PS7801J-1A CEL | Alldatasheet

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Technical content

DESCRIPTION

The PS7801J-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side (input side) and MOS FETs on the output side. An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 50% compared with the PS72xx series. It is suitable for high-frequency signal control, due to its low C×R3 p F •Ω, low output capacitance, and low off-state leakage current.

FEATURES

  • Ultra small flat-lead package (4.2 (L) ×2.5 (W) ×1.85 (H) mm)
  • L o w C ×R( C ×R = 2.9 pF • Ω)
  • Low output capacitance (C out = 1.3 pF TYP.)
  • 1 channel type (1 a output)
  • Designed for AC/DC switching line changer
  • Low offset voltage
  • Ordering number of taping product: PS7801J-1A-F3, F4 (3 500 pcs/reel)
  • Pb-Free product
  • UL awaiting approval

APPLICATIONS

  • Measurement equipment DATA SHEET 4-PIN ULTRA SMALL FLAT-LEAD, LOW C×R 3pF • Ω , 1-ch Optical Coupled MOS FET Solid State Relay OCMOS FET PS7801J-1A Document No. Date Published Printed in Japan © NEC Compound Semiconductor Devices, Ltd. 2006 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET PIN CONNECTION (Top View)

PACKAGE DIMENSIONS (UNIT: mm) 3.6+0.3 –0.4 2.5±0.3 4 3 N 4.2±0.2 0.2 MAX. 0.2±0.1 3.0 MAX. 1.27 1.85±0.05 0.4±0.1 0.15+0.1–0.05 0.2±0.1 0.36 4.6±0.2 MARKING EXAMPLE 6 03 Week assembled Year assembled No.1 pin mark (Nicked corner) (Marking details) *1 The marking corresponds to the last two digits of the part number below. PS7801J-1A Last number of type No. : 1J Assembly lot An initial of "NEC" Bar : Pb-Free1J 603 N Preliminary Data Sheet 2 PS7801J-1A

ORDERING INFORMATION

Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Application Part Number*1 PS7801J-1A-F3 PS7801J-1A-F3-A Pb-Free Embossed Tape 3 500 pcs/reel UL awaiting PS7801J-1A lavorppaA-4F-A1-J1087SP4F-A1-J1087SP *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (T A =2 5°C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current (DC) I F 50 mA Reverse Voltage V R 5.0 V Power Dissipation P D 50 mW Peak Forward Current IFP 1A MOS FET Break Down Voltage V L 20 V Continuous Load Current I L 160 mA Pulse Load Current (AC/DC Connection) ILP 240 mA Power Dissipation P D 250 mW Isolation Voltage .s.m.rV005VB Total Power Dissipation P T 300 mW Operating Ambient Temperature T A −40 to +85 °C Storage Temperature T stg −40 to +100 °C *1 PW = 100 μs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. RECOMMENDED OPERATING CONDITIONS (TA =2 5°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current I F 2 5 20 mA VegatloVffODEL F 0 0.5 V Preliminary Data Sheet 3 PS7801J-1A

ELECTRICAL CHARACTERISTICS (TA =2 5°C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Forward Voltage V F IF V4.11.1Am5=Diode Reverse Current I R VR 0.5V5= μA Off-state Leakage Current ILoff VD 52.010.0V02= nA MOS FET Output Capacitance C out VD =0V ,f=1M H z , 1 1.3 1.7 pF Coupled LED On-state Current I Fon IL Am0.2Am061= On-state Resistance R on IF = 5 mA, IL = 160 mA, t ≤ 10 ms 2.2 3.2 Ω Turn-on Time *1, 2 ton IF = 5 mA, VL = 5 V, RL = 500 Ω, 0.05 0.5 ms Turn-off Time *1, 2 toff PW ≥ 5.030.0sm01 Isolation Resistance R I-O VI-O = 0.5 kVDC 01 Ω Isolation Capacitance C I-O Fp3.0zHM1=f,V0=V *1 Test Circuit for Switching Time Pulse Input rotinomrotinomtupnIV O VL RL IF Rin ton toff 10% 90% Input Output VO = 5 V 50% *2 The turn-on time and turn-off time are specified as input-pulse width ≥10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. Preliminary Data Sheet 4 PS7801J-1A

TAPING SPECIFICATIONS (UNIT: mm) Tape Direction PS7801J-1A-F3 PS7801J-1A-F4 Outline and Dimensions (Tape) Outline and Dimensions (Reel) 1.55±0.05 4.0±0.1 2.0±0.05 4.0±0.1 1.75±0.1 2.9 MAX. 0.3 2.9±0.1 2.4±0.1 1.5+0.1 5.3±0.1 5.5±0.05 12.0±0.2 NNNNNNNN Packing: 3 500 pcs/reel 2.0±0.5 R 1.0 13.0±0.2q 21.0±0.8q 330±2.0q 100±1.0q 2.0±0.5 11.9 to 15.4 Outer edge of flange 17.5±1.0 13.5±1.0 13.0±0.2q Preliminary Data Sheet 5 PS7801J-1A

RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 3.6 (0.35) 4.4 5.3 1.27 0.8 0.6 24-R0.1 ( ) : Reference value Remark All dimensions in this figure must be evaluated before use. Preliminary Data Sheet 6 PS7801J-1A

RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering 062erutarepmetwolferkaeP• °C or below (package surface temperature)

  • Time of peak reflow temperature 10 seconds or less
  • Time of temperature higher than 220°C 60 seconds or less
  • Time to preheat temperature from 120 to 180°C1 2 0 ±30 s eerhTswolferforebmuN• ahtiwxulfehT(enirolhcfotnuomallamsgniniatnocxulfnisoRxulF• maximum chlorine content of 0.2 Wt% is recommended.) 3DFNDJH6XUIDFH7HPSHUDWXUH7 7LPH V KHDWLQJ to 10 s to 60 s Ý&0$; Recommended Temperature Profile of Infrared Reflow 120±30 s SUHKHDWLQJ (2) Wave soldering
  • Temperature 260 °C or below (molten solder temperature)
  • Time 10 seconds or less
  • Preheating conditions 120 °C or below (package surface temperature)
  • Number of times One
  • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine c o n t e n to f0 . 2W t %i sr e c o m m e n d e d . ) (3) Cautions
  • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Preliminary Data Sheet 7 PS7801J-1A

When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. M8E 00. 4 - 0110 The information in this document is current as of February, 2005. The info rmation is subject to change without notice. For actual d esign-in, refer to the l atest publications of NEC 's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other int ellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of cust omer. NEC ass umes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the pos sibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "S pecific" quality grade applies onl y to semiconductor products developed based o n a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": T ransportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not spe cificall y designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If cust omers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). Preliminary Data Sheet 8 PS7801J-1A

Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points.

  • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal.
  • Do not burn, destroy, cut, crush, or chemically dissolve the product.
  • Do not lick the product or in any way allow it to enter the mouth. NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office Taipei Branch Office Korea Branch Office TEL: +852-3107-7303 TEL: +886-2-8712-0478 FAX: +852-3107-7309 FAX: +886-2-2545-3859 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 For further information, please contact PS7801J-1A

4590 Patrick Henry Drive

Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A -AZLead (Pb) < 1000 PPM Not Detected (*) Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sol d by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.