melting Point (°C) 980~1010 1060~1080 1080~1100 Fusing Current (A, Length = 10 mm) 0.44 0.47 0.58 Resistivity (uΩ cm) @ 20°C 3.3 2.9 1.9 Thermal Conductivity (W/mk) 429 317 401 Coefficient Of Thermal Expansion (0 ~ 100°C, ×10-6/K) 19 14 17 Elongation (%) 2~12 2~7 3~17 Material Composition Properties of Different Wire Materials