RT9742

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Technical content

Features

 70mΩΩΩΩΩ/55mΩΩΩΩΩ (typ.) N-MOSFET Switch  Operating Range : 2.7V to 6V  Reverse Blocking Current  Under Voltage Lockout  Deglitched Fault Report (FLG)  Thermal Protection with Fold-back  Over Current Protection  Short Circuit Protection Pin Configurations (TOP VIEW) SOT-23-3 VIN VOUT GND VOUT GND VIN VOUT EN TSOT-23-5 (For RT9742M Only) TSOT-23-5 / TSOT-23-5 (FC) VOUT GND VIN FLG EN/EN GND VOUT RT9742 COUT VBUS GND Data Supply Voltage 2.7V to 6V VIN Over-Current USB Controller FLG CIN Chip Enable EN/EN

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Ordering and Marking Information Version Product Code Current Discharge Function EN Function Package Active High Active Low Internal Pull High TSOT-23-5 (FC) TSOT-23-5 SOT-23-3 RT9742AGJ5F 07= 3A Yes V V RT9742BGJ5F 06= 3A Yes V V RT9742ANGJ5F 0F= 3A No V V RT9742BNGJ5F 0E= 3A No V V RT9742CGJ5F 05= 2A Yes V V RT9742DGJ5F 04= 2A Yes V V RT9742CNGJ5F 0D= 2A No V V RT9742DNGJ5F 0C= 2A No V V RT9742CGJ5 0K= 2A Yes V V RT9742DGJ5 0J= 2A Yes V V RT9742CNGJ5 11= 2A No V V RT9742DNGJ5 10= 2A No V V RT9742JNGV 6A= 2A No V V RT9742EGJ5F 03= 1.5A Yes V V RT9742FGJ5F 02= 1.5A Yes V V RT9742ENGJ5F 0B= 1.5A No V V RT9742FNGJ5F 0A= 1.5A No V V RT9742EGJ5 0H= 1.5A Yes V V RT9742FGJ5 0G= 1.5A Yes V V RT9742ENGJ5 0Z= 1.5A No V V RT9742FNGJ5 0Y= 1.5A No V V RT9742KNGV 69= 1.5A No V V RT9742GGJ5F 01= 1A Yes V V RT9742HGJ5F 00= 1A Yes V V RT9742GNGJ5F 09= 1A No V V RT9742HNGJ5F 08= 1A No V V RT9742GGJ5 0F= 1A Yes V V RT9742HGJ5 0E= 1A Yes V V RT9742GNGJ5 0X= 1A No V V RT9742HNGJ5 0W= 1A No V V RT9742LNGV 68= 1A No V V RT9742MGJ5 14= 1.5A Yes V V RT9742MNGJ5 15= 1.5A No V V

DS9742-00 July 2015 www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Functional Pin Description Pin Name Pin Function VOUT Output Voltage GND Ground. FLG Fault FLAG Output. EN/EN Chip Enable (Active High/Low). VIN Power Input Voltage. Note : Richtek products are :  RoHS compliant and compatible with the current require- ments of IPC/JEDEC J-STD-020.  Suitable for use in SnPb or Pb-free soldering processes.

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Function Block Diagram TSOT-23-5 / TSOT-23-5 (FC) Package Gate Control Output Voltage Detection Delay Oscillator UVLO Charge Pump Bias Thermal Protection Current Limiting VOUT VIN GND EN/EN FLG Auto Discharge Output Voltage Detection Gate Control VOUT Charge Pump VIN Bias GND Current Limiting Auto Discharge UVLO Thermal Protection Oscillator Output Voltage Detector Gate Control VOUT Charge Pump VIN Bias GND Current Limiting UVLO Thermal Protection Oscillator VOUT EN Auto Discharge

DS9742-00 July 2015 www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Operation Charge Pump and Drivers An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate of the MOSFET above the source. The driver controls the gate voltage of the power switch. Current Limit The RT9742 continuously monitors the output current for over-current protection to protect the system power, the power switch, and the load from damage during output short circuit. When an overload or short circuit occurs, the current-sense circuitry sends a control signal to the driver. The driver reduces the gate voltage and drives the power MOSFET into its saturation region, which switches the output into a constant-current mode and holds the current constant until the thermal shutdown occurs or the fault is removed. Under-Voltage Lockout A voltage-sense circuit monitors the input voltage. When the input voltage is above 2.4V, UVLO turns on the MOSFET switch. Thermal Shutdown The RT9742 continuously monitors the operating temperature of the power switch for over-temperature protection. The RT9742 turns off the power switch to prevent the device from damage if the junction temperature rises to approximately 140°C due to over-current or short- circuit conditions. The pass element turns on again after the junction temperature cools to 120°C. FLAG The RT9742 pulls low the open drain output FLAG after over current or over temperature condition occurring over approximately 10ms.

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Absolute Maximum Ratings (Note 1)  Power Dissipation, PD @ TA = 25°C  Package Thermal Resistance (Note 2)  ESD Susceptibility (Note 3) Recommended Operating Conditions (Note 4)

Electrical Characteristics

(VIN = 5V, CIN = 10μF, COUT = 0.1μF, TA = 25°C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Input Quiescent Current I Q Switch On, V OUT = Open -- 30 40 Input Shutdown Current I SHDN VIN = 5V, No Load on OUT, Device OFF , VEN = 0V or ENV = 5 V -- 0.1 1 Switch On Resistance RT9742XXJ5F RDS(ON) -- 55 -- RT9742XXJ5/V -- 70 -- Over Current Trip Threshold RT9742G/H/L ITRIP V IN = 5V, 100A/s ILIM 1.4 1.5 A RT9742E/F/K/M I LIM 2.1 2.25 RT9742C/D/J I LIM 2.8 3 RT9742A/B I LIM 4.2 4.5 Current Limit RT9742G/H/L ILIM V OUT = 1V 1 1.1 1.2 A RT9742E/F/K/M 1.5 1.65 1.8 RT9742C/D 2 2.2 2.4 RT9742A/B 3 3.3 3.6 RT9742J 1.8 2.15 2.5

DS9742-00 July 2015 www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Note 1. Stresses beyond those listed “Absolute Maximum Ratings ” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Note 2. θ JA is measured at T A = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. The thermal shutdown protection will react at high Ambient Temperature or low V IN due to R DS(ON) variation. Please refer to Application Information and Typical Operating Characteristics. Parameter Symbol Test Conditions Min Typ Max Unit EN/EN Threshold Logic_High Voltage VIH V IN = 2.7V to 6V 2 -- -- V Logic_Low Voltage VIL V IN = 2.7V to 6V -- -- 0.8 EN/EN Input Current EN/ENI VEN = 0V, ENV = 5 V 0.5 -- 0.5 A Output Leakage Current I LEAKAGE V EN = 0V, RLOAD = 0 -- 0.5 1 A Output Turn-On Rise Time T ON_RISE 10% to 90% of V OUT Rising -- 300 -- s Output ResistFLG ance FLGR ISINK = 1mA -- 10 --  FLG Off Current FLG_OFFI FLGV = 5 V -- 0.01 1 A FLG Delay Time T D From fault condition to FLG Assertion -- 10 -- ms Shutdown Auto-Discharge Resistance RDischarge V EN = 0V, VEN = 5V -- 10 --  Under-Voltage Lockout V UVLO V IN Rising -- -- 2.4 V Under-Voltage Hysteresis VUVLO V IN Decreasing -- 0.1 -- V Thermal Shutdown Protection T SD -- 140 -- °C Thermal Shutdown Hysteresis TSD -- 20 -- °C

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Typical Application Circuit Supply Voltage 2.7V to 6V VIN VOUT GND RT9742A/B/ C/D/E/F/G/H Over -Current VBUS GND USB Controller 10µF Pull-Up Resistor (10k to 100k) Ferrite Beads Data FLG EN/EN CIN COUT RT9742B/D/F/H Chip Enable RT9742A/C/E/G Chip Enable 0.1µF Supply Voltage 2.7V to 6V VIN VOUT GND RT9742J/K/L + VBUS GND 10µF Ferrite Beads Data CIN COUT 0.1µF VBUS GND COUT GND VOUT Data RT9742M VIN Ferrite Beads CIN Supply Voltage 2.7V to 6V EN 10µF 0.1µF

DS9742-00 July 2015 www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Typical Operating Characteristics Shutdown Current vs. Temperature 0.2 0.4 0.6 0.8 1.2 -50 -25 0 25 50 75 100 125 Temperature (°C) Shutdown Current (μA) 1 VIN = 5V, VEN = 0V Shutdown Current vs. Input Voltage 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Shutdown Current (μA) 1 VEN = 0V Quiescent Current vs. Input Voltage 24.5 25.0 25.5 26.0 26.5 27.0 27.5 28.0 28.5 29.0 29.5 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Quiescent Current (μA) No Load Quiescent Current vs. Temperature 26.8 27.0 27.2 27.4 27.6 27.8 28.0 28.2 28.4 -50 -25 0 25 50 75 100 125 Temperature (°C) Quiescent Current (μA) VIN = 5V, No Load On Resistance vs. Input Voltage 100 110 120 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) On Resistance (m )Ω TSOT-23-5 (FC) TSOT-23-5 On Resistance vs. Temperature 100 -50 -25 0 25 50 75 100 125 Temperature (°C) On Resistance (m ) TSOT-23-5 (FC) TSOT-23-5 VIN = 5V Ω

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. FLAG Delay Time vs. Input Voltage 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) FLAG Delay Time (ms) Current Limit Threshold vs. Input Voltage 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 2 . 533 . 544 . 555 . 56 Input Voltage (V) Current Limit Threshold (A) Output Voltage vs. Output Current Output Current (A) Output Voltage (V) VIN = 3.3V VIN = 5V UVLO Threshold vs. Temperature 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 -50 -25 0 25 50 75 100 125 Temperature (°C) UVLO Threshold (V) Falling Rising Current Limit Threshold vs. Temperature 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 -50 -25 0 25 50 75 100 Temperature (°C) Current Limit (A) VIN = 5V Over Current Trip Threshold vs. Temperature 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 -50 -25 0 25 50 75 100 Temperature (°C) Over Current Trip Threshold (A ) VIN = 5V

DS9742-00 July 2015 www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. VIN = 5V Time (2ms/Div) FLG Response VOUT (2V/Div) FLG (5V/Div) IIN (2A/Div) Time (200 μs/Div) Power On from EN VOUT (2V/Div) EN (5V/Div) IIN (2A/Div) No Load Time (2ms/Div) Power On from VIN VOUT (2V/Div) VIN (2V/Div) No Load Time (10ms/Div) Power Off from VIN VOUT (2V/Div) VIN (2V/Div)

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. D G S D G S Normal MOSFET RT9742 Soft-Start for Hot Plug-In Applications In order to eliminate the upstream voltage droop caused by the large inrush current during hot-plug events, the “soft-start” feature effectively isolates the power source from extremely large capacitive loads, satisfying the USB voltage droop requirements. Fault Flag The RT9742 series provides a FLG signal pin which is an N-Channel open drain MOSFET output. This open drain output goes low when current limit or the die temperature exceeds 140°C approximately. The FLG output is capable of sinking a 10mA load to typically 200mV above ground. The FLG pin requires a pull-up resistor, this resistor should be large in value to reduce energy drain. A 100kΩ pull-up resistor works well for most applications. In the case of an over-current condition, FLG will be asserted only after the flag response delay time, t D, has elapsed. This ensures that FLG is asserted only upon valid over-current conditions and that erroneous error reporting is eliminated. For example, false over-current conditions may occur during hot-plug events when extremely large capacitive loads are connected and causes a high transient inrush current that exceeds the current limit threshold. The FLG response delay time t D is typically 10ms. Under-Voltage Lockout Under-voltage lockout (UVLO) prevents the MOSFET switch from turning on until input the voltage exceeds 2.4V. If input voltage drops below than UVLO threshold, UVLO turns off the MOSFET switch. Under-voltage detection functions only when the switch is enabled. Current Limiting and Short-Circuit Protection The current limit circuitry prevents damage to the MOSFET switch and the hub downstream port but can deliver load current up to the current limit threshold of 3A through the switch of the RT9742A/B, 2A for RT9715C/D/J, 1.5A for RT9742E/F/K/M and 1A for RT9742G/H/L respectively. When a heavy load or short circuit is applied to an enabled switch, a large transient current may flow until the current

Application Information

The RT9742 is a single N-MOSFET high-side power switch with enable input, optimized for self-powered and bus- powered Universal Serial Bus (USB) applications. The RT9742 is equipped with a charge pump circuitry to drive the internal N-MOSFET switch; the switch's low R DS(ON), 70mΩ/55mΩ, meets USB voltage drop requirements; and a flag output is available to indicate fault conditions to the local USB controller. Input and Output V IN (input) is the power source connection to the internal circuitry and the drain of the MOSFET. VOUT (output) is the source of the MOSFET. In a typical application, current flows through the switch from VIN to V OUT toward the load. If VOUT is greater than VIN, current will flow from VOUT to VIN since the MOSFET is bidirectional when on. Unlike a normal MOSFET, there is no parasitic body diode between drain and source of the MOSFET, the RT9742 prevents reverse current flow if V OUT is externally forced to a higher voltage than VIN when the chip is disabled EN <0.8V or VEN > 2V). Chip Enable Input The switch will be disabled when the EN/EN pin is in a logic low/high condition. During this condition, the internal circuitry and MOSFET will be turned off. Floating the EN/EN may cause unpredictable operation. EN should not be allowed to go negative with respect to GND. The EN/EN pin may be directly tied to V IN (GND) to keep the part on.

DS9742-00 July 2015 www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. limit circuitry responds. Once this current limit threshold is exceeded, the device enters constant current mode until the thermal shutdown occurs or the fault is removed. Thermal Shutdown Thermal protection limits the power dissipation in RT9742. When the operation junction temperature exceeds 140°C, the OTP circuit starts the thermal shutdown function and turns the pass element off. The pass element turn on again after the junction temperature cools to 120°C. Power Dissipation The junction temperature of the RT9742 series depend on several factors such as the load, PCB layout, ambient temperature and package type. The output pin of the RT9742 can deliver the current of up to 3A (RT9742A/B), 2A (RT9742C/D/J), 1.5A (RT9742E/F/K/M) and 1A (RT9742G/H/L) respectively over the full operating junction temperature range. However, the maximum output current must be derated at higher ambient temperature to ensure the junction temperature does not exceed 125 °C. With all possible conditions, the junction temperature must be within the range specified under operating conditions. Power dissipation can be calculated based on the output current and the R DS(ON) of the switch as below. PD = RDS(ON) x IOUT2 Although the devices are rated for 3A, 2A, 1.5A and 1A of output current, but the application may limit the amount of output current based on the total power dissipation and the ambient temperature. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation : P D (MAX) = ( TJ (MAX) - TA ) / θJA Where TJ (MAX) is the maximum junction temperature of the die (125 °C) and T A is the maximum ambient temperature. The junction to ambient thermal resistance (θJA) for TSOT- 23-5 package at recommended minimum footprint is 250°C/W (θ JA is layout dependent). Universal Serial Bus (USB) & Power Distribution The goal of USB is to enable device from different vendors to interoperate in an open architecture. USB features include ease of use for the end user, a wide range of workloads and applications, robustness, synergy with the PC industry, and low-cost implementation. Benefits include self-identifying peripherals, dynamically attachable and reconfigurable peripherals, multiple connections (support for concurrent operation of many devices), support for as many as 127 physical devices, and compatibility with PC Plug-and-Play architecture. The Universal Serial Bus connects USB devices with a USB host: each USB system has one USB host. USB devices are classified either as hubs, which provide additional attachment points to the USB, or as functions, which provide capabilities to the system (for example, a digital joystick). Hub devices are then classified as either Bus-Power Hubs or Self-Powered Hubs. A Bus-Powered Hub draws all of the power to any internal functions and downstream ports from the USB connector power pins. The hub may draw up to 500mA from the upstream device. External ports in a Bus-Powered Hub can supply up to 100mA per port, with a maximum of four external ports. Self-Powered Hub power for the internal functions and downstream ports does not come from the USB, although the USB interface may draw up to 100mA from its upstream connect, to allow the interface to function when the remainder of the hub is powered down. The hub must be able to supply up to 500mA on all of its external downstream ports. Please refer to Universal Serial Specification Revision 2.0 for more details on designing compliant USB hub and host systems. Over-Current protection devices such as fuses and PTC resistors (also called polyfuse or polyswitch) have slow trip times, high on-resistance, and lack the necessary circuitry for USB-required fault reporting.

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. The faster trip time of the RT9742 power distribution allows designers to design hubs that can operate through faults. The RT9742 provides low on-resistance and internal fault- reporting circuitry to meet voltage regulation and fault notification requirements. Because the devices are also power switches, the designer of self-powered hubs has the flexibility to turn off power to output ports. Unlike a normal MOSFET, the devices have controlled rise and fall times to provide the needed inrush current limiting required for the bus-powered hub power switch. Supply Filter/Bypass Capacitor A 10μF low-ESR ceramic capacitor from V IN to GND, located at the device is strongly recommended to prevent the input voltage drooping during hot-plug events. However, higher capacitor values will further reduce the voltage droop on the input. Furthermore, without the bypass capacitor, an output short may cause sufficient ringing on the input (from source lead inductance) to destroy the internal control circuitry. The input transient must not exceed 7V of the absolute maximum supply voltage even for a short duration. Output Filter Capacitor A low-ESR 150 μF aluminum electrolytic or tantalum between VOUT and GND is strongly recommended to meet the 330mV maximum droop requirement in the hub V BUS (Per USB 2.0, output ports must have a minimum 120μF of low-ESR bulk capacitance per hub). Standard bypass methods should be used to minimize inductance and resistance between the bypass capacitor and the downstream connector to reduce EMI and decouple voltage droop caused when downstream cables are hot-insertion transients. Ferrite beads in series with V BUS, the ground line and the 0.1μF bypass capacitors at the power connector pins are recommended for EMI and ESD protection. The bypass capacitor itself should have a low dissipation factor to allow decoupling at higher frequencies. Voltage Drop The USB specification states a minimum port-output voltage in two locations on the bus, 4.75V out of a Self- Powered Hub port and 4.40V out of a Bus-Powered Hub port. As with the Self-Powered Hub, all resistive voltage drops for the Bus-Powered Hub must be accounted for to guarantee voltage regulation (see Figure 7-47 of Universal Serial Specification Revision 2.0). The following calculation determines V OUT(MIN) for multi- ple ports (NPORTS) ganged together through one switch (if using one switch per port, NPORTS is equal to 1) : VOUT (MIN) = 4.75V − [ II x ( 4 x RCONN + 2 x RCABLE ) ] − (0.1A x N PORTS x RSWITCH ) − VPCB Where RCONN = Resistance of connector contacts (two contacts per connector) RCABLE = Resistance of upstream cable wires (one 5V and one GND) RSWITCH = Resistance of power switch VPCB = PCB voltage drop The USB specification defines the maximum resistance per contact (RCONN) of the USB connector to be 30m Ω and the drop across the PCB and switch to be 100mV. This basically leaves two variables in the equation: the resistance of the switch and the resistance of the cable. If the hub consumes the maximum current (I I) of 500mA, the maximum resistance of the cable is 90mΩ. The resistance of the switch is defined as follows : R SWITCH = { 4.75V − 4.4V − [ 0.5A x ( 4 x 30mΩ + 2 x 90mΩ) ] − VPCB } ( 0.1A x NPORTS ) = (200mV − VPCB ) ( 0.1A x NPORTS ) If the voltage drop across the PCB is limited to 100mV, the maximum resistance for the switch is 250mΩ for four ports ganged together. The RT9742, with its maximum 100mΩ on-resistance over temperature, can fit the demand of this requirement.

©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Figure 1. Derating Curve of Maximum Power Dissipation on the maximum power dissipation. possible to the VIN pins of the RT9742. least 50-mil, 2 ounce copper for all VBUS traces. make them as large as feasible. reduce the coupling of transients between ports. and improve transient load performance. port to limit switching noise.

©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Figure 2. PCB Layout Guide

DS9742-00 July 2015 www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. Outline Dimension TSOT-23-5 Surface Mount Package Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 1.000 0.028 0.039 A1 0.000 0.100 0.000 0.004 B 1.397 1.803 0.055 0.071 b 0.300 0.559 0.012 0.022 C 2.591 3.000 0.102 0.118 D 2.692 3.099 0.106 0.122 e 0.838 1.041 0.033 0.041 H 0.080 0.254 0.003 0.010 L 0.300 0.610 0.012 0.024 A e b B D C H L

DS9742-00 July 2015www.richtek.com ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Ric htek Technology Corporation. TSOT-23-5 (FC) Surface Mount Package Min. Max. Min. Max. A 0.700 1.000 0.028 0.039 A1 0.000 0.100 0.000 0.004 B 1.397 1.803 0.055 0.071 b 0.300 0.559 0.012 0.022 C 2.591 3.000 0.102 0.118 D 2.692 3.099 0.106 0.122 e 0.838 1.041 0.033 0.041 H 0.080 0.254 0.003 0.010 L 0.300 0.610 0.012 0.024 Symbol Dimensions In Millimeters Dimensions In Inches

DS9742-00 July 2015 www.richtek.com Richtek Technology Corporation 14F, No. 8, Tai Yuen 1st Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnish ed by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringeme nts of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of R ichtek or its subsidiaries. A b B D C e H L SOT-23-3 Surface Mount Package Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.889 1.295 0.035 0.051 A1 0.000 0.152 0.000 0.006 B 1.397 1.803 0.055 0.071 b 0.356 0.508 0.014 0.020 C 2.591 2.997 0.102 0.118 D 2.692 3.099 0.106 0.122 e 1.803 2.007 0.071 0.079 H 0.080 0.254 0.003 0.010 L 0.300 0.610 0.012 0.024