RT9011_11 RICHTEK | Alldatasheet
Document overview
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Technical content
Features
z Wide Operating Voltage Ranges : 2.5V to 5.5V z Low-Noise for RF Application z No Noise Bypass Capacitor Required z Fast Response in Line/Load Transient z TTL-Logic-Controlled Shutdown Input z Low Temperature Coefficient zzzzz Dual LDO Outputs (300mA/300mA) zzzzz Ultra-low Quiescent Current 27μμμμμA/LDO zzzzz High Output Accuracy 2% zzzzz Short Circuit Protection zzzzz Thermal Shutdown Protection zzzzz Current Limit Protection zzzzz Short Circuit Thermal Folded Back Protection zzzzz Tiny TSOT-23-6 and 6-Lead/8-Lead/10-Lead WDFN Packages zzzzz RoHS Compliant and 100% Lead (Pb)-Free
Applications
zzzzz CDMA/GSM Cellular Handsets zzzzz Battery-Powered Equipment zzzzz Laptop, Palmtops, Notebook Computers zzzzz Hand-Held Instruments zzzzz PCMCIA Cards zzzzz Portable Information Appliances Marking Information For marking information, contact our sales representative directly or through a Richtek distributor located in your area. Code Voltage Code Voltage Code Voltage A 3.5 B 1.3 C 1.2 D 1.85 E 2.1 F 1.5 G 1.8 H 2 J 2.5 K 2.6 L 2.7 M 2.8 N 2.85 P 3 Q 3.1 R 3.2 S 3.3 T 2.65 V 2.9 W 1.6 X 3.15 Y 1.9 Available Voltage Version Note : Richtek products are : \ RoHS compliant and compatible with the current require- ments of IPC/JEDEC J-STD-020. \ Suitable for use in SnPb or Pb-free soldering processes. RT9011- Package Type J6 : TSOT-23-6 QW : WDFN-8L 2x2 (W-Type) QWA : WDFN-10L 3x3 (W-Type) QWB : WDFN-8L 3x3 (W-Type) QWC : WDFN-6L 1.6x1.6 (W-Type) Lead Plating System P : Pb Free G : Green (Halogen Free and Pb Free) Output Voltage : VOUT1/VOUT2 VOUT2 > VOUT1 is Recommended
DS9011-08 April 2011www.richtek.com Functional Pin Description Pin No. Pin Name Pin Function TSOT-23-6 WDFN-8L 2x2 WDFN-10L 3x3 WDFN-8L 3x3 WDFN-6L 1.6x1.6 5 1 1 1 1 VIN Supply Input. 4 2 2 2 2 EN1 Chip Enable1 (Active High). 3 3 3 3 3 EN2 Chip Enable2 (Active High). Exposed Pad (9) Exposed Pad (11) Exposed Pad (9) Exposed Pad (7) GND Common Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. 1 7 9 5 5 VOUT2 Channel 2 Output Voltage. 6 8 10 8 6 VOUT1 Channel 1 Output Voltage. -- 4, 6 4, 5, 7, 8 4, 7 -- NC No Internal Connection. Typical Application Circuit EN1 EN2 VOUT2 VOUT1 RT9011 GND VIN 1uF VOUT1 1uF VOUT2 1uF VIN Chip Enable CIN COUT1 COUT2 Pin Configurations (TOP VIEW) WDFN-8L 3x3 VIN NC EN1 VOUT1 NC GND VOUT2 EN2 GND WDFN-6L 1.6x1.6 VIN EN2 VOUT1 GND VOUT2EN1 GND WDFN-10L 3x3 VIN EN1 NC NC VOUT1 VOUT2 NC GND NC EN2 GND WDFN-8L 2x2 VIN NC EN1 VOUT1 VOUT2 NC GND EN2 GND TSOT-23-6 VIN EN1VOUT1 GND EN2VOUT2
DS9011-08 April 2011 www.richtek.com Function Block Diagram EN1 Current-Limit and Thermal Protection MOS Driver + - VOUT1 Shutdown and Logic Control VIN Error Amplifier VREF GND EN2 Current-Limit and Thermal Protection MOS Driver + - VOUT2 Shutdown and Logic Control Error Amplifier VREF GND 0.2uA 0.2uA
DS9011-08 April 2011www.richtek.com
Electrical Characteristics
Parameter Symbol Test Conditions Min Typ Max Unit Input Voltage VIN = 2.5V to 5.5V 2.5 -- 5.5 V Dropout Voltage (Note 5) VDROP I OU T = 300mA -- 240 330 mV Output voltage range VOUT 1.2 -- 3.6 V VOUT Accuracy ΔV I OU T = 1mA to 300mA −3 -- +3 % Line Regulation ΔVLINE VIN = (V OUT + 0.3V) to 5.5V or VIN > 2.5V, whichever is larger -- -- 0.2 %/V Load Regulation ΔVLOAD 1mA < I OU T< 300mA -- -- 0.6 % Current Limit RLOAD = 1Ω 330 450 700 mA Quiescent Current IQ V EN > 1.5V -- 58 80 μA Shutdown Current IQ_SD V EN < 0.4V -- -- 1 μA VIH V IN = 2.5V to 5.5V, Power On 1.5 -- -- EN Threshold VIL V IN = 2.5V to 5.5V, Shutdown -- -- 0.4 V (VIN = VOUT + 1V, VEN = VIN, CIN = COUT = 1μF, TA = −40°C to 85 °C, unless otherwise specified.) To be continued Recommended Operating Conditions (Note 4) Absolute Maximum Ratings (Note 1) z Power Dissipation, PD @ TA = 25°C z Package Thermal Resistance (Note 2) z ESD Susceptibility (Note 3)
DS9011-08 April 2011 www.richtek.com Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θ JA is measured in the natural convection at T A = 25°C on a low effective single layer thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Note 3. Devices are ESD sensitive. Handling precaution recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. The dropout voltage is defined as V IN -VOUT, which is measured when V OUT is VOUT(NORMAL) − 100mV. Note 6. It is guaranteed by design. Parameter Symbol Test Conditions Min Typ Max Unit Output Voltage TC -- 100 -- ppm/ °C VOU T Discharge Resistance in Shutdown (Note 6) VIN = 5V, EN1 = EN2 = GND -- 3 -- k Ω EN Pull Low Current IEN -- 0.2 -- μA Thermal Shutdown TSD -- 170 -- °C Thermal Shutdown Hysteresis ΔTSD -- 40 -- °C f = 100Hz -- 70 -- f = 1kHz -- 70 -- f = 10kHz -- 70 -- PSRR VIN = VOUT + 1V, COUT = 2.2μF ILOAD = 50mA PSRR dB Output Voltage Noise COU T1 = C OUT2 = 10uF, 10Hz to 100kHz, IOUT1 = IOUT2 = 1mA -- 100 -- uVrms
DS9011-08 April 2011www.richtek.com Typical Operating Characteristics Quiescent Current vs. Temperature -50 -25 0 25 50 75 100 125 Temperature Quiescent Current (uA) RT9011-GS VIN = VEN = 4.3V CIN = COUT1 = COUT2 = 1uF/X7R (°C) Dropout Voltage vs. Load Current 100 150 200 250 300 350 0 50 100 150 200 250 300 Load Current (mA) Dropout Voltage (mV) RT9011-GS, VOUT2 TJ = 25°C TJ = -40°C TJ = 125°C Power-On Time (10 μs/Div) RT9011-FM Both ILOAD = 10mA VEN (5V/Div) VOUT2 (2V/Div) VOUT1 (1V/Div) POR (5V/Div) Output Voltage vs. Temperature 1.7 1.75 1.8 1.85 1.9 -50 -25 0 25 50 75 100 125 Temperature Output Voltage (V) RT9011-GS, VOUT1 (°C) Output Voltage vs. Temperature 3.2 3.25 3.3 3.35 3.4 -50 -25 0 25 50 75 100 125 Temperature Output Voltage (V) RT9011-GS, VOUT2 (°C) RT9011-GS, Both ILOAD = 1mA VIN = 3.8V to 4.8V Line Transient Response VIN (V) Time (100 μs/Div) VOUT1 (10mV/Div) 4.8 3.8 VOUT2 (10mV/Div)
DS9011-08 April 2011 www.richtek.com Load Transient Response Time (250 μs/Div) IOUT (100mA/Div) VOUT2 (20mV/Div) VOUT1 (20mV/Div) RT9011-GS, ILOAD = 10mA to 100mA VIN = VEN = 4.3V CIN = COUT1 = COUT2 = 1uF/X7R RT9011-GS, Both ILOAD = 100mA VIN = 3.8V to 4.8V Line Transient Response VIN (V) Time (100 μs/Div) VOUT1 (10mV/Div) 4.8 3.8 VOUT2 (10mV/Div) RT9011-GS, Both ILOAD = 10mA VIN = 3.8V to 4.8V Line Transient Response VIN (V) VOUT1 (10mV/Div) 4.8 3.8 VOUT2 (10mV/Div) Time (100 μs/Div) RT9011-GS, Both ILOAD = 50mA VIN = 3.8V to 4.8V Line Transient Response VIN (V) Time (100 μs/Div) VOUT1 (10mV/Div) 4.8 3.8 VOUT2 (10mV/Div) Load Transient Response Time (250 μs/Div) IOUT (50mA/Div) VOUT2 (20mV/Div) VOUT1 (20mV/Div) RT9011-GS, ILOAD = 10mA to 50mA VIN = VEN = 4.3V CIN = COUT1 = COUT2 = 1uF/X7R Start Up Time (5 μs/Div) RT9011-FM, VIN = 5V IOUT1 = IOUT2 = 50mA (5V/Div) (1V/Div) VEN VOUT1 VOUT2
DS9011-08 April 2011www.richtek.com EN Pin Shutdown Response Time (50 μs/Div) RT9011-FM, VIN = 5V IOUT1 = IOUT2 = 50mA (5V/Div) (1V/Div) VEN VOUT1 VOUT2 Noise Time (10ms/Div) RT9011-GS, ILOAD = 50mA VIN = VEN = 4.5V(By battery) CIN = COUT1 = COUT2 = 1uF/X7R Noise (μV/Div) 300 200 100 -100 -200 -300 Noise Time (10ms/Div) RT9011-GS, No LOAD VIN = VEN = 4.5V(By battery) CIN = COUT1 = COUT2 = 1uF/X7R Noise (μV/Div) 150 100 -50 -100 -150 EN2 Pin Response (1V/Div) VEN1 VOUT1 VOUT2 VEN2 VEN1 (2V/Div) VEN2 (2V/Div) VEN1 (2V/Div) (1V/Div) VEN1 VOUT1 VOUT2 EN1 Pin Response VEN2 VEN2 (2V/Div) Time (10ms/Div) Time (10ms/Div) PSRR -80 -60 -40 -20 10 100 1000 10000 100000 100000 0 Frequency(Hz) PSRR(dB) IOUT = 50mA PSRR 1M100k10k1k
input pin of the IC and returned to a clean analog ground. and returned to a clean analog ground. Figure 1. Stable Cout ESR Range
170 C° 110 C°
80 C°IC Temperature
Figure 2. Short Circuit Thermal Folded Back Protection Thermal protection limits power dissipation in RT9011. again after the junction temperature cools by 40 °C. the junction to ambient thermal resistance.
ambient temperature on the maximum power allowed. Figure 3. Derating Curves for RT9011 Packages
DS9011-08 April 2011 www.richtek.com Outline Dimension TSOT-23-6 Surface Mount Package Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 1.000 0.028 0.039 A1 0.000 0.100 0.000 0.004 B 1.397 1.803 0.055 0.071 b 0.300 0.559 0.012 0.022 C 2.591 3.000 0.102 0.118 D 2.692 3.099 0.106 0.122 e 0.838 1.041 0.033 0.041 H 0.080 0.254 0.003 0.010 L 0.300 0.610 0.012 0.024 A e b B D C H L
DS9011-08 April 2011www.richtek.com W-Type 8L DFN 2x2 Package Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.200 0.300 0.008 0.012 D 1.950 2.050 0.077 0.081 D2 1.000 1.250 0.039 0.049 E 1.950 2.050 0.077 0.081 E2 0.400 0.650 0.016 0.026 e 0.500 0.020 L 0.300 0.400 0.012 0.016 1 122 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. DETAIL A Pin #1 ID and Tie Bar Mark Options D E A L be SEE DETAIL A
DS9011-08 April 2011 www.richtek.com Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.180 0.300 0.007 0.012 D 2.950 3.050 0.1 16 0.120 D2 2.300 2.650 0.091 0.104 E 2.950 3.050 0.1 16 0.120 E2 1.500 1.750 0.059 0.069 e 0.500 0.020 L 0.350 0.450 0.014 0.018 W-Type 10L DFN 3x3 Package 1 122 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. DETAIL A Pin #1 ID and Tie Bar Mark Options D E A L be SEE DETAIL A
DS9011-08 April 2011www.richtek.com Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.200 0.300 0.008 0.012 D 2.950 3.050 0.1 16 0.120 D2 2.100 2.350 0.083 0.093 E 2.950 3.050 0.1 16 0.120 E2 1.350 1.600 0.053 0.063 e 0.650 0.026 L 0.425 0.525 0.017 0.021 W-Type 8L DFN 3x3 Package 1 122 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. DETAIL A Pin #1 ID and Tie Bar Mark Options D E A L be SEE DETAIL A
DS9011-08 April 2011 www.richtek.com Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the ri ght to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property inf ringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications i s assumed by Richtek. Richtek Technology Corporation Headquarter 5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611 Richtek Technology Corporation Taipei Office (Marketing) 5F, No. 95, Minchiuan Road, Hsintien City Taipei County, Taiwan, R.O.C. Tel: (8862)86672399 Fax: (8862)86672377 Email: marketing@richtek.com Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.200 0.300 0.008 0.012 D 1.550 1.650 0.061 0.065 D2 0.950 1.050 0.037 0.041 E 1.550 1.650 0.061 0.065 E2 0.550 0.650 0.022 0.026 e 0.500 0.020 L 0.190 0.290 0.007 0.011 W-Type 6L DFN 1.6x1.6 Package D E A e b L SEE DETAIL A 1 122 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. DETAIL A Pin #1 ID and Tie Bar Mark Options