PAP7501V PIXART | Alldatasheet
Document overview
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Technical content
Features
.USB Features z USB 2.0 and 1.1 compliance(high speed and full speed transceiver). z USB video class 1.1 compliance. z USB audio class 1.0 compliance. .Micro Controller Features z Built-in 8 bit micro controller with 40K-byte of mask ROM and 24K-byte SRAM. z Firmware supports AE, AWB, and USB protocol. z Programmable codes uploaded from serial EEPROM/Flash. .Sensor Controller Features. z Support up to VGA CMOS image sensors. z Support 8 bit raw image data or YUV2 input from CMOS sensor. z On chip color processor engine. z Built-in MJPEG encoder. z Support 2 wires serial interface for sensor control. . Audio Controller Features z Audio interface: -Built in 10 bit mono audio ADC for audio recording through microphone. z -Sampling rate @16/48kHZ, resolution 16 bits format. z Recording, mute and volume control. . Miscellaneous Features z Power consumption: < 100mA z USB 5V power in, on-chip 3.3V regulator for IO PAD and PHY, on-chip 1.8V regulator for core logic.
Ordering Information
Order number Package Type Package Size(mm) PAP7501V 48-pin QFN 5.53 x 5.53
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 2 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 1. Pin Assignment Pin# Name Type Description
1 GND33A_PLL_I GND Ground for PLL
2 VDD5MA PWR 5V Power for analog circuit
3 VDD28A_MIC BYPASS Analog power for Audio MIC, 2.8V
4 VCOM BYPASS Microphone common mode voltage reference
5 MIC_P IN Microphone positive input
6 MIC_N IN Microphone negative input
7 VDD33A_PGA BYPASS Analog power for Audio PGA, 3.3V
8 VSSA GND Microphone GND
9 VDD33A_ADC BYPASS Analog power for Audio ADC, 3.3V
10 VSSQ GND Digital ground
11 RSTN IN Chip power up reset (Internal pull-up 100Kohm)
12 SEN_CSB OUT Chip select of EEPROM
13 KEY IN Snapshot control signal (Active Low, internal pull-up 100Kohm)
14 GPIO4 I/O General purpose I/O
15 VDD18K BYPASS Logic power for digit circuit, 1.8V 16 VDD33Q BYPASS Logic power for digit circuit, 3.3V
17 SEN_CLK OUT Clock output for sensor
18 SEN_SCL OUT I2C clock
19 SEN_SDA I/O I2C data
20 I_VSYNC IN Vertical synchronization signal
21 I_HSYNC IN Horizontal synchronization signal
22 EPR_CSB IN Chip Select of EEPROM
23 EPR_SO IN Data out of EEPROM
24 EPR_SI OUT Data input of EEPROM
25 EPR_SCK OUT Serial clock of EEPROM
26 I_PXD7 IN Sensor digital data input
27 I_PXD6 IN Sensor digital data input
28 I_PXD5 IN Sensor digital data input
29 I_PXD4 IN Sensor digital data input
30 I_PXD3 IN Sensor digital data input
31 I_PXD2 IN Sensor digital data input
32 I_PXD1 IN Sensor digital data input
33 I_PXD0 IN Sensor digital data input
34 I_PXCLK IN Sensor pixel clock input
35 VDD5MD PWR 5V power for digit circuit
36 VDDAYS BYPASS Logic power for digit circuit, 2.5V
37 VDD5MV PWR 5V power for PHY circuit
38 VSSQ GND Digital ground
39 VDD33A_HSRT_O BYPASS Analog power for TX/RX
40 VDD18K BYPASS Logic power for digit circuit, 1.8V
41 OSC_IN IN Crystal input
42 OSC_OUT OUT Crystal output
43 VDD33A_HSRT_I BYPASS Analog power for TX/RX
44 GND33A_HSRT_I GND Ground for USB TX/RX
45 RRET IN Reference supply current for PHY
46 DM I/O DM for USB PHY
47 DP I/O DP for USB PHY
48 VDD33A_PLL_I BYPASS Analog power for PLL
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 3 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 2.Block Diagram 4FOTPS .*$ "VEJP1(""%$*NBHFQSDFTTJOH &&130. #PPU -PBEFS ,FZ %." */5 '64# 64# 1): 1-- $SZTUBM The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard. It integrates micro-controller, color processor engine, MJPEG encoder, and 24K-byte programmable SRAM.
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 4 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 3. Specifications Absolute Maximum Ratings Exceeding the Absolute Maximum Ratings shown below invalidates all AC and DC electrical specifications and may result in permanent device damage. Symbol Parameter Min Max Unit Notes TSTG Ambient storage temperature -25 125 °C VDD DC supply voltage -0.5 5.5 V VIN DC input voltage 0.5 3.8 V VOUT DC output voltage -0.5 3.8 V ESD ESD Rating, Human Body model 2 kV Recommend Operating Condition Symbol Parameter Min Typ. Max Unit Notes Operation -10 - 70 °C TA Temperature Range Stable Image 0 - 50 °C VDD Power supply voltage 4.5 5.0 5.5 V FCLK System clock frequency - 12.0 - MHz Symbol Parameter Min. Typ. Max. Unit Notes Type: PWR IDD Operating Current - 70 - mA @30 frame/sec IPWDN Power Down current 500u Type: IN & I/O, Reset VIH Input voltage HIGH - V VIL Input voltage LOW - V Type: OUT & I/O VOH Output voltage HIGH 0.9 x VDD33Q - - V VOL Output voltage LOW - - 0.1 x VDD33Q V
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 5 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 4. Packing Information
4.1 Product Ordering Information
Product Number : PAP7501 V
4.2 Material List
*UFNT 1SPDFTT .BUFSJBM -FBEGSBNF.BUFSJBM $PQQFS %JF"UUBDI $POEVDUJWF&QPYZ 8JSF#POEJOH /ƵNJM(PME8JSF $PWFS &QPYZ.PMEJOH$PNQPVOE .BSLJOH -BTFSPS*OL -FBE'JOJTI 1E/J"VQMBUJOH
4.3 Package Outline Dimension
Saw Type(A type): QFN 6*6 48L with lead-free process Part Number
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 6 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 Punch Type(U type):
4.4 Pin Assignment
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 7 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008
4.5 Recommended Layout PCB
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 8 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008
4.6 Packing Information
Tray (11 pcs) Static Shielding Bag PART NO. : LOT NO. : QTY : QA : Label PACKING BOX ELECTROSTATIC SENSITIVE DEVICES CAUTION LABEL One packing box capacity One packing box 4900 units Remark ( 490 units x 10 Trays) Tray durable temperature = 150Ċ Note: 1. When the units is out of dry packing, should be operation at : Temperature = ö30Ċ , Humidity = ö60% RH 2. If units is out of dry packing over 168 hrs, before go through infrared reflow process must be bake with 125Ċ Ô5Ċ @24hrs, to remove the moisture.
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 9 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008
4.7 Recommended Condition For Infrared Reflow
Carefully observe the mounting conditions, recommended temperature profile when Mounting infrared reflows is show in the figure below. Recommend Pb-free solder paste vender & type : 1. Almit LFM-48W TM-HP 2. Senju M705-GRN360-K 3FDPNNFOE3FGMPX1SPGJMF 5JNF 5FNQ Pre-heat Melting area ( Sec ) Programming rate 1.5~2.5 oC/sec Pre-heat 170~200oC 90 +/- 30 sec Melting area >220oC 30~50sec with peak temperature 230~245oC
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 10 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008
4.8 Handling precaution for the prevention of ESD
Explained below are procedures that must be taken in fabrication to prevent the electrostatic destruction of semiconductor devices. The following basic rules must be obeyed. 1. Equalize potentials of terminals when transporting or storing. 2. Equalize the potentials of the electric device, work table, and operator's body that may come in contact with the IC's. 3. Prepare an environment that does not generate static electricity. One method is keeping relative humidity in the work room to about 50%. Operator 1. The operator should wear wrist straps. (Must maintain electric contact with bare skin) 2. Wear cotton or antistatic-treated materials clothes and gloves. 3. When a conductive mat will be used, must be ware conductive shoes. 4. Do not touch the IC's leads. Touch the body of IC's when holding. Equipment and tools 1. Any electrical equipments and tools located on the work table surface must be isolated from The work table surface, and ground the equipments and tools that are to be used. 2. Work table surface must be use conductive material or conductive mat. (Should be ground through a 1MƸ resistor) Transporting, storing and packing 1. Use conductive IC's tray, and conductive or shielding bag to store IC's. Soldering operation 1. Use a soldering iron with a grounding wire. 2. When perform manual soldering operation, the operator should wear wrist straps. 3. Do not use the desoldering pump when removing the IC's from the PCB board. Use a solder-wick or equivalent.
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 11 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 5. Reference Application Circuit
5.1 PAP7501 with PAS6311
0.1u USB_5V VDD33A_HSRT_I C35 1uF_N.M. USB_5V EPR_SO MICROPHONE VDD33A_HSRT_O VDD28A_MIC VDD33A_PLL_I VDD33A_PLL_I EPR_SCK VDD33Q R14 10k VCOM VDD33Q OSC_IN C22 2.2u I_HSYNC I_VSYNC VDD18K C34 1uF_N.M. VDD33Q 100k GPIO_4 VDD28A_MIC C28 1uF_N.M. EPR_HOLD I_PX D6 R11 100k VCOM VDD5MA VDD33Q VDD33A_PLL_I EPR_SO VDD33A_HSRT_I I_PX D7 C15 22u +C13 22u VSSV RST NWP C33 0.47uF_N.M. C18 0.01u L1 3.3u 1 2 SEN_CLK I_PXD2 C27 0.1u 5.1k 25F512A CS SO WP GND VCC HOLD SCK SI VDDQ PAP7501_48P I_PX D1 I_PX D0 I_PX CLK VDD5MD VDD33A_HSRT_O VDD18K XSCI XSCO VDD33A_HSRT_I GND33A_HSRT_I RREF DM DP VDD33A_PLL_I MIC _P MIC _N VDD33A_PGA VSSA VDD33A_ADC VSSQ RSTN SEN_CSB KEY GPIO_4 VDD18K VDD33Q SEN_CLK I_PX D7 I_PX D6 I_PX D5 I_PX D4 I_PX D3 I_PX D2 VCOM SEN_SCL GND33A_PLL_I VDD28A_MIC SEN_SDA I_VSYNC I_HSYNC EPR_CSB EPR_SCK EPR_SI EPR_SO VDDAYS VSSQ VDD5MV VDD5MA I_PXD4 C31 1u 10M VDD28A_MIC C10 10pF R3 1M MIC_PC21 1u OSC_OUT VSSQ VDD33Q I_PXD5 SEN_SCL C1 1u R13 100k I_PX D6 CON1 MINI USB 5P +5V HC1HC4 HC2HC3 NC GND2 SEN_CLK RESET I_HSYNC Note: xx_N_M=> No Mount VDD33Q VCOM VDD33A_HSRT_O VDD33A_HSRT_O C30 0.1u 0.1u I_PX D0 VSSA R16 100k VDDA C17 10u I_PX D4 I_PX D7 VDDQ 2.2k KEY 4.7nF/250V VDD5MA I_PXD3 GND L3 3.3uH VDD18K C29 1u VDD5MV VDD33Q C25 20pF_N.M. EPR_SI VSSA C20 1u RESET C12 20pF_N.M. SEN_SDA I_PXD0 EPR_SI +C26 10u SEN_SCL I_PX D3 VDD33Q I_PX D5 SEN_CSB C2 1u VDD5MD EPR_CSB SEN_CLK VDDAY VDDA C23 2.2u I_PXCLK 2.2k EPR_HOLD R10 100k C16 0.1u I_PX D2 10k I_PX CLK GND33A_HSRT_O VDD33Q C11 10pF I_PX D1 KEY VDDAYS VDD33A_HSRT_I GPIO_4 C5 1u VDD33A_ADC MIC_N SEN_CSB +C7 4.7u C32 0.47uF_N.M. I_VSYNC C8 0.1u L4 3.3u 1 2 PAS6311LT A2A1 PX7 PX6 PX5 PX4 CSB SCL VSSA SDA VDDA VDDAY VDDD VSYNC HSYNC PXCLK VDDQ SYSCLK RESET VSSD PX9 PX8 PX3 PX2 PX1PX0 C14 20pF_N.M. EPR_SCK C24 1uF VDD18K EPR_CSB 10k R12 300k VDD5MD C19 22u VDDAYS VDDA USB_SHADING VDD5MD VDD5MV L2 3.3u 1 2 D1_Green LED-0603 I_PXD1 12k Y1 12MHz VDD33A_ADC R17 VDDAY VDD5MV VDDQ R15 10k VSSQ VDD5MA I_PX CLK WP SEN_SDA VDD33A_PGA VDD33Q SEN_CSB USB_SHADING VDD33A_PGA VDDAYS
PixArt Imaging Inc. PAP7501V USB2.0 Camera All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 12 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 6. Update History Version Update Date V1.0 Creation, Preliminary 1 st version 01/17/2008 V1.1 Update circuit and Package information, Add C30~C35, R17, D1, Change R5 to 5.1k ohm, R6 and R9 Change to 2.2k ohm 05/06/2008