MSM6502B OKI | Alldatasheet

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Technical content

¡ Semiconductor GENERAL DESCRIPTION The MSM6502B/6512 is a low-power, 4-bit microcontroller implemented in complementary metal-oxide semiconductor technology. The device is ideally suited to battery-powered systems such as watches and game machines because it can directly drive LCDs with up to 108 picture elements.

FEATURES

  • ROM : 2000 words ¥ 8 bits
  • RAM : 128 words ¥ 4 bits
  • Number of instructions : 68
  • Clock oscillation : Crystal 32.768 kHz
  • Cycle time : 91.5 ms
  • Timer interrupt : Dual (16,128 Hz)
  • I/O port Input-output port : 2 ports ¥ 4 bits Input port : 1 port ¥ 4 bits
  • LCD drive : 108 (4 ¥ 27) picture elements
  • Buzzer : 2000/1000/512 Hz/Soft
  • Interrupt : Three sources (external; two timer sources)
  • Stack : Nesting RAM Stack pointer = 7 bits
  • Power down : Halt mode available
  • Operating power supply voltage : 2.4 V to 3.6 V
  • Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM6502B-¥¥¥GS-K, MSM6512-¥¥¥GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM6502B-¥¥¥GS-2K, MSM6512-¥¥¥GS-2K) ¥¥¥ indicates the code number. ¡ Semiconductor MSM6502B/6512 Low-power and Built-in LCD Driver 4-Bit Microcontroller E2E0018-27-Y4 This version: Jan. 1998 Previous version: Mar. 1996

¡ Semiconductor BLOCK DIAGRAM BZ/BZ PROGRAM MEMORY ROM 2000 ¥ 8bits ROMDATA H L R I 8bits PCR M L H PC M L H IDR L H 8bits 7bits 4bits 4bits SP L H L H INSTRUC– TION DECODER L H ALU ACC 4bits C 11bits 11bits DP L H DATA MEMORY RAM 128 ¥ 4bits 8bits R/W LCD Driver TBC f 8bits BUS INT. TBF CONTROL OSC0 BZ CONT OSC Timing Generator 4bits 4bits 4bits P1.0 to P1.3 P0.0 to P0.3 P2.0 to P2.3 OSC1 RESET 4 3 2 1 TEST I V A VDD 12bits COM1 - 4 SEG0 - 26 INT GND

¡ Semiconductor PIN CONFIGURATION (TOP VIEW) 56-Pin Plastic QFP P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3

56 SEG26

55 SEG25

54 SEG24

53 SEG23

52 SEG22

51 SEG21

50 SEG20

49 VDD

48 SEG19

47 SEG18

46 SEG17

P2.3 SEG2 BZ SEG1 BZ SEG0

45 SEG16

44 SEG15

43 SEG14

¡ Semiconductor PIN DESCRIPTIONS Symbol

Description

Crystal OSC input, internal clock input OSC1 Crystal OSC input, internal clock output P0.0 to P0.3 P1.0 to P1.3 Pseudo-bidirectional ports for 4-bit parallel I/O. To input data from these ports, it is necessary to write "1" beforehand. The port to be selected is specified by the L register. The register contents and the corresponding specified ports are listed below. Note: P3, P4, and P5 are internal ports. P2.0 to P2.3 Input port for 4-bit parallel input with no latching function. INT Input pin to request an interrupt from the external circuit. The input flag is set at the falling edge of the input signal. 6, 7, OEH, OFH 5, 0DH 4, 0CH 3, 0BH 2, 0AH 1, 9 0, 8 Content of L Register Port Specified No designation RESET The reset mode starts after "0" is input to the RESET pin for more than 2 machine cycles. The reset signal has priority over all of other signals and performs the following operations automatically: (1) Resets all bits of the PC (program counter) to"0". (2) Sets all bits of the parallel I/O ports (P0.0 to P1.3) to "1" (3) Resets the internal register (H, L, ACC, C, P3, P4, P5). (4) Resets the skip flag. (5) Resets all bits of the time base counter (TBC). (6) Resets the interrupt request flag (IRQF). (7) Resets the interrupt enable flag (EIF). (8) Resets the master interrupt enable flag (MEIF). (9) Sets all bits of the stack pointer (SP) to "1" . (10) Initializes the segment and common outputs. (11) Sets all bits of the index register (IDR) to "1". Since the RESET pin is pulled up to VDD by an internal resistor (800 kW), it is possible to achieve power ON reset by connecting it with an external capacitor. Pin 21, 49 1 to 4 5 to 8 9 to 12

¡ Semiconductor LCD Drive Pins SEG 0 to 26 COM 1 to 4 A special AC waveform designed to comply with liquid-crystal properties is required for liquid-crystal-drive purposes. The MSM6502B/6512 is equipped with a 1/4 duty, 1/3 bias liquid-crystal-drive circuit with four common output ports and 27 segments, to enable displays of up to 108 picture elements. On/off selection of picture elements involves writing "0" or "1" to the corresponding bits in the RAM 00H to 1AH display area, and subsequent automatic hardware controlled display. The frame frequency is 64 Hz. BZ/BZ BZ and BZ are used in the generation of alarms and other sounds. The selectable frequencies include three hardware frequencies (TBC output) of 512, 1024, and 2048 Hz, and a software type based on P5.0 data. These frequencies are selected at P3. When one of the hardware frequencies is selected by P3, output of that frequency is continuous. But selection of the software type results in output of the P5.0 contents to generate a melody by program. Symbol 13,14 Pin PIN DESCRIPTIONS (Continued)

¡ Semiconductor ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Rating Unit Power Supply Voltage VDD Ta=25°C –0.3 to +7 V Input Voltage VI –0.3 to VDD V Output Voltage VO –0.3 to VDD V Power Dissipation PD Ta=25°C per package 200 mW Storage Temperature TSTG –55 to +150 Parameter Symbol Condition Range Unit Power Supply Voltage VDD fOSC£32.768 kHz 2.4 to 3.6 V Operating Temperature Top –20 to +70

¡ Semiconductor

ELECTRICAL CHARACTERISTICS

(VDD=3 V, Ta=–20 to +70°C) Parameter Symbol Condition Min. Typ. Max. Unit VIH 2.6 V VIL 0.4 V VOH 2.0 V VOL 1.0 V 2.8 3.0 V IIH/IIL 2/–2 mA 1000/–1 IIH/IIL 1/–10 "H" Input Voltage "L" Input Voltage "H" Output Voltage (*1) "L" Output Voltage (*2) LCD Drive Output Voltage (*3) OSC0 Input Current Input Current (*4) Input Current (*6) IO=1.0 mA MSM6502B VI=VDD/VI=0 V VI=VDD/VI=0 V VI=VDD/VI=0 V VO=0 V VI=VDD/VI=0 V 1/–10 IIH/IIL IIH/IIL Input Current (*5) IOH –50 P0, P1 "H" Output Current fOSC=32.768 kHz at no load IDD Current Consumption IDDHLT Static IDDS TOSC sec Oscillation Start Time IO=–1.0 mA fOSC=32.768 kHz at HLT execution IO=–5 mA MSM6512 MSM6502B MSM6512 MSM6502B MSM6512 MSM6502B MSM6512 IO=–2 mA IO=±2 mA IO=±0.5 mA IO=±2 mA IO=±0.5 mA IO=5 mA IO=2 mA 1.8 2.2 V 0.8 1.2 V 0.0 0.2 V mA mA mA mA mA mA mA MSM6502B MSM6512 MSM6502B MSM6512 MSM6502B MSM6512 *1 Applied to BZ, BZ *2 Applied to BZ, BZ, P0, P1 *3 Applied to COM1-4, SEG0-26 *4 Applied to RESET, INT *5 Applied to P2 (When input is disabled) *6 Applied to P2 (When input is enabled)

¡ Semiconductor Switching Characteristics Parameter Symbol Condition Min. Typ. Max. Unit Clock (OSC0) Pulse Width tfW ms Cycle Time tCY (*1) ms tDV (*2) ms tDIV (*3) ms tDDS CL=50 pF (*4) ms Data Delay Time Data Invalid Time Data Valid Time (VDD=3 V, Ta=–20 to +70°C) *1 tCY=3 ¥ 1/fOSC *2 tDV=1/2 ¥ 1/fOSC *3 tDIV=1 ¥ 1/fOSC + 10 ms *4 tDDS=5/2 ¥ 1/fOSC + 15 ms 1MC tCY tfW tfW INVALID VALID INVALID tDIV tDV OLD DATA NEW DATA tDDS P1 Input mode OSC0 P1 Output mode

¡ Semiconductor Operating Characteristics (MSM6502B) High-level Output Current (IOH) - Output Voltage (VOH) Low-level Output Current (IOL) - Output Voltage (VOL) 0 1 2 3 4 5 6 7 8 9 10 IOH (mA) (VDD=3 V, Ta=25°C) VOH (V) 0 1 2 3 4 5 6 7 8 9 10 IOL (mA) (VDD=3 V, Ta=25°C) VOL (V) 0 1 2 3 4 5 6 7 8 9 10 –25 –20 –15 –10 I1, I2 (mA) (VDD=3 V, Ta=25°C) V1, V2 (V) BZ, BZ pins (COM, SEG pins) (P0, P1 pins) COM, SEG pins (P0, P1 pins) (BZ, BZ pins) V1 V2 (COM, SEG pins) 0 1 2 3 4 5 6 7 8 9 10 VDD (V) (Ta=25°C, no load) 100n IDD (A) 500n 10m 50m 100m 500m 10m fOSC=32.768 kHz 0Hz Middle-level Output Current (I1, I2) - Output Voltage (V1, V2) Current Consumption (IDD) - Power Supply Voltage (VDD)

¡ Semiconductor Operating Characteristics (MSM6512) High-level Output Current (IOH) - Output Voltage (VOH) Low-level Output Current (IOL) - Output Voltage (VOL) 0 1 2 3 4 5 6 7 8 9 10 IOH (mA) (VDD=3 V, Ta=25°C) VOH (V) 0 1 2 3 4 5 6 7 8 9 10 IOL (mA) (VDD=3 V, Ta=25°C) VOL (V) 0 1 2 3 4 5 6 7 8 9 10 –25 –20 –15 –10 I1, I2 (mA) (VDD=3 V, Ta=25°C) V1, V2 (V) (BZ, BZ pins) (COM, SEG pins) (P0, P1 pins) (COM, SEG pins) (P0, P1 pins) (BZ, BZ pins) V1 V2 (COM, SEG pins) 0 1 2 3 4 5 6 7 8 9 10 VDD (V) (Ta=25°C, no load) 100n IDD (A) 500n 10m 50m 100m 500m 10m fOSC=32.768 kHz 0Hz Middle-level Output Current (I1, I2) - Output Voltage (V1, V2) Current Consumption (IDD) - Power Supply Voltage (VDD)

¡ Semiconductor (Unit : mm) PACKAGE DIMENSIONS Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP56-P-910-0.65-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Mirror finish

¡ Semiconductor (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP56-P-910-0.65-2K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP. Mirror finish