PS9505L3-V

PS9505 CEL | Alldatasheet

Document overview

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Technical content

02 fo 1 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 PIN CONNECTION (Top View) 1. NC 2. Anode 3. Cathode 4. NC 5. VEE 6. VO 7. VO 8. VCC SHIELD 1 2 3 4 8765 Preliminary Data Sheet PS9505,PS9505L1, PS9505L2,PS9505L3

2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER

DESCRIPTION

The PS9505, PS9505L1, PS9505L2 and PS9505L3 are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. The PS9505 Series is designed specifically for high common mode transient immunity (CMR), high output current and high switching speed. The PS9505 Series is suitable for driving IGBTs and MOS FETs. The PS9505 Series is in a plastic DIP (Dual In-line Package). The PS9505L1 is lead bending type for long creepage distance. The PS9505L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. The PS9505L3 is lead bending type (Gull-wing) for surface mounting.

FEATURES

• Long creepage distance (8 mm MIN.: PS9505L1, PS9505L2)
• Large peak output current (2.5 A MAX., 2.0 A MIN.)
• High speed switching (tPLH, tPHL = 0.25 μs MAX.)
• UVLO (Under Voltage Lock Out) protection with hysteresis
• High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.)
• Embossed tape product: PS9505L2-E3: 1 000 pcs/reel leer/scp 000 1 :3E-3L5059SP :
• Pb-Free product
• Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)

APPLICATIONS

• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating) R08DS0015EJ0100 Rev.1.00 Jan 06, 2012 <R> <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 2 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 PACKAGE DIMENSIONS (UNIT: mm) DIP Type PS9505 9.25 +0.5 –0.25 6.5 +0.5 –0.1 0 to 15° 7.62 2.54 1.01 +0.4 –0.2 0.5±0.15 0.84±0.150.25 M 3.5±0.2 4.15±0.32.8 MIN. Lead Bending Type (Gull-wing) For Surface Mount PS9505L3 6.5 +0.5 –0.1 9.65±0.4 0.74±0.25 0.635±0.15 2.54 3.5±0.2 1.01 +0.4 –0.2 9.25 +0.5 –0.25 8 5 0.5±0.15 0.25 M A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 3 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 Lead Bending Type For Long Creepage Distance PS9505L1 9.25 +0.5 –0.25 6.5 +0.5 –0.1 0 to 15° 10.16 2.54 3.5±0.2 3.87±0.42.8 MIN. 1.01 +0.4 –0.2 0.5±0.15 0.25 M 0.84±0.15 Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) PS9505L2 9.25 +0.5 –0.25 6.5 +0.5 –0.1 11.8±0.4 2.54 3.5±0.2 1.01 +0.4 –0.2 0.9±0.25 0.25±0.2 8 5 0.5±0.15 0.25 M A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 4 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 PHOTOCOUPLER CONSTRUCTION Parameter PS9505, PS9505L3 PS9505L1, PS9505L2 Air Distance (MIN.) 7 mm 8 mm Outer Creepage Distance (MIN.) 7 mm 8 mm Isolation Distance (MIN.) 0.4 mm 0.4 mm FUNCTIONAL DIAGRAM LED Output HNO OFF Tr. 1 ON OFF Tr. 2 OFF ON L Input H L SHIELD (Tr. 2) (Tr. 1) MARKING EXAMPLE 9505 NT131 RNo. 1 pin Mark Company Initial Type Number Assembly Lot Year Assembled (Last 1 Digit) 1 31 N T Rank Code In-house Code Week Assembled <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 5 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012

ORDERING INFORMATION

Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Application Part Number PS9505 PS9505-AX Pb-Free 50 Magazine Cases Standard PS9505 1L5059SP stcudorp )uA/dP/iN( XA-1L5059SP 1L5059SP 2L5059SP OKMES ,ASC ,LU( XA-2L5059SP 2L5059SP 3L5059SP )devorppa XA-3L5059SP 3L5059SP 2L5059SP epaT dessobmE XA-3E-2L5059SP 3E-2L5059SP 3L5059SP leer/scp 000 1 XA-3E-3L5059SP 3E-3L5059SP PS9505-V PS9505-V-AX 50 Magazine Cases DIN EN60747-5-2 PS9505 1L5059SP )2traP 4880EDV( XA-V-1L5059SP V-1L5059SP 2L5059SP devorppa XA-V-2L5059SP V-2L5059SP 3L5059SP )noitpO( XA-V-3L5059SP V-3L5059SP 2L5059SP epaT dessobmE XA-3E-V-2L5059SP 3E-V-2L5059SP 3L5059SP leer/scp 000 1 XA-3E-V-3L5059SP 3E-V-3L5059SP *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current IF 25 mA Peak Transient Forward Current (Pulse Width < 1 μs) IF (TRAN) 1.0 A Reverse Voltage VR 5 V Detector High Level Peak Output Current IOH (PEAK) 2.5 A Low Level Peak Output Current IOL (PEAK) 2.5 A Supply Voltage (VCC - VEE) 0 to 35 V Output Voltage VO 0 to VCC V Power Dissipation PC 250 mW Isolation Voltage BV 5 000 Vr.m.s. Total Power Dissipation PT 300 mW Operating Frequency f 50 kHz Operating Ambient Temperature TA −40 to +110 °C Storage Temperature Tstg −55 to +125 °C *1 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2% *2 Reduced to 4.8 mW/°C at TA = 70°C or more. *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-4 shorted together, 5-8 shorted together. *4 Reduced to 5.4 mW/°C at TA = 70°C or more. *5 IOH (PEAK) ≤ 2.0 A (≤ 0.3 μs), IOL (PEAK) ≤ 2.0 A (≤ 0.3 μs) <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 6 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (VCC - VEE) 15 30 V Forward Current (ON) IF (ON) 7 10 16 mA Forward Voltage (OFF) VF (OFF) −2 0.8 V Operating Ambient Temperature TA −40 110 °C

ELECTRICAL CHARACTERISTICS

(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS) Parameter Symbol Conditions MIN. TYP. MAX. Unit Diode Forward Voltage VF IF = 10 mA, TA = 25°C 1.2 1.56 1.8 V Reverse Current IR VR = 3 V, TA = 25°C 10 μA Input Capacitance CIN f = 1 MHz, VF = 0 V, TA = 25°C 30 pF Detector High Level Output Current IOH VO = (VCC − 4 V) 0.5 2.0 A VO = (VCC − 15 V) 2.0 Low Level Output Current IOL VO = (VEE + 2.5 V) 0.5 2.0 A VO = (VEE + 15 V) 2.0 High Level Output Voltage VOH IO = −100 mA VCC − 3.0 VCC − 1.5 V Low Level Output Voltage VOL IO = 100 mA 0.1 0.5 V High Level Supply Current ICCH VO = open, IF = 10 mA 1.4 3.0 mA Low Level Supply Current ICCL VO = open, VF = 0 to +0.8 V 1.3 3.0 mA UVLO Threshold VUVLO+ VO > 5 V, IF = 10 mA 10.8 12.3 13.4 V VUVLO− 9.5 11.0 12.5 UVLO Hysteresis UVLOHYS VO > 5 V, IF = 10 mA 0.4 1.3 V Coupled Threshold Input Current (L → H) IFLH IO = 0 mA, VO > 5 V 2.0 5.0 mA Threshold Input Voltage (H → L) VFHL IO = 0 mA, VO < 5 V 0.8 V *1 Typical values at TA = 25°C. *2 Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%. *3 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2% *4 VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle = 20%). <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 7 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 SWITCHING CHARACTERISTICS (VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS) Parameter Symbol Conditions MIN. TYP. MAX. Unit Propagation Delay Time (L → H) tPLH Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, 0.07 0.25 μs Propagation Delay Time (H → L) tPHL Duty Cycle = 50% , IF = 10 mA 0.10 0.25 μs Pulse Width Distortion (PWD) |tPHL−tPLH| 0.03 0.1 μs Propagation Delay Time (Difference Between Any Two Products) tPHL−tPLH −0.1 0.1 μs Rise Time tr 50 ns Fall Time tf 50 ns UVLO (Turn On Delay) tUVLO ON VO > 5 V, IF = 10 mA 0.8 μs UVLO (Turn Off Delay) tUVLO OFF VO < 5 V, IF = 10 mA 0.6 μs Common Mode Transient Immunity at High Level Output |CMH| TA = 25°C, IF = 10 to 16 mA, VCC = 30 V, VO (MIN.) = 26 V, VCM = 1.5 kV 25 kV/μs Common Mode Transient Immunity at Low Level Output |CML| TA = 25°C, IF = 0 mA, VCC = 30 V, VO (MAX.) = 1 V, VCM = 1.5 kV 25 kV/μs *1 Typical values at TA = 25°C. *2 This load condition is equivalent to the IGBT load at 1 200 V/75 A. <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 8 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 TEST CIRCUIT Fig. 1 IOH I 2 .giFtiucriC tseT OL Test Circuit Fig. 3 VOH V 4 .giFtiucriC tseT OL Test Circuit Fig. 5 IFLH tiucriC tseT OLVU 6 .giFtiucriC tseT VCC = 15 to 30 V 2.5 V 0.1 Fμ IOL IF VCC = 15 to 30 V 0.1 Fμ VO > 5 V IF = 10 mA VCC 0.1 Fμ VO > 5 V IF = 7 to 16 mA VCC = 15 to 30 V 0.1 Fμ VOH 100 mA VCC = 15 to 30 V 4 V0.1 Fμ IF = 7 to 16 mA SHIELD SHIELD SHIELD SHIELD SHIELD SHIELD IOH VCC = 15 to 30 V 0.1 Fμ VOL 100 mA A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 9 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 VCC = 15 to 30 VIF = 10 mA 10 kHz 50% DUTY CYCLE 0.1 Fμ VO500 Ω 10 Ω 10 nF tPHLtPLH IF VOUT 90% 50% 10% tr tf VCC = 30 V VCM = 1.5 kV 0.1 Fμ A B VO IF VOH 26 V 1 V VOL VCM 0 V VO (Switch A: IF = 10 to 16 mA) VO (Switch B: IF = 0 mA) Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms Fig. 8 CMR Test Circuit and Wave Forms Δt =δV δ t VCM Δt SHIELD SHIELD <R> <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 01 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) Ambient Temperature TA (°C) Detector Power Dissipation PC (mW) DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE Ambient Temperature TA (°C) Total Power Dissipation PT (mW) TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE Ambient Temperature TA (°C) Threshold Input Current IFLH (mA) THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE 20 40 60 80 1201000 300 250 200 150 100 20 40 60 80 1201000 5.0 4.0 3.0 2.0 1.0 VCC = 30 V, VEE = GND, VO > 5 V VCC = 30 V, VEE = GND −40 −20 0 20 40 60 80 100 Forward Current IF (mA) Output Voltage VO (V) OUTPUT VOLTAGE vs. FORWARD CURRENT 10 2 43 5 350 300 250 200 150 100 Forward Voltage VF (V) Forward Current IF (mA) FORWARD CURRENT vs. FORWARD VOLTAGE 1.0 0.01 0.1 1.0 100 TA = +100°C +85°C +50°C +25°C 0°C −40°C High Level Output Voltage – Supply Voltage VOH – VCC (V) High Level Output Current IOH (A) HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT VCC = 30 V, VEE = GND, IF = 10 mA−40°C +25°C TA = +110°C Remark The graphs indicate nominal characteristics. <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 11 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 Forward Current IF (mA) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. FORWARD CURRENT PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Low Level Output Current IOL (A) Low Level Output Voltage VOL (V) LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) 6 8 10 12 14 16 18 VCC = 30 V, VEE = GND, Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 250 200 150 100 t PHL PWD tPLH 15 20 25 30 VEE = GND, IF = 10 mA, Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 250 200 150 100 t PHL PWD tPLH PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD CAPACITANCE Load Capacitance Cg (nF) 10 20 30 40 50 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 Ω, f = 10 kHz, Duty cycle = 50% 250 200 150 100 t PHL tPLH PWD 0 0.5 1 1.5 2.52 VCC = 30 V, VEE = GND, IF = 0 mA −40°C +25°C TA = +110°C PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD RESISTANCE 0 10 20 30 40 50 VCC = 30 V, VEE = GND, IF = 10 mA, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 250 200 150 100 tPHL PWD tPLH Load Resistance Rg (Ω) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE Ambient Temperature TA (°C) 0−40 −20 20 40 60 80 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 250 200 150 100 t PHL tPLH 100 PWD Remark The graphs indicate nominal characteristics. A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 21 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 Ambient Temperature TA (°C) SUPPLY CURRENT vs. AMBIENT TEMPERATURE High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) 20 0 20 40 8060−40 2.0 1.5 1.0 0.5 100 VCC = 30 V, VEE = GND, VO = OPEN ICCH (IF = 10 mA) ICCL (IF = 0 mA) Ambient Temperature TA (°C) Supply Voltage VCC (V) SUPPLY CURRENT vs. SUPPLY VOLTAGE High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) 030251 25 2.0 0.5 1.0 1.5 VEE = GND, VO = OPEN ICCH (IF = 10 mA) ICCL (IF = 0 mA) High Level Output Voltage – Supply Voltage VOH – VCC (V) HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE −20 0 20 40 8060−40 0.0 −3.0 −2.5 −2.0 −1.5 −1.0 −0.5 100 −20 0 20 40 8060−40 100 VCC = 30 V, VEE = GND, IF = 10 mA, IO = –100 mA Ambient Temperature TA (°C) High Level Output Current IOH (A) HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature TA (°C) Low Level Output Voltage VOL (V) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE 0.30 0.00 0.05 0.10 0.15 0.20 0.25 V CC = 30 V, VEE = GND, IF = 10 mA, IO = 100 mA Ambient Temperature TA (°C) Low Level Output Current IOL (A) LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE −20 0 20 40 8060−40 100 3.0 0.0 0.5 1.0 1.5 2.0 2.5 V CC = 30 V, VEE = GND, IF = 10 mA, VCC–VO = 4 V −20 0 20 40 8060−40 100 3.0 0.0 0.5 1.0 1.5 2.0 2.5 V CC = 30 V, VEE = GND, IF = 10 mA, VO = 2.5 V Remark The graphs indicate nominal characteristics. A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 31 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 OUTPUT VOLTAGE vs. SUPPLY VOLTAGE Supply Voltage VCC – VEE (V) Output Voltage VO (V) 0 5 10 15 20 UVLOHYS VUVLO+VUVLO− (12.3 V)(11.0 V) Remark The graph indicates nominal characteristics. A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 41 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 TAPING SPECIFICATIONS (UNIT: mm) 2.05±0.05 2.0±0.1 4.0±0.1 1.75±0.1 24.0±0.3 10.7±0.1 12.0±0.1 1.5 +0.1 –0 4.5 MAX. 12.8±0.1 4.1±0.1 0.3±0.05 11.5±0.1 Tape Direction PS9505L2-E3 Outline and Dimensions (Tape) Outline and Dimensions (Reel) Packing: 1 000 pcs/reel 330±2.0 100±1.0 2.0±0.5 13.0±0.2 R 1.0 21.0±0.8 2.0±0.5 23.9 to 27.4 Outer edge of flange 25.5±1.0 29.5±1.0 A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 51 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 Outline and Dimensions (Tape) 1.55±0.1 2.0±0.1 4.0±0.1 1.75±0.1 5.3 MAX. 10.3±0.1 12.0±0.1 1.5 +0.1–0 7.5±0.1 10.4±0.1 16.0±0.3 4.75±0.1 0.35±0.05 Outline and Dimensions (Reel) Packing: 1 000 pcs/reel 330±2.0 100±1.0 2.0±0.5 13.0±0.2 R 1.0 21.0±0.8 2.0±0.5 15.9 to 19.4 Outer edge of flange 21.5±1.0 17.5±1.0 Tape Direction PS9505L3-E3 A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 61 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) D CB A Part Number PS9505L2 PS9505L3 Lead Bending A lead bending type (Gull-wing) for long creepage distance (surface mount) lead bending type (Gull-wing) for surface mount 10.2 9.0 B 2.54 2.54 C 1.7 1.7 D 2.2 2.0 <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 71 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering 062 erutarepmet wolfer kaeP • °C or below (package surface temperature)

• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s eerhT swolfer fo rebmuN • a htiw xulf ehT( enirolhc fo tnuoma llams gniniatnoc xulf nisoR xulF • maximum chlorine content of 0.2 Wt% is recommended.) 120±30 s (preheating) 220°C 180°C Package Surface Temperature T (°C) Time (s) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s to 60 s 260°C MAX. 120°C (2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less a htiw xulf ehT( enirolhc fo tnuoma llams gniniatnoc xulf nisoR xulF • maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 81 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 (4) Cautions

• Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics. (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly evaluate operation.) (3) Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. *1 NC: Non-Connection (No Connection) 3. Make sure the rise/fall time of the forward current is 0.5 μs or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less. 5. Avoid storage at a high temperature and high humidity. <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 91 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Spec. Unit Climatic test class (IEC 60068-1/DIN EN 60068-1) 40/110/21 Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.6 × UIORM, Pd < 5 pC UIORM Upr 1 130 1 808 Vpeak Vpeak Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 × UIORM, Pd < 5 pC Upr 2 119 Vpeak Highest permissible overvoltage UTR 8 000 Vpeak Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2 Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175 Material group (DIN EN 60664-1 VDE0110 Part 1) III a Storage temperature range Tstg –55 to +125 °C Operating temperature range TA –40 to +110 °C Isolation resistance, minimum value VIO = 500 V dc at TA = 25°C VIO = 500 V dc at TA MAX. at least 100°C Ris MIN. Ris MIN. Ω Ω Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi Tsi Isi Psi Ris MIN. 175 400 700 mA mW Ω <R> A Business Par tner of Renesas Electronics Corporation.

PS9505,PS9505L1,PS9505L2,PS9505L3 Chapter Title 02 fo 02 egaP 00.1.veR 0010JE5100SD80R Jan 06, 2012 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth. A Business Par tner of Renesas Electronics Corporation.

All trademarks and registered trademarks are the property of their respective owners. C - 1 Rev. Date Page Summary

0.01 May 12, 2010 − First Edition issued

1.00 Jan 06, 2012 Throughout Prelimi nary Data Sheet -> Data Sheet

Throughout Safety standards approved p.1 Addition of Pb-Free product p.4 Modification of MARKING EXAMPLE p.5 Addition of ORDERING INFORMATION p.6 Modification of ELECTRICAL CHARACTERISTICS p.7 Modification of SWITCHING CHARACTERISTICS p.9 Modification of TEST CIRCUIT pp.10 to 13 Addition of TYPICAL CHARACTERISTICS p.16 Modification of RECOMMENDED MOUNT PAD DIMENSIONS p.18 Modification of USAGE CAUTIONS 2. (2) p.19 Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT

1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.