PS9634 CEL | Alldatasheet

Document overview

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Technical content

FEATURES

  • HIGH INSTANTANEOUS COMMON MODE REJECTION VOLTAGE CM H = -1000 V/µs MIN, CML = 1000 V/µs MIN
  • HIGH POWER SUPPLY VOLTAGE (V CC ) VCC = 18 V
  • HIGH RESPONSE SPEED tPHL , tPLH = 5 µs MAX
  • HIGH OUTPUT CURRENT IO1 = 0.5 A (DC), 1.0 A (pulse) MAX
  • CAN BE SOLDERED BY INFRARED REFLOW SOLDERING

DESCRIPTION

The PS9634 is an optical linkage device mounting a GaAs infrared LED on the light emitting side (input side), and a photodiode and a signal processing circuit on the light receiv- ing side (output side) on one chip. The device can directly drive a power transistor of 15 A to 20 A class and may be used for an inverter control air conditioner or general purpose inverter. The PS9634L has formed leads for surface mounting. POWER TRANSISTOR DRIVING BASE AMPLIFIER BUILT-IN TYPE OPTOCOUPLER ELECTRICAL CHARACTERISTICS (TA = -20 °C to +80 °C, unless otherwise specified) Input Characteristic Output Characteristics Propagation Characteristics PART NUMBER PS9634, PS9634L SYMBOLS PARAMETERS UNITS MIN TYP MAX VF Forward Voltage, IF = 5 mA, TA = 25 °C V 1.1 1.4 IR Reverse Current, VR = 5 V, TA = 25 °C µA5 C t Capacitance Between Terminals pF 30 V = 0, f = 1.0 MHz, TA = 25 °C VCC Supply Voltage V 5.4 15 VO1L * Low Level Output Voltage (O1) V 0.25 0.4 Vcc = 6 V, IO1 = 0.4 A, RL2 = 10 Ω , IF = 5 mA VO2H * High Level Output Voltage (O2) V 4.5 5.0 Vcc = 6 V, IO2 = -0.4 A, IF = 5 mA VO2L Low Level Output Voltage (O2) V 0.25 0.4 Vcc = 6 V, IO2 = 0.5 A, IF = 0 IO1L * Leak Current (O1), Vcc = 13 V, IF = 0 µA 100 IO2L Leak Current (O2), Vcc = 13 V, IF = 5 mA µA 100 ICCH High Level Supply Current VCC = 6 V, IF = 5 mA, TA = 25 °Cm A 8 1 2 VCC = 6 V, IF = 5 mA mA 16 ICCL Low Level Supply Current VCC = 6 V, IF = 0, TA = 25 °Cm A 1 5 1 8 VCC = 6 V, IF = 0 mA 22 IFLH * Input ON Current, Low ♦ High Vcc = 6 V, RL1 = 5 Ω , RL2 = 10 Ω, TA = 25 °C mA 0.3 1.5 3.0 Vcc = 6 V, RL1 = 5 Ω , RL2 = 10 Ω mA 0.2 5.0 R I-O Insulation Resistance, RH = 40% to 60%, TA = 25 °C Ω 1011 tPLH * Propagation Delay Time, Low ♦ High µs3 5 Vcc = 6 V, IF = 5 mA, RL1 = 5 Ω , RL2 = 10 Ω, TA = 25 °C tPHL * Propagation Delay Time, High ♦ Low µs3 5 Vcc = 6 V, IF = 5 mA, RL1 = 5 Ω , RL2 = 10 Ω, TA = 25 °C CM H * Instantaneous Common Mode Rejection Voltage V/ µs -1000 (Output "High"), TA = 25°C, VCM = 600 V (peak), IF = 5 mA RL 1 = 470 Ω , RL2 = 1 kΩ , ∆VO2H = 0.5 V CM L* Instantaneous Common Mode Rejection Voltage V/ µs 1000 (Output "Low"), TA = 25°C, VCM = 600 V (peak), IF = 0 mA RL 1 = 470 Ω , RL2 = 1 kΩ , ∆VO2L = 0.5 V PS9634 PS9634L ESD SENSITIVE California Eastern Laboratories *Note: See Figures 1-7 for test schematic.

ABSOLUTE MAXIMUM RATINGS 1 (TA = 25°C) RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PART NUMBER PS9634,PS9634L SYMBOLS PARAMETERS UNITS MIN TYP MAX IFLH Input ON Current mA 6 8 10 VCC Supply Voltage V 5.4 15 IO1 Output Current (O1) A 0.1 0.2 0.3 IO2 Output Current (O2) A 0.1 0.2 0.3 TOP Operating Temperature °C 0 25 50 SYMBOLS PARAMETERS UNITS RATINGS Input VR Reverse Voltage V 6 IF/IFM Forward Current2 mA/A 30/1 Output VCC Power Voltage V 18 IO1 Output Current (O1) A 0.5 IO1P Peak Output Current (O1) A 1.0 IO2 Output Current (O2) A 0.8 IO2P Peak Output Current (O2) A 2.0 VO1 Output Voltage (O1) V 18 PO Power Dissipation mW 500 PT Total Power Dissipation mW 550 BV Insulation Withstand Voltage3 Vr.m.s. 5000 TOP Operating Temperature °C -20 to +80 TSTG Storage Temperature °C -55 to +150 LED ON OFF Tr. 1 ON OFF Tr. 2 OFF ON TRUTH TABLE PIN CONNECTION (Top View) Tr. 2 Tr. 1 Signal processing circuit 1 4

3.8 MAX

2.8 MIN 0.65 1.34 0.50±0.10

1.27 MAX

7.62 6.5

10.16 MAX

4.55 MAX

0 to 15˚ 8 5 1 4 1.34±0.10 1.27 MAX 7.62 6.5 0.9±0.25 0.05 to 0.23.8 MAX 2.54 9.60±0.4 OUTLINE DIMENSIONS (Units in mm) PS9634 PS9634L 1. Anode 2. Cathode 3. NC 4. NC 5. Output (O1) 6. Output (O2) 7. GND 8. V CC PS9634 Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Peak forward current IFM : Pulse width = 100 µs; Duty Ratio = 1%. 3. When all input pins are connected to all output pins at TA = 25 °C and RH = 60 %. PS9634, PS9634L

MEASUREMENT CIRCUITS FOR ELECTRICAL CHARACTERISTICS FIG. 1 (VO1L ) IF VCC R L2 = 10 Ω IO1 VO1LV FIG. 2 (VO2H ) IF VCC IO2VO2H V FIG. 3 (IO1L ) FIG. 4 (I O2L ) FIG. 7 (CMH , CML) FIG. 5 (IFLH ) FIG. 6 (tPLH , tPHL ) IF VCC A IO1L IF VCC IO2L A IF variable VCC V 6 V R L1 = 5 Ω R L2 = 10 Ω VO2 VCC R L1 = 5 Ω R L2 = 10 Ω VOUT 51 Ω (tr, tf = 0.01µs) VIN VIN VOUT tPLH tPHL 50 % 50 % IF VCC R L1 = 470 Ω R L2 = 1 K Ω VO2 SW VCM VCM VO2 100 V 2 V 0.5 V CM H (IF = 5 mA) CM L (IF = 0) GND–+ PS9634, PS9634L

MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE Maximum Forward Current, I F (mA) Ambient Temperature, TA (°C) Supply Voltage, VCC (V) Total Power Dissipation, P T (mW) NORMALIZED I FLH vs. SUPPLY VOLTAGE Ambient Temperature, TA (°C) Normalized I FLH , ∆IFLH TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE POWER DISSIPATION vs. AMBIENT TEMPERATURE Power Dissipation, P D ( mW) Ambient Temperature, TA (°C) Forward Current, I F ( mA) Forward Voltage, VF (V) FORWARD CURRENT vs. FORWARD VOLTAGE TYPICAL PERFORMANCE CURVES (TA = 25 °C) Ambient Temperature, TA (°C) NORMALIZED I FLH vs. AMBIENT TEMPERATURE Normalized I FLH , ∆IFLH 0 25 50 75 100 600 450 300 150 0 25 50 75 100 (500) 600 450 300 150 0 25 50 75 100 (550) TA = 100 ˚C 75 ˚C 50 ˚C 25 ˚C 0 ˚C -25 ˚C -55 ˚C 100 0.1 0.01 Normalized to 1.0 at VCC = 6 V TA = 25 ˚C 1.5 0.5 468 1 0 1 2 1 4 1 6 1 8 Normalized to 1.0 at TA = 25 ˚C VCC = 6 V 1.3 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 PS9634, PS9634L

vs. SUPPLY VOLTAGE High Level Supply Current, I CCH (mA) Supply Voltage, VCC (V) Output Current (O2), IO2 (A) Low Level Output V oltage (O1), V O1L (V) LOW LEVEL OUTPUT VOLTAGE vs. OUTPUT CURRENT Output Current (O1), IO1 (A) Low Level Output V oltage (O2), V O2L (V) LOW LEVEL OUTPUT VOLTAGE vs. OUTPUT CURRENT LOW LEVEL SUPPLY CURRENT vs. SUPPLY VOLTAGE Low Level Supply Current, I CCL (mA) Supply Voltage, VCC (V) Low Level Output V oltage (O1), V O1L (V) Ambient Temperature, TA (°C) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE TYPICAL PERFORMANCE CURVES (TA = 25 °C) Ambient Temperature, TA (°C) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE Low Level Output V oltage (O2), V O2L (V) VCC = 6 V TA = 25 ˚C 10 10 10 -2 -1 0 VCC = 6 V 0.3 0.25 0.2 0.15 0.1 0.05 -20 0 20 40 60 80 IO1 = 0.5 mA 0.3 mA 0.1 mA VCC = 6 V TA = 25 ˚C 10 10 10-2 -1 0 VCC = 6 V IO2 = 0.6 A 0.4 A 0.1 A 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 22.5 17.5 12.5 7.5 468 1 0 1 2 1 4 1 6 1 8 25 ˚C 80 ˚C TA = -20 ˚C 20 TA = -20 ˚C 25 ˚C 80 ˚C 468 1 0 1 2 1 4 1 6 1 8 PS9634, PS9634L

vs. OUTPUT CURRENT High Level Output V oltage (O2), V O2H (V) Output Current (O2), IO2 (A) Output Voltage (O2), VO2 (V) Propagation Delay Time, t PHL, tPLH (µs) Forward Current, IF (mA) Output Current (O2), I (A) HIGH LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE High Level Output V oltage (O2), V O2H (V) Ambient Temperature, TA (°C) Propagation Delay Time, t PHL, tPLH (µs) Ambient Temperature, TA (°C) PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE TYPICAL PERFORMANCE CURVES (TA = 25 °C) VCC = 6 V TA = 25 ˚C 5.5 4.5 VCC = 6 V IO2 = -0.1 A -0.4 A -0.6 A 5.3 5.2 5.1 5.0 4.9 4.8 4.7 4.6 4.5 -20 0 20 40 60 80 PROPAGATION DELAY TIME vs. FORWARD CURRENT VCC = 6 V R L1 = 5 Ω R L2 = 10 Ω TA = 80 ˚C 25 ˚C -20 ˚C 80 ˚C -20 ˚C 25 ˚C tPHL tPLH 51 0 1 5 2 0 2 5 3 0 VCC = 6 V R L1 = 5 Ω R L2 = 10 Ω IF = 5 mA tPHL tPLH 4.5 3.5 2.5 -20 0 20 40 60 80 SAFE OPERATING AREA (T r1) *1) One Pulse *2) On the epoxy board IO2 MAX. (Pulse) IO2 MAX. (DC) 1 ms *1) 10 m s *1)100 ms *1) 1 s *1) DC *2) DC (T A = 80 ˚C) *2) V CC MAX. 0.5 0.2 0.1 0.3 0.5 1 2 5 10 20 30 PS9634, PS9634L

PS9634, PS9634L TAPING SPECIFICATIONS (Units in mm) Tape Outline and Dimensions Tape Direction Reel Outline and Dimensions 4.0 ± 0.1 2.0 ± 0.1 1.55 ± 0.1 16.0 ± 0.3 4.3 ± 0.2 0.3 10.3 ± 0.1 12.0 ± 0.1 2.0 ± 0.5 φ13.0 ± 1.0 φ21.0 ± 0.8 R1.0 φ80.0 ± 5.0 φ330 16.4 +2.0 -0.0 1.5

PS9634, PS9634L Time (s) Package Surface Temperature T (˚C) 120 to 160 ˚C 60 to 90 s (preheating) (heating) to 10 s to 30 s 235 ˚C (peak temperature) 210 ˚C Peak temperature 235˚ C or below RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering

  • Peak reflow temperature 235 °C or below (plastic surface)
  • Time of temperature higher than 210 °C 30 seconds or less
  • Number of reflows Three
  • Flux Rosin flux containing a small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (2) Dip soldering
  • Temperature 260 °C or below (molten solder temperature)
  • Time 10 seconds or less
  • Number of times One
  • Flux Rosin flux containing a small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) CAUTION: Avoid removing the residual flux with water after the first reflow process. Recommended Temperature Profile of Infrared Reflow EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 12/04/2001DATA SUBJECT TO CHANGE WITHOUT NOTICE