PLCC AMKOR | Alldatasheet
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Features: Thermal Resistance: Electrical: Reliability: LEADFRAME www.amkor.com Plastic Leaded Chip Carrier (PLCC) Packages: Amkor’s PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. All PLCC products are offered with and without heatspreaders. The heatspreader versions are identical in form factor to the standard non-heatspreader versions. Both versions are JEDEC compliant in all respects. The heatspreader versions give the system designer greater latitude in thermally enhanced board level and/or system design. All products utilize the most advanced manufacturing equipment offered today. Lead free and green material set are qualified. Applications: Amkor’s PLCC product family was engi- neered to meet JEDEC requirements for “J” leaded surface mount packages. As such, they take up less board space than equiva- lent “gull” formed product in the same body size. Due to the flexibility and performance offered, most industry circuit types can be designed into this product. This would include memory, processors and controllers, ASIC, DSP, PC chipset, to name a few. Applications range from consumer through automotive and aerospace. Amkor’s PLCC IC package portfolio provides: .352” x .352” to 1.152” x 1.152” body size 20 to 84 lead counts JEDEC standard compliant Available with heatspreader option Fine pitch wire bond capability Multi-Layer PCB Theta JA (°C/W) by Velocity Body Size Pad Size Pkg (mm) (mm) 0 200 500 *With Drop-in heatspreader option Tested @ 1W Self Bulk Self Body Size Pad Size Inductance Capacitance Resistance Pkg (mm) (mm) Lead (nH) (pF) (mΩ) Shortest 1.780 0.583 11.1 Simulated Results @ 100 MHz Amkor’s PLCCs are reliability assured through optimized design, material and process enabling high performance operation of your IC chip. Moisture sensitivity JEDEC Level 3 characterization 30 °C/60% - 192 hrs, SAT-192 hrs PCT 121 °C, 2 atm, 100%RH, 504 hours Temp cycle -65/150 °C, 1000 cycles Temp/Humidity 85 °C/85% RH, 1000 hours High temp storage 150 °C, 1000 hours VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . DS293D Rev Date: 07’03
PLCC NOMINAL PACKAGE DIMENSIONS PLCC LEADFRAME Process Highlights Die thickness (max) 25 mils Strip solder plating 85/15 Sn/Pb or 100% Sn Strip marking Laser/pad/offset Lead inspection Optical Pack/ship options Bar code Test Services Program/generation/conversion Product engineering Wafer sort 256 pin x 20 MHz test system available -55 °C to +165 °C test available Burn-in Shipping Clear antistatic tube 20 inches data sheet With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and withou t notice. www.amkor.com Configuration Options: Cross-section PLCC Body Amkor JEDEC Qty Per Lead Count Body Size Thickness Lead Pitch Lead Form Dwg No. Dwg No. Tube Square 20 .352 x .352 0.152 0.05 N/A 00060 MS-018 46 28 .452 x .452 0.152 0.05 N/A 00060 MS-018 37 44 .652 x .652 0.152 0.05 N/A 00060 MS-018 26 52 .752 x .752 0.152 0.05 N/A 00060 MS-018 23 68 .952 x .952 0.150 0.05 N/A 00060 MS-018 18 84 1.152 x 1.152 0.150 0.05 N/A 00060 MS-018 15 Rectangular 32 .452 x .552 0.109 0.05 N/A 00061 MS-016 30