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Mounting Pad Dimensions for Renesas Optocouplers & Solid State Relays PN2009 California Eastern Laboratories P r o d u c t N o t e Your source for Renesas RF, Microwave, Optoelectronic, and Fiber Optic Semiconductor Devices. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 (408) 919-2500 FAX (408) 988-0279 Telex 34/6393 www.cel.com Information and data presented here is subject to change without notice. California Eastern Laboratories assumes no responsibility for the use of any circuits described herein and makes no representations or warranties, expressed or implied, that such circuits are free from patent infringement. © California Eastern Laboratories 11/06/2012 Package A B1 B2 C D Package A B C Surface Mount DIP, SOP and SSOP Packages (mm) DIP (SMT) 4, 6, 8, 12, 16 Pin 8.2 - 2.54 1.7 2.2 DIP (L2 – SMT) 4, 6, 8, 16 Pin 10.2 - 2.54 1.7 2.2 SOP 4, 8, 16 Pin 6.25 - 2.54 0.8 1.45 SOP SSOP 4, 16 Pin SSOP 8 Pin (SO-8) SSOP 12 Pin LSDIP 8 Pin 16.6 - 1.27 0.9 2 SDIP 6 Pin 9.2 - 1.27 0.8 2.2 Mini Flat Packages (mm) Optocoupler Version PS29xx, 1.27mm Pitch 4.14 4.7 5.7 SSR Version PS78xx, 1.27mm Pitch 3.6 4.4 5.3 NOTES: The Mini Flat package meets the 4.0mm air distance and outer creepage requirement. All dimensions are subject to change without notice. Please contact CEL to ensure that you have the latest version of this document. C A D A B 24–R0.1 C 0.8 0.6 1.27 0.35 Reference Value