PS7200U-1A CEL | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
NEC's 4-PIN SOP LOW OFF-STATE LEAKAGE CURRENT 1-ch OPTICAL COUPLED MOS FET PS7200U-1A
FEATURES
- LOW OFF-STATE LEAKAGE CURRENT: ILoff = 0.1 nA TYP.
- BREAK DOWN VOLTAGE: VL = 80 V
- HIGH-SPEED TURN-ON TIME: ton = 0.05 ms TYP
- LOW OUTPUT CAPACITANCE: Cout = 2.3 pF TYP.
- C × R: C × R = 40 pF • Ω
- 1 CHANNEL TYPE: 1a Output
- DESIGNED FOR AC/DC SWITCHING LINE CHANGER
- SMALL AND THIN PACKAGE: 4-pin SOP, Height = 2.1 mm
- LOW OFFSET VOLTAGE
- ORDERING NUMBER OF TAPING PRODUCT: PS7200U-1A-E3, E4, F3, F4
DESCRIPTION
NEC's PS7200U-1A is a low output capacitance solid state relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. It is suitable for high-frequency signal control, due to its extremely low off-state leakage current, low output capacitance, and high-speed turn-on time. California Eastern Laboratories
APPLICATIONS
- Measurement Equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. PRELIMINARY DATA SHEET
PACKAGE DIMENSIONS (UNIT: mm) 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 4 3 1 2 TOP VIEW 4.4 7.0±0.3 0.5±0.3 0.15+0.10 -0.05 2.54 4.0±0.5 0.05+0.08 -0.05 2.05+0.08 -0.05 0.40+0.10 -0.05 0.25 M
ORDERING INFORMATION
PART NUMBER ORDER NUMBER SOLDER PLATING SPECIFICATION PACKING STYLE PS7200U-1A PS7200U-1A Solder Magazine case 100 pcs PS7200U-1A-E3 PS7200U-1A-E3 contains lead Embossed Tape 900 pcs/reel PS7200U-1A-E4 PS7200U-1A-E4 PS7200U-1A-F3 PS7200U-1A-F3 Embossed Tape 3 500 pcs/reel PS7200U-1A-F4 PS7200U-1A-F4 PS7200U-1A PS7200U-1A-A Pb-Free Magazine case 100 pcs PS7200U-1A-E3 PS7200U-1A-E3-A Embossed Tape 900 pcs/reel PS7200U-1A-E4 PS7200U-1A-E4-A PS7200U-1A-F3 PS7200U-1A-F3-A Embossed Tape 3 500 pcs/reel PS7200U-1A-F4 PS7200U-1A-F4-A ABSOLUTE MAXIMUM RATINGS (TA = 25ºC, unless otherwise specified ) PARAMETER SYMBOL RATINGS UNIT Diode Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V Power Dissipation PD 50 mW Peak Forward Current *1 IFP 1 A MOS FET Break Down Voltage VL 80 V Continuous Load Current IL 40 mA Pulse Load Current*2 (AC/DC Connection) ILP 80 mA Power Dissipation PD 300 mW Isolation Voltage *3 BV 1 500 Vr.m.s. Total Power Dissipation PT 350 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C *1 PW = 100 μs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at T A = 25 °C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together.
RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PARAMETER SYMBOL MIN. TYP. MAX. UNIT LED Operating Current IF 2 10 20 mA LED Off Voltage VF 0 0.5 V ELECTRICAL CHARACTERISTICS (TA = 25ºC) PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT Diode Forward Voltage VF IF = 5 mA 1.1 1.3 V Reverse Current IR VR = 5 V 0.01 5.0 μA MOS FET Off-state Leakage Current ILoff VD = 80 V 0.1 1.0 nA Output Capacitance Cout VD = 0 V, f = 1 MHz 2.3 3.5 pF Coupled LED On-state Current IFon IL = ±40 mA 2.0 mA On-state Resistance Ron IF = 5 mA, IL = ±40 mA 17 25 Ω Turn-on Time*1 ton IF = 5 mA, VL = 5 V, RL = 500 Ω, 0.05 0.5 ms Turn-off Time*1 toff PW ≥ 0.5 ms 0.15 0.5 Isolation Resistance RI-O VI-O = 1.0 kVDC 109 Ω Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.3 pF *1 Test Circuit for Switching Time RL IF Rin Pulse Input Input monitor monitorVO VL ton toff 10% 90% Input Output VO = 5 V 50%
TAPING SPECIFICATIONS (mm) PS7200U-1A-E3 PS7200U-1A-E4 Tape Direction Outline and Dimensions (Tape) 1.55±0.1 2.0±0.05 4.0±0.1 1.75±0.1 4.6±0.1 2.9 MAX. 0.38.0±0.1 2.4±0.1 1.5+0.1 7.4±0.1 5.5±0.05 12.0±0.2 Outline and Dimensions (Reel) Packing: 900 pcs/reel 2.0±0.5 R 1.0 13.0±0.2φ 21.0±0.8φ 2.0±0.5 11.9 to 15.4 Outer edge of flange 17.5±1.0 13.5±1.0 180+0 φ -1.5 -060φ
PS7200U-1A-F3 PS7200U-1A-F4 Tape Direction Outline and Dimensions (Tape) 1.55±0.1 2.0±0.05 4.0±0.1 1.75±0.1 4.6±0.1 2.9 MAX. 0.38.0±0.1 2.4±0.1 1.5+0.1 7.4±0.1 5.5±0.05 12.0±0.2 Outline and Dimensions (Reel) Packing: 3 500 pcs/reel 2.0±0.5 R 1.0 13.0±0.2φ 21.0±0.8φ 330±2.0 φ 100±1.0 φ 2.0±0.5 11.9 to 15.4 Outer edge of flange 17.5±1.0 13.5±1.0 13.0±0.2φ
- Recommended soldering conditions (1) Infrared reflow soldering
- Peak reflow temperature 260 °C or below (package surface temperature)
- Time of peak reflow temperature 10 seconds or less
- Time of temperature higher than 220°C 60 seconds or less
- Time to preheat temperature from 120 to 180°C 120 ±30 s
- Number of reflows Three
- Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (2) Wave soldering
- Temperature 260°C or below (molten solder temperature)
- Time 10 seconds or less
- Preheating conditions 120 °C or below (package surface temperature)
- Number of times One
- Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron
- Peak Temperature (lead part temperature) 350 °C or below
- Time (each pins) 3 seconds or less
- Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100°C 220ºC Package Surface Temperature T (ºC) Time (s) (heating) to 10 s to 60 s 260ºC MAX. Recommended Temperature Profile of Infrared Reflow 120±30 s (preheating) 180ºC 120ºC
(4) Cautions
- Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 04/11/2005