UPC8240T6N-E2-A CEL | Alldatasheet
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Technical content
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge BIPOLAR ANALOG INTEGRATED CIRCUIT PC8240T6N SiGe:C LOW NOISE AMPLIFIER FOR GPS Document No. PU10735EJ01V0DS (1st edition) Date Published October 2008 NS
DESCRIPTION
The PC8240T6N is a silicon germanium carbon (SiGe:C) monolithic integrated circuit low noise amplifier for GPS. This device exhibits low noise figure and high gain characteristics, to improve the sensitivity of GPS receivers. The PC8240T6N contains the output matching circuit to reduce external components and system size. The package is a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) suitable for surface mounting. This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
- Supply Voltage : VCC = 1.6 to 3.3 V (2.7 V TYP.)
- Low Noise Figure : NF = 1.0 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz : NF = 1.0 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
- High Gain : GP = 28 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz : GP = 27 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
- Low current consumption : ICC = 6.5 mA TYP. @ VCC = 2.7 V
- Built-in power-saving function : VPSon = 1.0 V to VCC, VPSoff = 0 to 0.4 V
- High-density surface mounting : 6-pin plastic TSON (T6N) package (1.5 1.5 0.37 mm)
- Included output matching circuit
- Included very robust bandgap regulator (Small VCC and TA dependence)
- Included protection circuits for ESD APPLICATION
- Low noise amplifier for GPS
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form PC8240T6N-E2 PC8240T6N-E2-A 6-pin plastic TSON (T6N) (Pb-Free) C3T 8 mm wide embossed taping Pin 1, 6 face the perforation side of the tape Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC8240T6N-A
Data Sheet PU10735EJ01V0DS 2 PC8240T6N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name
1 VCC
2 GND
3 INPUT
4 Power Save
5 OUTPUT
6 VCC
Remark Exposed pad : GND ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC TA = +25C 4.0 V Power-Saving Voltage VPS TA = +25C 4.0 V Total Power Dissipation Ptot 150 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin +10 dBm RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 1.6 2.7 3.3 V Operating Ambient Temperature TA 40 +25 +85 C Power Save Turn-on Voltage VPSon 1.0 VCC V Power Save Turn-off Voltage VPSoff 0 0.4 V
ELECTRICAL CHARACTERISTICS
(TA = +25C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No Signal (VPS = 2.7 V) 4.5 6.5 9.0 mA At Power-Saving Mode (VPS = 0 V) 1 A Power Gain GP Pin = 35 dBm 24.5 28 31 dB Noise Figure NF 1.0 1.3 dB Input Return Loss RLin 6.5 8.5 dB Output Return Loss RLout 10 17 dB
Data Sheet PU10735EJ01V0DS 3 PC8240T6N STANDARD CHARACTERISTICS FOR REFERENCE 1 (TA = +25C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified) Parameter Symbol Test Conditions Reference Unit Input 3rd Order Intercept Point IIP3 fin1 = 1 575 MHz, fin2 = 1 574 MHz 21.5 dBm Isolation ISL 55 dB Gain 1 dB Compression Input Power Pin (1 dB) 22.5 dBm STANDARD CHARACTERISTICS FOR REFERENCE 2 (TA = +25C, VCC = VPS = 1.8 V, fin = 1 575 MHz, unless otherwise specified) Parameter Symbol Test Conditions Reference Unit Circuit Current ICC No Signal (VPS = 1.8 V) 6.2 mA Power Gain GP Pin = 35 dBm 27 dB Noise Figure NF 1.0 dB Input Return Loss RLin 8.5 dB Output Return Loss RLout 16.5 dB Input 3rd Order Intercept Point IIP3 fin1 = 1 575 MHz, fin2 = 1 574 MHz 21.5 dBm Isolation ISL 55 dB Gain 1 dB Compression Input Power Pin (1 dB) 26.5 dBm TEST CIRCUIT
Data Sheet PU10735EJ01V0DS 4 PC8240T6N TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified) Remark The graphs indicate nominal characteristics.
Data Sheet PU10735EJ01V0DS 5 PC8240T6N Remark The graphs indicate nominal characteristics.
Data Sheet PU10735EJ01V0DS 6 PC8240T6N Remark The graphs indicate nominal characteristics.
Data Sheet PU10735EJ01V0DS 7 PC8240T6N Remark The graphs indicate nominal characteristics.
Data Sheet PU10735EJ01V0DS 8 PC8240T6N S-PARAMETERS (TA = +25C, VCC = VPS = 2.7 V, monitored at connector on board) Remark The graphs indicate nominal characteristics.
Data Sheet PU10735EJ01V0DS 9 PC8240T6N S-PARAMETERS (TA = +25C, VCC = VPS = 1.8 V, monitored at connector on board) Remark The graphs indicate nominal characteristics.
Data Sheet PU10735EJ01V0DS 10 PC8240T6N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (T6N) (UNIT: mm)
Data Sheet PU10735EJ01V0DS 11 PC8240T6N NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) Do not supply DC voltage to INPUT pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating).