PI3012A AMI | Alldatasheet
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Table 2. Electro-Optical Characteristic by the time interval between two start pulses. of the line integration time. of the line integration time. Vpmax is the maximum pixel output voltage in the light. Vpmin is the minimum pixel output voltage in the light. Note: In the light means the sensor is exposed to the light. Vdmax is the maximum pixel output voltage in the dark. Vdmin is the minimum pixel output voltage in the dark.
Absolute Maximum Ratings: Parameters Symbol Maximum Rating Units Power Supply Voltage VDD 10 Volts Power Supply Current IDD <2.0 ma Input clock pulse (high level) Vih Vdd + 0.5 Volts Input clock pulse (low level) Vil -0.25 Volts Operating Temperature Top 0 to 50 oC Operating Humidity Hop 10 to 85 RH % Storage Temperature Tstg -25 to 75 oC Storage Humidity Hstg 10 to 90 RH % Recommended Operating Conditions at Room Temperature Parameters Symbol Min. Typical Max. Units Notes Power Supply VDD 4.5 5.0 5.5 Volts Input clock pulses high level Vih 2.8 5.0 VDD Volts 1 Input clock pulse low level Vil 0 0 0.8 Volts 1 Operating high level exposed output Iout 2 Clock Frequency f 0.1 2.0 5.0 MHz 3 Clock pulse duty cycle 25 % 4 Clock pulse high durations tw 0.125 µsec 4 Integration time Tint 1.3 10 ms 3 Operating Temperature Top 25 50 oC Notes: (1) Applies to both CP and SP. (2) The output is a current that is proportional to the charges, which are integrated on the phototransistor’s base via photon-to-electron conversion. Accordingly during read out, these charges are discharged from the base through the transistor’s emitter proportionally to the Beta of the phototransistor. Hence, the emitter current, that flows to the output video line, is the signal that is proportional to the photon integrated charges. To gain the optimum performance, the signal interfacing circuits are designed consistently with this signal process. The video signal current is made to flow into a virtual ground, while the signal extraction circuit is made to integrate these charges that converts these charges into the output signal voltage. The circuit used for the converting the current charge to voltage is attached to this document as a separate sheet. (3) Although the clock frequency will operate the device at less than 100KHz, it is recommended that the device be operated above 500KHz to maintain the devices performance characteristic. (4) The clock duty cycle typically is 25 %. However, it can operate with duty cycle as large as 50 %. This specified duty cycle is suggested because the 25 % of clock time, or the positive time of the clock, is used in the reset process, while the remainder of the time is used inextracting the signal during each pixel. Accordingly at low clock frequencies, it would help the PAGE 4 OF 7 PI3012A, 6/9/99
a 50% duty cycle the operator has additional timing flexibility if it desired. Switching Characteristics @ 25o C. Figure 3. Timing Diagram of the PI3012 A Sensor
- Clock pulse width varies with frequency, as it was explained foregoing paragraphs. The number given in table is the minimum value regardless of the clock frequency. 2. Prohibit crossing time to insure that two start pulses are not locked into the shift register in any single scan time. 3. Pixel delay times and settling time depend on the output amplifier, which is employed. The numbers, which are given, are measured with an EL2044 amplifier. Note the impulse signal current out of the device is within 10 ns. Hence, the faster the amplifier with a quick settling time and with a lower input capacitance will allow the signal to rise and settle quickly with speeds greater than those given above. Output Circuits for Video Signal The circuit, attached on this document as separate page, is a recommended module circuit for operating the sensors. It was also used in the forgoing characterization of the sensor’s signal output. See page 7. Optional Wafer Probe Classification An optional wafer classification is available for users of the PI3012A devices. To achieve the highest degree of amplitude uniformity, the wafers are sorted and classified. The wafers are rank in accordance to their output amplitudes. Accordingly the users are assured of a greater uniform output from a CIS module when the sensors are selected from the same wafer. PAGE 6 OF 7 PI3012A, 6/9/99 ©1999 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications are subject to change without notice. Contents may not be reproduced in whole or in part without the express prior written permission of Peripheral Imaging Corporation. Information furnished herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral Imaging Corporation for its use nor for any infringement of patents or other rights granted by implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation.
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