PI331MC-DR AMI | Alldatasheet

Document overview

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Technical content

  • Light source, lens, and sensor are integrated into a single module
  • 11.8 dpm resolution, 89 mm scanning length
  • Up to 600 µsec/line scanning speed, with 2 MHz pixel rate (See Table 3, Note 3.) (Other speeds are also available)
  • Wide dynamic range
  • Two-Level Tracking Digital Output ( “ Dynamic Threshold Digitizer ” )
  • Red light source 660nm (Other colors are available)
  • Compact size ≅ 13 mm x 25.6 mm x 102 mm
  • Low power
  • Light weight General Description The PI331MC-DR is a contact image sensor, CIS, module with a n additional on board circuit that digitizes the analog pixels from the CIS image sensor to a “ background- tracking ” , two-level digital output signals. It is based on CIS modu le, the PI305M-A6 manufactured by PIC, but with a shorter read length of 89 mm . Hence, its performance is equivalent to the PI305M-A6 that uses MOS image sensor technology to gains its high- speed performance and high sensitivity. The PI331MC-DR is su itable for scanning documents with width of 89 mm and with resolution of 11.8 do ts per millimeter. Its has a broad applications, but specially designed for the following areas:
  • Where data compression is required, such as in data transmis sions. PAGE 1 OF 9 - PI331MC-DR, 11-8-00 PI331MC-DR Engineering Data Sheet Peripheral Imaging Corporation 300DPI CIS Two Level Digital Output Module
  • Where component pin-out count must be kept to a minimum. The background-tracking-digitizing circuits in the PI331MC-D R have been referred to as the “ dynamic threshold ” two-level A/D converter. For the purpose of describing the module ’s characteristics this “ dynamic threshold ” processing circuit shall herein be referred to as the “ tracking digitizer ” . Module Description The PI331MC-DR module consists of 11 sensors that are cascad ed to provide 1056 photo-detectors with their associated multiplex switches, an d a digital shift register that controls its sequential readout. Mounted in the module is on e-to-one graded-indexed micro lens array that focuses the scanned documents to image onto its sensing plane. A buffer amplifier amplifies the video pixels from the image s ensors and passes them to analog digitizing circuit, where video pixels are converted to digital signal and passed to output of the module. See Figure 1, the block diagram of the PI331MC-DR module. Illumination is by means of an integrated LED light source. All components are housed in a small plastic housing with a cover glass which acts as the focal point for the object being scanned and protects the imaging array, the micro lens assem bly, and the LED light source from dust. The pictorial of PI331MC-DR cross section is shown in Figure 2. PAGE 2 OF 9 - PI331MC-DR, 11-8-00

Figure 1. PI331MC-DR Module Block Diagram.

The table of pins and their functions are listed in Table I, Pin Configuration.

1 DIGOUT Digital Video Output

2 Vdd (+5 V) Ground; 0 V

3 Vn (-10 to -5V) Negative power supply

4 SP Start Pulse for the shift register

5 GRD Ground; 0 V

6 CLOCK Clock for the shift register

7 GLED Return for the LED light source

8 VLED Power in for the LED light

Table 1. Pin configuration The connector is a 8-pin 1-mm surface mount flex input, Molex 52207-0890.

  • Clock is on Pin 6 of the I/O Connector. This is main clock i nput into the CIS Module.
  • SP is on Pin 4. This is the start clock input to the CIS Mo dule. PAGE 4 OF 9 - PI331MC-DR, 11-8-00
  • VDD is on Pin 2. This is a + 5 Volts supply.
  • VN is on Pin 3. This is a ( – 10 to – 5) Volts supply.
  • VLED is on Pin 8. This is a +5 Volts supply for the LED lig ht source. Note: Power return for the LED light source is GLED on Pin 7 and the ground return for the CIS modules is pin 5. Video Output : DIGOUT is on pin 1 of the I/O connector. This is the digital video output from the CIS module. Reflection off the dark target produces a digital si gnal of “ 0 ” level, while the white reflection off the white target produces a digital level of “ one ” . The amplitudes of the white and dark are listed in the table below: Electro-Optical Characteristics (25 ° C)

Table 2. Electro-optical characteristics at 25 ° C. Table 3. Recommended Operating Conditions (25 ° C)

(1) The clock frequency and the integration times must be f ixed at the factory. time as indicated by the minimum and maximum clock speeds. (2) Clock pulse high is specified at 2.0 MHz at 25% duty. hence the time constant will determine the optimum integrati on time. Diagram. The timing parametric values and their symbols are given in the Table 4. Table 4. Switching Parameter and Timing Symbol Definition

Signal delay time tdl 50 ns Signal settling time tsh 120 ns Digital Signal Delay tddl 60 ns Digital Signal Off Delay tdodl 300 ns Table 5 Absolute Maximum Rating: Parameter Symbols Maximum Rating Units Vdd 10 V Idd 50 mA Vn -15 V In 30 mA VLED 6.0 V Power supply voltage ILED 250 mA Input clock pulse (high level) Vih Vdd – 0.5 V Input clock pulse (low level) Vil -0.8 V Note: These are absolute maximum parameters and should not b e used in operation. Table 6 Operating Environment Operating temperature Top 0 to 50 0 C Operating humidity Hop 10 to 85 % Storage temperature Tstg -25 to+75 0 C Storage humidity Hstg 5 to 95 % Setup and Adjustments The Clock Rate and Integration Time: This was factory set to a specific application. See note 1 under Table 2, Electro-optical characteristics at 25 ° C. The clock frequency was set to 2.0MHz. The total integration time was set to 600 µsec. The Required Power. The required power is slightly greater than the specified va lues in Table 3. Circuit Power: Positive Supply: +5 V olts @ 25 mA Negative Supply: -10 Volts @ 15 mA LED Power: +5 Volts @ 180 mA PAGE 7 OF 9 - PI331MC-DR, 11-8-00