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Teledyne Microwave Solutions • 650-691-9800 • FAX: 650-962-6845 Specifications subject to change without notice. PHA-0370B Typical Biasing Configuration NOTES: 1. Permanent damage may occur if any of these limits are exceeded. Technical Data PHA-0370B Suggested Maximum Ratings Parameter Suggested Maximum [1] Device Current 80 mA RF Input Power +13 dBm Junction Temperature +200°C Storage Temperature -65 to +200°C Cascadable Silicon Bipolar MMIC Amplifier PHA-0370B
Description
The PHA-0370B is a high performance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) housed in a hermetic high reliability 70 mil microstrip package. This MMIC is designed for use as a general purpose 50 Ω gain block. Typical applications include narrow and broad band IF and RF amplifiers in industrial and military applications. 70 mil Package Dimensions 0.02 0.040 NOTES: (Unless otherwise specified) 1. Dimensions are in inches 2. Tolerances: X.XXX = ±0.005 0.0350.004 ± 0.002 0.070 0.495 ± 0.030 Gnd RF in RF Out GndTMS is not the original device manufacturer. TMS procures commercial off the shelf product and UpScreens per the following process flow. For custom screening requirements, Quality Conformance Inspection, or additional electrical selection, please contact TMS.
Teledyne Microwave Solutions • 650-691-9800 • FAX: 650-962-6845 Specifications subject to change without notice. PHA-0370B Electrical Specifications [1] -55°C +25°C +125°C Symbol Parameters and Test Conditions Units Min Max Min Max Min Max GP Power Gain (S21 f = 0.1GHz ΔGp Gain Flatness f = 0.1 to 1.8 GHz dB ±1.5 ±1.0 ±1.5 NOTE: 1. The recommended operating current range for this device is 20 to 50 mA. TMS UpScreen Table 2A 100% Screening Screening Test/Operation MIL-STD-883 Method Conditions Stabilization Bake 1008 Condition C, Ta = +150 °C t= 24 hrs. Temperature Cycling 1010 Condition C, -65 to +150°C, 10 cycles minimum Constant Acceleration 2001 Condition E, 30,000 G, Y1 axis only Pre Burn-in Electrical Test (optional) +25°C; Gp, ΔGp, and Vd Burn-in 1015 Condition B, t= 160 hrs., Ta = +125°C, Final Electrical Test ----- +25°C; Gp, ΔGp, and Vd Percent Defective Allowable (PDA) 5% max.; applies to 25°C Final Electrical Test Hermeticity Fine Leak Gross Leak 1014 1014 Condition A Condition C External Visual 2009 Group A Inspection +125°C -55 °C n = 116, r = 1 Gp, Vd and ΔGp Gp, Vd and ΔGp Shipment Packaging 10 units per strip Marking: Manufacturer’s marking (if applicable) will remain on devices. TMS individual packaging will be labeled with TMS Part Number and manufacturer date code. TMS shipment date code will appear on outer label and C of C. Certificate of Conformance (C of C) will be sent with each shipment. This document provides objective evidence of TMS testing and documents traceability to manufacturers wafer/lot identification.