MR27V402E OKI | Alldatasheet

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Technical content

Issue Date: Jan. 15, 2004 MR27V402E 262,144–Word × 16–Bit or 524,288–Word × 8–Bit One Time PROM GENERAL DESCRIPTION The MR27V402E is a 4 Mbit One Time Programmable Read-Only Memory that can be electrically switched between 262,144-word × 16-bit and 524,288-word × 8-bit by the state of the BYTE pin. The MR27V402E supports high speed asynchronous read operation using a single 3.3V power supply.

FEATURES

  • 262,144-word × 16-bit/524,288-word × 8-bit electrically switchable configuration
  • +3.3 V power supply
  • Access time 80 nS MAX
  • Operating current 30 mA MAX
  • Standby current 50 µA MAX
  • Input/Output TTL compatible
  • Three-state output
  • Packages: 40-pin plastic DIP (DIP40-P-600-2.54) (MR27V402ERP) 40-pin plastic SOP (SOP40-P-525-1.27-K) (MR27V402EMP) 44-pin plastic TSOP (TSOP(2)44-P-400-0.80-K) (MR27V402ETP) 42-pin plastic SOJ (SOJ42-P-400-1.27) (MR27V402EJA)

PIN CONFIGURATION (TOP VIEW) Pin name Functions D15/A–1 Data output / Address input A0 to A17 Address input D0 to D14 Data output CE Chip enable OE Output enable BYTE/VPP Mode switch / Program power supply voltage VCC Power supply voltage VSS GND NC Non connection NC NC A10 A11 A12 A13 A14 A15 A16 BYTE/VPP VSS D15/A–1 D14 D13 D12 VCC NC NC A17 CE VSS OE D10 D11 44-pin TSOP(II) A10 A11 A12 A13 A14 A15 A16 BYTE/VPP VSS D15/A–1 D14 D13 D12 VCC A17 CE VSS OE D10 D11 40-pin DIP or SOP NC A10 A11 A12 A13 A14 A15 A16 BYTE/VPP VSS D15/A–1 D14 D13 D12 VCC NC A17 CE VSS OE D10 D11 42-pin SOJ

D15/A–1 Read (16-Bit) L L H DOUT Read (8-Bit) L L L DOUT Hi–Z L/H H Output disable L H L Hi–Z H Standby H L 3.3 V Hi–Z Program L H DIN Program inhibit H H Hi–Z Program verify H L 9.75 V 4.0 V DOUT ∗: Don’t Care (H or L) A10 A11 A12 A13 A14 A15 A16 A17 CE BYTE/VPP OE CE OE × 8/× 16 Switch D0 D2 D4 D6 D8 D10 D12 D14 D1 D3 D5 D7 D9 D11 D13 D15 Memory Cell Matrix 262,144 × 16-Bit or 524,288 × 8-Bit Multiplexer Output Buffer Row Decoder Column Decoder Address Buffer In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. A–1 PGM

Operating temperature under bias Ta 0 to 70 Storage temperature Tstg –55 to 125 Input voltage VI –0.5 to VCC+0.5 V Output voltage VO –0.5 to VCC+0.5 V Power supply voltage VCC –0.5 to 5 V Program power supply voltage VPP relative to VSS –0.5 to 11.5 V Power dissipation per package PD 1.0 W RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol Condition Min. Typ. Max. Unit VCC power supply voltage VCC 3.0 3.6 V VPP power supply voltage VPP –0.5 VCC+0.5 V Input “H” level VIH 2.2 VCC+0.5∗ V Input “L” level VIL VCC = 3.0 to 3.6 V –0.5∗∗ 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5 V(Max.) when pulse width of overshoot is less than 10 ns. ∗∗ : -1.5 V(Min.) when pulse width of undershoot is less than 10 ns.

ELECTRICAL CHARACTERISTICS

(VCC = 3.3 V ±0.3 V, Ta = 0 to 70°C) parameter Symbol Condition Min. Typ. Max. Unit Input leakage current ILI VI = 0 to VCC µA Output leakage current ILO VO = 0 to VCC µA ICCSC CE = VCC µA VCC power supply current (Standby) ICCST CE = VIH mΑ VCC power supply current (Read) ICCA CE = VIL, OE = VIH tc = 80 ns mA VPP power supply current IPP VPP = VCC µA Input “H” level VIH 2.2 VCC+0.5∗ V Input “L” level VIL –0.5∗∗ 0.6 V Output “H” level VOH IOH = –400 µA 2.4 V Output “L” level VOL IOL = 2.1 mA 0.4 V Voltage is relative to VSS. ∗ : Vcc+1.5 V(Max.) when pulse width of overshoot is less than 10 ns. ∗∗ : -1.5 V(Min.) when pulse width of undershoot is less than 10 ns. AC Characteristics (VCC = 3.3 V ±0.3 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit Address cycle time tC ns Address access time tACC CE = OE = VIL ns CE access time tCE OE = VIL ns OE access time tOE CE = VIL ns tCHZ OE = VIL ns Output disable time tOHZ CE = VIL ns Output hold time tOH CE = OE = VIL ns Measurement conditions Output 2.08 V 800Ω 50 pF (Including scope and jig)

Timing Chart (Read Cycle) 16-Bit Read Mode (BYTE = VIH) Address CE OE D0 to D15 tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH tACC Valid Data tACC tC 8-Bit Read Mode (BYTE = VIL) Address CE OE D0 to D7 tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH tACC Valid Data tACC tC

ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION) DC Characteristics (Ta = 25°C ±5°C) Parameter Symbol Condition Min. Typ. Max. Unit Input leakage current ILI VI = VCC+0.5 V µA VPP power supply current (Program) IPP2 CE = VIL mA VCC power supply current ICC mA Input “H” level VIH 3.0 VCC+0.5 V Input “L” level VIL –0.5 0.8 V Output “H” level VOH IOH = –400 µA 2.4 V Output “L” level VOL IOL = 2.1 mA 0.45 V Program voltage VPP 9.5 9.75 10.0 V VCC power supply voltage VCC 3.9 4.0 4.1 V Voltage is relative to VSS. AC Characteristics (VCC = 4.0 V ±0.1 V, BYTE/VPP = 9.75 V ±0.25 V, Ta = 25°C ±5°C) Parameter Symbol Condition Min. Typ. Max. Unit Address set-up time tAS 100 ns OE set-up time tOES µs Data set-up time tDS 100 ns Address hold time tAH µs Data hold time tDH 100 ns Output float delay time from OE tOHZ 100 ns VPP voltage set-up time tVS µs Program pulse width tPW µs Data valid from OE tOE 100 ns Address hold from OE high tAOH ns Pin Check Function Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer. Setting up address as following condition call the preprogrammed codes on device outputs. (VCC = 3.3 V ±0.3 V, CE = VIL, OE = VIL, BYTE/VPP = VIH, Ta = 25°C ±5°C) A10 A11 A12 A13 A14 A15 A16 A17 DATA VH∗ FF00 VH∗ 00FF Other conditions FFFF

Consecutive Programming Waveforms Consecutive Program Verify Waveforms tAS A0 to A17 CE OE D0 to D15 tAH tPW Din High BYTE/Vpp tDH tDS tVS Din tOHZ tAHO tACC A0 to A17 CE OE D0 to D15 High BYTE/Vpp Dout tOE Dout 9.75 V

Program and Program Verify Cycle Waveforms Pin Capacitance (VCC = 3.3 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Condition Min. Typ. Max. Unit Input CIN1 8 (10) BYTE/VPP CIN2 VI = 0 V Output COUT VO = 0 V 10 (12) pF ( ) : DIP only tOHZ tDS tOE tAS A0 to A17 CE OE D0 to D15 tAHO tPW Dout BYTE/Vpp tDH Din tOES tOHZ 9.75 V

Programming/Verify Flow Chart NG YES NO NO VCC = 3.0 V/VPP = 3.0 V Device Passed Start Last Address? X = 0 Verify(One Word) Last Address? NG X = 2? X = X+1 Increment Address Program 10 µs Programming Pin Check NG PASS Verify Verify Start Verify Pin Check Bad Insertion Device Passed YES YES PASS PASS NG PASS NG PASS NG PASS NO VCC = 3.6 V/VPP = 3.6 V Device Failed Bad Insertion Address = First Location VCC = 4.0 V VPP = 9.75 V Program 10 µs Verify Device Failed VCC = 3.0 V/VPP = 3.0 V Address = First Location Increment Address Address = First Location

DIP40-P-600-2.54 Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 6.10 TYP. Rev. No./Last Revised 2/Dec. 11, 1996 (Unit: mm)

SOJ42-P-400-1.27 Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 1.86 TYP. Rev. No./Last Revised 5/Dec. 5, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

TSOP(2)44-P-400-0.80-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 0.54 TYP. Rev. No./Last Revised 3/Dec. 10, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

SOP40-P-525-1.27-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 1.27 TYP. Rev. No./Last Revised 3/Oct. 21, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

REVISION HISTORY

No. Date Previous Edition Current Edition

Description

Sep. 2001 Final edition 2 FEDR27V402E-01-03 Jan. 15, 2004 1, 2 1, 2, 12 Added 42SOJ package.

  1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd.