MSM7512B

MSM7512B OKI | Alldatasheet

Document overview

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Technical content

The MSM7512B is useful for the ITU-T V.23 modem, for examples, low cost built-in modems, telecontrol systems, home security systems, etc. The family version, MSM7510 for ITU-T V.21, will be available following this device. Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these devices need two power supplies, +5 V for digital and +12 V for analog. New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power consumption.

FEATURES

• Conforms to ITU-T V.23, 1200 bps Half Duplex
• Conforms to ITU-T V.23, 75 bps transmitter
• Single Power Supply: +3 V to +5 V
• Low Power Consumption Operating Mode: 25 mW Typ. Power Down Mode: 0.1 mW Max.
• Line Hybrid Circuit on Chip
• Line Direct Drive Capability of Analog Output
• 3.579545 MHz Crystal Oscillator
• Digital Interface: TTL
• Package options: 16-pin plastic DIP (DIP16-P-300–2.54) (Product name: MSM7512BRS) 24-pin plastic SOP (SOP24-P-430-1.27–K) (Product name: MSM7512BGS-K) ¡ Semiconductor MSM7512B 1200 bps Half Duplex FSK Modem – ITU-T V.23 E2A0014-16-X0 This version: Jan. 1998 Previous version: Nov. 1996

(2) (6) (7) VDD (1) CLK (8) RD (9) CD (10) XD (11) RS (12) CONT. Demodulator Modulator *R1 *R2 AO (3) *R3 *R2 AOG*R2 EAI (4) TEST (13) MOD1 (14) MOD2 (15) AOG (16) CLK GEN.OSC SG GEN. GND (5) * R1 to R3 ³ 50 kW ( ) : for MSM7512BRS *R1 FSK & ANS Bandpass Filter

PIN CONFIGURATION (TOP VIEW) 8 9 16VDD AI AO EAI GND CLK AOG MOD2 MOD1 TEST RS XD CD RD 16-Pin Plastic DIP 12 13 24VDD NC AI AO EAI NC AOG NC MOD2 NC NC CD NC CLK NC RD 24-Pin Plastic SOP NC : No connect pin NC GND MOD1 TEST RS XD

Note : I* : Internally pulled-up input pin.

11 V DD — +3 V to +5 V Power Supply

2 3 AI I Analog receive signal input. 3 5 AO O Analog transmit signal output. 4 6 EAI I External analog signal input. The signal applied to this pin is transmitted from AO via transmit output amplifier. When not using this pin, it should be left open. 5 7 GND — Ground, 0 V. 6 8 X1 I 3.579545 MHz crystal resonator should be connected to X1 and X2. When applying external clock 3.579545 MHz to the device, it should be applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1 has to be opened.71 0 X 2 O 8 12 CLK O 3.579545 MHz clock signal output. 91 3 R D O Modem receive serial data output. Digital "1" and "0" correspond to "Mark" and "Space", respectively. When CD (Carrier Detect) is off, RD is held at "Mark" state. 10 15 CD O FSK Receive signal and answer tone detect. Digital "0" and "1" represent "Detect" and "Non-detect", respectively. 11 17 XD I* Modem transmit serial data input. Digital "1" and "0" correspond to "Mark" and "Space", respectively. 12 18 RS I* FSK signal and answer tone transmit enable. When digital "0" is applied to RS, transmitting becomes enable. 13 19 TEST I* Chip test input. TEST should be open or digital "1". 14 20 MOD1 I* Operation mode select. Refer to Table 1.15 22 MOD2 I* 16 24 AOG I* Analog transmit signal amplitude select. Digital "1" ® –10 dBm Typ. at AO Digital "0" ® –4 dBm Typ. at AO DescriptionName I/ORS GS-VK No.

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

• Internally pulled-up pins Power Supply Voltage V DD Ta = 25°C, With respect to GND –0.3 to +7 V Input Voltage V IN –0.3 to VDD + 0.3 V Storage Temperature T STG –55 to +150 °C— Symbol Condition Rating UnitParameter ( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) Power Supply Current IDD Operating Mode — 5.0 10.0 mA ISS Power Down Mode — 5.0 20.0 mA Digital Input Voltage VIL — 0 — 0.8 V VIH — 2.2 — V DD V Digital Input Leakage Current IIL VI = 0 V * –80 — 10 mA IIH VI = 5 V –10 — 10 mA Digital Output Voltage VOL IOL = 1.6 mA 0 0.2 0.4 V VOH IOH = –0.4 mA 2.4 — V DD V Symbol Condition Min. Typ. Max. UnitParameter UnitMax.Typ.Min.ConditionSymbol Power Supply Voltage V+5.5—+2.7—VDD Operating Temperature °C+85—–40—Top Input Clock Frequency %+0.1—–0.1To 3.579545 MHzfCLK VDD Bypass Capacitor mF——10VDD – GNDCVDD Oscillation Frequency MHz —3.579545——— Frequency Deviation ppm+100—–100+25°C ±5°C— Temperature Characteristics ppm +50—–50–40°C to +85°C— Equivalent Series Resistance W 50———— Load Capacitance pF—16——— Crystal Parameter

Modulator/analog output (AO) characteristics * 0 dBm = 0.775 Vrms (VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) fDM fDS 1200 bps Transmit Mode XD = "1" XD = "0" 1296 2096 1300 2100 1304 2104 Hz Hz fBM fBS 75 bps Transmit Mode XD = "1" XD = "0" 386 446 390 450 394 454 Hz Hz FSK Transmit Signal Frequency FSK Transmit Signal Amplitude Ratio V AO(MARK) – VAO(SPACE) –2 0 2 dBVAOD VSPS P : In-band Signal Energy 4 kHz to 8 kHz 8 kHz to 12 kHz P–20 P–40 dB dB More than12 kHz — — P–60 dB Out-of-band Energy To VDD/2 –150 — +150 mVVOFFOutput Offset Voltage — 600 — — W RAOOutput Load Resistance Symbol Condition Min. Typ. Max. UnitParameter VAO1 VAO2 VO AOG = "0" AOG = "1" –12 –10 dBm dBm FSK Transmit Signal Answer Tone amplitude VEA1 VEA2 VAO – VEAI AOG = "0" AOG = "1" dB dB Analog External Input Signal Gain

Demodulator analog input (Al, EAI) characteristics * 0 dBm = 0.775 Vrms tCDD AI CD tCDH Figure 1 Carrier Detect ( CD) Timing ( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) VON ® VOFF —2 — d BVHYSHysteresis (CD) AI — 10 — M WRAI Input Resistance Symbol Condition Min. Typ. Max. UnitParameter FSK Signal, at AI — — –6 dBmVAI Receive Signal Amplitude VON VOFF FSK Signal, (1:1) at AI OFF ® ON OFF ® OFF –48 –42 dBm dBm Receive Signal Detect Amplitude (CD) — See Fig. 1 51 5 2 0 m stCDDCD Delay Time 20 40 60 mstCDHCD Hold Time 1200 bps, 1:1 Pattern –10 — 10 %DBS Receive Data (RD) Bias Distortion EAI 20 — — k WREAI

Figure 4 Analog Loop Back Test Mode Figure 2 FSK Transmit Mode Figure 3 FSK Receive Mode MOD2 MOD1 00 FSK Transmit Mode (Fig.2) 01 FSK Receive & 75 bps Transmit Mode (Fig.3) 10 Analog Loop Back Test Mode (Fig. 4)

11 Power Down Mode

À MSM7512BRS AO AI VDD EAI GND MOD1 MOD2 AOG TEST RS XD CD CLK RD CONT. 8 9 2.2 mF 600 W Line

600 W : 600 W

2.2 mF External Analog Transmit Signal 100 pF External Clock

3.58 MHz

10 mF – MSM7512BRS AO AI VDD 10 mF EAI GND MOD1 MOD2 AOG TEST RS XD CD CLK RD CONT. 8 9 2.2 mF 600 W Line

An Example of the External Adjustment for a transmitting Level and detecting Level If you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit. Line transmitting level : VAOL = V AO ´ (R2/R1) IC input level : V AI = V AIL ´ (R4/R3) Line 2.2 mF51 kW 51 kW 600 W AI 600 W VAOL VAO VAI AO 2.2 mF 51 kW 51 kW VAIL

(Unit : mm) PACKAGE DIMENSIONS DIP16-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.99 TYP.

(Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SOP24-P-430-1.27-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Mirror finish